DE10392347T5 - Gerät mit einer Schaltung zur Erfassung von Substratfehlern - Google Patents

Gerät mit einer Schaltung zur Erfassung von Substratfehlern Download PDF

Info

Publication number
DE10392347T5
DE10392347T5 DE10392347T DE10392347T DE10392347T5 DE 10392347 T5 DE10392347 T5 DE 10392347T5 DE 10392347 T DE10392347 T DE 10392347T DE 10392347 T DE10392347 T DE 10392347T DE 10392347 T5 DE10392347 T5 DE 10392347T5
Authority
DE
Germany
Prior art keywords
substrate
circuit
dsas
substrates
motherboard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10392347T
Other languages
German (de)
English (en)
Inventor
Kousaku Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of DE10392347T5 publication Critical patent/DE10392347T5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
DE10392347T 2002-03-01 2003-02-25 Gerät mit einer Schaltung zur Erfassung von Substratfehlern Withdrawn DE10392347T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002056570A JP3790175B2 (ja) 2002-03-01 2002-03-01 基板異常検出回路付き装置
JP2002-056570 2002-03-01
PCT/JP2003/002037 WO2003075026A1 (en) 2002-03-01 2003-02-25 Device with board abnormality detecting circuit

Publications (1)

Publication Number Publication Date
DE10392347T5 true DE10392347T5 (de) 2005-04-07

Family

ID=27784643

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10392347T Withdrawn DE10392347T5 (de) 2002-03-01 2003-02-25 Gerät mit einer Schaltung zur Erfassung von Substratfehlern

Country Status (7)

Country Link
JP (1) JP3790175B2 (ko)
KR (3) KR100966686B1 (ko)
CN (2) CN1811479A (ko)
DE (1) DE10392347T5 (ko)
MY (1) MY134319A (ko)
TW (3) TWI325060B (ko)
WO (1) WO2003075026A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100395718C (zh) * 2004-03-13 2008-06-18 鸿富锦精密工业（深圳）有限公司 主机板功能测试板
KR100897349B1 (ko) 2007-06-12 2009-05-15 주식회사 유니테스트 반도체 소자 테스트 장치
CN101551427B (zh) * 2008-03-31 2012-04-04 无锡松下冷机有限公司 基板的检测方法
TWI385773B (zh) * 2008-05-21 2013-02-11 Lefram Technology Corp Lead frame carrier and method of manufacturing the same
CN102445635B (zh) * 2010-10-11 2014-12-03 中国电信股份有限公司 跳线快速测试器
US8878182B2 (en) * 2011-10-12 2014-11-04 Taiwan Semiconductor Manufacturing Company, Ltd. Probe pad design for 3DIC package yield analysis
KR101316785B1 (ko) 2013-07-31 2013-10-10 테스토피아 주식회사 수직식 실린더를 이용한 소켓보드 교체장치
CN103440567A (zh) * 2013-08-28 2013-12-11 杭州华三通信技术有限公司 一种区分销往不同市场设备的方法及装置
KR102377694B1 (ko) * 2020-07-28 2022-03-23 주식회사 에스티아이테크 보드 결합용 브래킷 및 이에 의한 보드 어셈블리

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4787143A (en) * 1985-12-04 1988-11-29 Tdk Corporation Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor
JP3730340B2 (ja) * 1996-11-20 2006-01-05 株式会社アドバンテスト 半導体試験装置
US6480751B1 (en) * 1997-01-16 2002-11-12 Matsushita Electric Industrial Co., Ltd. Component supplying method, component arrangement data forming method and electronic component mounting apparatus using the methods
US6040530A (en) * 1997-12-05 2000-03-21 Hewlett-Packard Company Versatile printed circuit board for testing processing reliability
JPH11326448A (ja) * 1998-05-20 1999-11-26 Advantest Corp Ｉｃ試験装置
CN1240939A (zh) * 1998-06-09 2000-01-12 株式会社爱德万测试 电子元器件试验装置
KR20000008963U (ko) * 1998-10-29 2000-05-25 김영환 신규의 소켓 어댑터를 가지는 반도체 소자 패키지 테스트 장치
JP2000310664A (ja) * 1999-04-27 2000-11-07 Ando Electric Co Ltd Ｉｃ試験装置、及びｉｃ試験装置における外部機器識別方法
JP3797529B2 (ja) * 1999-05-20 2006-07-19 富士写真フイルム株式会社 導通状態検知機能付き集積回路
JP2001004701A (ja) * 1999-06-22 2001-01-12 Advantest Corp Ｉｄ認識方式及びその方式を用いたｉｄ認識装置

Also Published As

Publication number Publication date
TWI277757B (en) 2007-04-01
MY134319A (en) 2007-12-31
WO2003075026A1 (en) 2003-09-12
TW200303990A (en) 2003-09-16
TWI292484B (en) 2008-01-11
CN1811479A (zh) 2006-08-02
KR20040082446A (ko) 2004-09-24
JP3790175B2 (ja) 2006-06-28
KR100966686B1 (ko) 2010-06-29
KR20100050568A (ko) 2010-05-13
JP2003255020A (ja) 2003-09-10
TW200634322A (en) 2006-10-01
CN1639579B (zh) 2011-01-26
TWI325060B (en) 2010-05-21
KR20050121763A (ko) 2005-12-27
CN1639579A (zh) 2005-07-13
TW200739100A (en) 2007-10-16
KR100624060B1 (ko) 2006-09-20

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: G01R 31/28 AFI20051017BHDE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20120901