CN1811479A - 带有基板异常检测电路的装置 - Google Patents

带有基板异常检测电路的装置 Download PDF

Info

Publication number
CN1811479A
CN1811479A CNA2006100042601A CN200610004260A CN1811479A CN 1811479 A CN1811479 A CN 1811479A CN A2006100042601 A CNA2006100042601 A CN A2006100042601A CN 200610004260 A CN200610004260 A CN 200610004260A CN 1811479 A CN1811479 A CN 1811479A
Authority
CN
China
Prior art keywords
substrate
signal
connector
group
dsa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2006100042601A
Other languages
English (en)
Chinese (zh)
Inventor
平野耕作
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Publication of CN1811479A publication Critical patent/CN1811479A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
CNA2006100042601A 2002-03-01 2003-02-25 带有基板异常检测电路的装置 Pending CN1811479A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002056570 2002-03-01
JP2002056570A JP3790175B2 (ja) 2002-03-01 2002-03-01 基板異常検出回路付き装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN038049503A Division CN1639579B (zh) 2002-03-01 2003-02-25 带有基板异常检测电路的装置

Publications (1)

Publication Number Publication Date
CN1811479A true CN1811479A (zh) 2006-08-02

Family

ID=27784643

Family Applications (2)

Application Number Title Priority Date Filing Date
CNA2006100042601A Pending CN1811479A (zh) 2002-03-01 2003-02-25 带有基板异常检测电路的装置
CN038049503A Expired - Fee Related CN1639579B (zh) 2002-03-01 2003-02-25 带有基板异常检测电路的装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN038049503A Expired - Fee Related CN1639579B (zh) 2002-03-01 2003-02-25 带有基板异常检测电路的装置

Country Status (7)

Country Link
JP (1) JP3790175B2 (ko)
KR (3) KR100966686B1 (ko)
CN (2) CN1811479A (ko)
DE (1) DE10392347T5 (ko)
MY (1) MY134319A (ko)
TW (3) TWI325060B (ko)
WO (1) WO2003075026A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101551427B (zh) * 2008-03-31 2012-04-04 无锡松下冷机有限公司 基板的检测方法
CN103440567A (zh) * 2013-08-28 2013-12-11 杭州华三通信技术有限公司 一种区分销往不同市场设备的方法及装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100395718C (zh) * 2004-03-13 2008-06-18 鸿富锦精密工业（深圳）有限公司 主机板功能测试板
KR100897349B1 (ko) 2007-06-12 2009-05-15 주식회사 유니테스트 반도체 소자 테스트 장치
TWI385773B (zh) * 2008-05-21 2013-02-11 Lefram Technology Corp Lead frame carrier and method of manufacturing the same
CN102445635B (zh) * 2010-10-11 2014-12-03 中国电信股份有限公司 跳线快速测试器
US8878182B2 (en) * 2011-10-12 2014-11-04 Taiwan Semiconductor Manufacturing Company, Ltd. Probe pad design for 3DIC package yield analysis
KR101316785B1 (ko) 2013-07-31 2013-10-10 테스토피아 주식회사 수직식 실린더를 이용한 소켓보드 교체장치
KR102377694B1 (ko) * 2020-07-28 2022-03-23 주식회사 에스티아이테크 보드 결합용 브래킷 및 이에 의한 보드 어셈블리

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4787143A (en) * 1985-12-04 1988-11-29 Tdk Corporation Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor
JP3730340B2 (ja) * 1996-11-20 2006-01-05 株式会社アドバンテスト 半導体試験装置
US6480751B1 (en) * 1997-01-16 2002-11-12 Matsushita Electric Industrial Co., Ltd. Component supplying method, component arrangement data forming method and electronic component mounting apparatus using the methods
US6040530A (en) * 1997-12-05 2000-03-21 Hewlett-Packard Company Versatile printed circuit board for testing processing reliability
JPH11326448A (ja) * 1998-05-20 1999-11-26 Advantest Corp Ｉｃ試験装置
CN1240939A (zh) * 1998-06-09 2000-01-12 株式会社爱德万测试 电子元器件试验装置
KR20000008963U (ko) * 1998-10-29 2000-05-25 김영환 신규의 소켓 어댑터를 가지는 반도체 소자 패키지 테스트 장치
JP2000310664A (ja) * 1999-04-27 2000-11-07 Ando Electric Co Ltd Ｉｃ試験装置、及びｉｃ試験装置における外部機器識別方法
JP3797529B2 (ja) * 1999-05-20 2006-07-19 富士写真フイルム株式会社 導通状態検知機能付き集積回路
JP2001004701A (ja) * 1999-06-22 2001-01-12 Advantest Corp Ｉｄ認識方式及びその方式を用いたｉｄ認識装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101551427B (zh) * 2008-03-31 2012-04-04 无锡松下冷机有限公司 基板的检测方法
CN103440567A (zh) * 2013-08-28 2013-12-11 杭州华三通信技术有限公司 一种区分销往不同市场设备的方法及装置

Also Published As

Publication number Publication date
TWI277757B (en) 2007-04-01
MY134319A (en) 2007-12-31
WO2003075026A1 (en) 2003-09-12
TW200303990A (en) 2003-09-16
TWI292484B (en) 2008-01-11
KR20040082446A (ko) 2004-09-24
JP3790175B2 (ja) 2006-06-28
KR100966686B1 (ko) 2010-06-29
KR20100050568A (ko) 2010-05-13
JP2003255020A (ja) 2003-09-10
TW200634322A (en) 2006-10-01
CN1639579B (zh) 2011-01-26
TWI325060B (en) 2010-05-21
KR20050121763A (ko) 2005-12-27
CN1639579A (zh) 2005-07-13
TW200739100A (en) 2007-10-16
DE10392347T5 (de) 2005-04-07
KR100624060B1 (ko) 2006-09-20

Similar Documents

Publication Publication Date Title
CN1129981C (zh) 一种用于电源箱输电系统的改进的连接器方案
EP2057873B1 (en) Sub-mezzanine structure for printed circuit card assemblies
CN1811479A (zh) 带有基板异常检测电路的装置
US20040008034A1 (en) Testing device and method for testing backplanes and connectors on backplanes
WO2016122555A1 (en) Expansion slot interface
KR100965249B1 (ko) 디스플레이 모듈 에이징 검사 장치
KR101296233B1 (ko) 멀티 입출력 제어장치
CN210005637U (zh) 母板控制装置及老炼母板
KR20020072446A (ko) 볼트 체결 방식의 모듈 소자 테스트용 소켓
CN1503911A (zh) Lsi检查方法及装置、lsi检测器
JP4185929B2 (ja) 基板異常検出回路付き装置
US20030212836A1 (en) Customer replacement unit monitor programming cable
US11500012B2 (en) Semiconductor component burn-in test module and burn-in test equipment
JPH1032046A (ja) コネクタ及びコネクタ結合チェック方法
EP1848258B1 (en) Computer device with a modular transmission interface, the modular transmission interface, and an adaptor board
CN111867244A (zh) 印刷电路板和板卡
CN1882844A (zh) 检查信号供给装置和检查信号施加方法
JP2009103620A (ja) 誤装着防止装置
CN112838961A (zh) 网络接口检测装置
CN217689873U (zh) 基于温控器的模块化硬件集成开发测试装置
TWI409479B (zh) Test unit for testing electronic parts, test heads and electronic parts test equipment
CN116027857A (zh) 具有竖直功率的可插拔cpu模块
US6066981A (en) Method and apparatus for automatically selecting clock voltage levels
CN110928221A (zh) 一种插卡式模块化设备
CN114078718A (zh) 半导体元件预烧测试模块及其预烧测试装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Open date: 20060802