TWI248135B - Heating device for manufacturing semiconductor - Google Patents

Heating device for manufacturing semiconductor Download PDF

Info

Publication number
TWI248135B
TWI248135B TW092104239A TW92104239A TWI248135B TW I248135 B TWI248135 B TW I248135B TW 092104239 A TW092104239 A TW 092104239A TW 92104239 A TW92104239 A TW 92104239A TW I248135 B TWI248135 B TW I248135B
Authority
TW
Taiwan
Prior art keywords
support member
ceramic
heating device
semiconductor manufacturing
supporting member
Prior art date
Application number
TW092104239A
Other languages
English (en)
Chinese (zh)
Other versions
TW200305227A (en
Inventor
Akira Kuibira
Masuhiro Natsuhara
Hirohiko Nakata
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200305227A publication Critical patent/TW200305227A/zh
Application granted granted Critical
Publication of TWI248135B publication Critical patent/TWI248135B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Resistance Heating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW092104239A 2002-02-27 2003-02-27 Heating device for manufacturing semiconductor TWI248135B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002050628A JP3791432B2 (ja) 2002-02-27 2002-02-27 半導体製造用加熱装置

Publications (2)

Publication Number Publication Date
TW200305227A TW200305227A (en) 2003-10-16
TWI248135B true TWI248135B (en) 2006-01-21

Family

ID=27764285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092104239A TWI248135B (en) 2002-02-27 2003-02-27 Heating device for manufacturing semiconductor

Country Status (7)

Country Link
US (1) US7999210B2 (ja)
EP (1) EP1480259A1 (ja)
JP (1) JP3791432B2 (ja)
KR (1) KR100877042B1 (ja)
CN (1) CN100339951C (ja)
TW (1) TWI248135B (ja)
WO (1) WO2003073483A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8796594B2 (en) 2006-03-24 2014-08-05 Nuflare Technology, Inc. Semiconductor manufacturing equipment and heater structural connection

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4662725B2 (ja) * 2004-02-25 2011-03-30 日本碍子株式会社 基板加熱装置とその製造方法
JP2005317749A (ja) * 2004-04-28 2005-11-10 Sumitomo Electric Ind Ltd 半導体製造装置用保持体及びそれを搭載した半導体製造装置
US20060011139A1 (en) * 2004-07-16 2006-01-19 Applied Materials, Inc. Heated substrate support for chemical vapor deposition
JP2007053280A (ja) * 2005-08-19 2007-03-01 Sumitomo Electric Ind Ltd 半導体加熱ヒータ用容器
JP4942385B2 (ja) * 2006-04-25 2012-05-30 東芝三菱電機産業システム株式会社 均熱処理装置
CN103184436B (zh) * 2011-12-30 2015-04-08 财团法人金属工业研究发展中心 具热膨胀间隙监测功能的加热装置
USD719596S1 (en) 2012-12-20 2014-12-16 Sfs Intec Holding Ag Induction apparatus
CN103177779A (zh) * 2013-01-08 2013-06-26 上海核工程研究设计院 一种大型非能动压水堆核电厂坩埚型堆芯捕集器
CN106856184A (zh) * 2015-12-08 2017-06-16 北京北方微电子基地设备工艺研究中心有限责任公司 加热基座以及半导体加工设备
KR102630782B1 (ko) 2016-08-19 2024-01-31 삼성전자주식회사 기판 처리 장치
US10679873B2 (en) * 2016-09-30 2020-06-09 Ngk Spark Plug Co., Ltd. Ceramic heater

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
US1647742A (en) * 1925-01-16 1927-11-01 Mock Hugo Fireless cooker
US3757733A (en) * 1971-10-27 1973-09-11 Texas Instruments Inc Radial flow reactor
JPS61194178A (ja) * 1985-02-22 1986-08-28 Oki Electric Ind Co Ltd 化学気相成長装置
ES2054357T3 (es) * 1989-05-08 1994-08-01 Philips Nv Aparato y metodo para tratar substratos planos bajo una presion reducida.
JPH10284360A (ja) * 1997-04-02 1998-10-23 Hitachi Ltd 基板温度制御装置及び方法
JP3810216B2 (ja) * 1998-07-01 2006-08-16 京セラ株式会社 試料加熱装置および処理装置並びにそれを用いた試料の処理方法
JP3512650B2 (ja) * 1998-09-30 2004-03-31 京セラ株式会社 加熱装置
JP4014348B2 (ja) * 2000-02-22 2007-11-28 東京エレクトロン株式会社 加熱処理装置
JP4637316B2 (ja) * 2000-02-24 2011-02-23 京セラ株式会社 筒状体を有するセラミックヒーター及びこれを用いた加熱装置
JP2001319758A (ja) * 2000-03-03 2001-11-16 Ibiden Co Ltd ホットプレートユニット
JP2002025758A (ja) 2000-05-02 2002-01-25 Ibiden Co Ltd ホットプレートユニット
JP4398064B2 (ja) * 2000-05-12 2010-01-13 日本発條株式会社 加熱装置
JP2001342079A (ja) * 2000-05-30 2001-12-11 Ibiden Co Ltd セラミック接合体
JP3615694B2 (ja) * 2000-08-08 2005-02-02 京セラ株式会社 ウェハ加熱部材及びこれを用いたウェハの均熱化方法
JP2002246305A (ja) * 2001-02-21 2002-08-30 Ibiden Co Ltd ホットプレートユニット
US20040140304A1 (en) * 2003-01-22 2004-07-22 Leyendecker Kurt Philip Baby bottle chiller/warmer and method of use
US7361865B2 (en) * 2003-08-27 2008-04-22 Kyocera Corporation Heater for heating a wafer and method for fabricating the same
TWI281833B (en) * 2004-10-28 2007-05-21 Kyocera Corp Heater, wafer heating apparatus and method for manufacturing heater

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8796594B2 (en) 2006-03-24 2014-08-05 Nuflare Technology, Inc. Semiconductor manufacturing equipment and heater structural connection

Also Published As

Publication number Publication date
CN1579007A (zh) 2005-02-09
US7999210B2 (en) 2011-08-16
EP1480259A1 (en) 2004-11-24
TW200305227A (en) 2003-10-16
KR20040083052A (ko) 2004-09-30
JP2003257809A (ja) 2003-09-12
JP3791432B2 (ja) 2006-06-28
KR100877042B1 (ko) 2008-12-31
WO2003073483A1 (fr) 2003-09-04
US20040238520A1 (en) 2004-12-02
CN100339951C (zh) 2007-09-26

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MM4A Annulment or lapse of patent due to non-payment of fees