TWI228066B - Abrasive cloth dresser and method for dressing an abrasive cloth with the same - Google Patents

Abrasive cloth dresser and method for dressing an abrasive cloth with the same Download PDF

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Publication number
TWI228066B
TWI228066B TW092124643A TW92124643A TWI228066B TW I228066 B TWI228066 B TW I228066B TW 092124643 A TW092124643 A TW 092124643A TW 92124643 A TW92124643 A TW 92124643A TW I228066 B TWI228066 B TW I228066B
Authority
TW
Taiwan
Prior art keywords
grindstone
honing
particles
dresser
honing cloth
Prior art date
Application number
TW092124643A
Other languages
English (en)
Chinese (zh)
Other versions
TW200408501A (en
Inventor
Tadakatsu Nabeya
Original Assignee
Read Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Read Co Ltd filed Critical Read Co Ltd
Publication of TW200408501A publication Critical patent/TW200408501A/zh
Application granted granted Critical
Publication of TWI228066B publication Critical patent/TWI228066B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW092124643A 2002-09-09 2003-09-05 Abrasive cloth dresser and method for dressing an abrasive cloth with the same TWI228066B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002263215A JP4216025B2 (ja) 2002-09-09 2002-09-09 研磨布用ドレッサー及びそれを用いた研磨布のドレッシング方法

Publications (2)

Publication Number Publication Date
TW200408501A TW200408501A (en) 2004-06-01
TWI228066B true TWI228066B (en) 2005-02-21

Family

ID=31986432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092124643A TWI228066B (en) 2002-09-09 2003-09-05 Abrasive cloth dresser and method for dressing an abrasive cloth with the same

Country Status (5)

Country Link
US (1) US20040048557A1 (ja)
JP (1) JP4216025B2 (ja)
KR (1) KR100530905B1 (ja)
CN (1) CN1274465C (ja)
TW (1) TWI228066B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451942B (zh) * 2010-09-21 2014-09-11 Ritedia Corp 具實質平坦顆粒尖端之超研磨工具及其相關方法
TWI608904B (zh) * 2013-10-17 2017-12-21 Shin Etsu Handotai Co Ltd Trimming device for polishing polyurethane foam pad

Families Citing this family (56)

* Cited by examiner, † Cited by third party
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US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US20140120807A1 (en) * 2005-05-16 2014-05-01 Chien-Min Sung Cmp pad conditioners with mosaic abrasive segments and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8974270B2 (en) 2011-05-23 2015-03-10 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US20110275288A1 (en) * 2010-05-10 2011-11-10 Chien-Min Sung Cmp pad dressers with hybridized conditioning and related methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US20140120724A1 (en) * 2005-05-16 2014-05-01 Chien-Min Sung Composite conditioner and associated methods
US20170232576A1 (en) * 2006-11-16 2017-08-17 Chien-Min Sung Cmp pad conditioners with mosaic abrasive segments and associated methods
JP2008229820A (ja) * 2007-03-23 2008-10-02 Elpida Memory Inc Ｃｍｐ加工用のドレッサ及びｃｍｐ加工装置並びにｃｍｐ加工用の研磨パッドのドレッシング処理方法
JP5194516B2 (ja) * 2007-03-30 2013-05-08 富士通セミコンダクター株式会社 化学機械研磨装置の管理方法
JP5002353B2 (ja) * 2007-07-05 2012-08-15 シャープ株式会社 化学的機械的研磨装置
CN104708539A (zh) * 2007-09-28 2015-06-17 宋健民 具有镶嵌研磨块的cmp衬垫修整器和相关方法
WO2009064677A2 (en) 2007-11-13 2009-05-22 Chien-Min Sung Cmp pad dressers
TWI388402B (en) 2007-12-06 2013-03-11 Methods for orienting superabrasive particles on a surface and associated tools
KR100954225B1 (ko) * 2008-01-30 2010-04-21 주식회사 디어포스 환형 연마제품 및 그 제조방법
JP5255860B2 (ja) * 2008-02-20 2013-08-07 新日鉄住金マテリアルズ株式会社 研磨布用ドレッサー
TWI380878B (zh) * 2009-04-21 2013-01-01 Sung Chien Min Combined Dressing Machine and Its Making Method
KR101148934B1 (ko) * 2009-06-19 2012-05-22 치엔 민 성 조합식 드레서
TWI383860B (zh) * 2009-06-19 2013-02-01 Chien Min Sung Modular dresser
JP2012130995A (ja) * 2010-12-22 2012-07-12 Nitta Haas Inc ドレッサ
ITMI20110850A1 (it) * 2011-05-16 2012-11-17 Nicola Fiore Utensile multi-abrasivo
KR101191141B1 (ko) 2011-08-19 2012-10-16 김제석 제습기
KR102089383B1 (ko) * 2012-08-02 2020-03-16 쓰리엠 이노베이티브 프로퍼티즈 컴파니 정밀하게 형상화된 특징부를 갖는 연마 물품 및 그의 제조 방법
TWI511841B (zh) * 2013-03-15 2015-12-11 Kinik Co 貼合式化學機械硏磨修整器及其製法
TWI546159B (zh) * 2014-04-11 2016-08-21 中國砂輪企業股份有限公司 可控制研磨深度之化學機械研磨修整器
TW201600242A (zh) * 2014-06-18 2016-01-01 Kinik Co 拋光墊修整器
JP6176671B2 (ja) * 2014-11-19 2017-08-09 旭精機工業株式会社 研削装置
TWI616278B (zh) * 2015-02-16 2018-03-01 China Grinding Wheel Corp 化學機械研磨修整器
TWI595973B (zh) * 2015-06-01 2017-08-21 China Grinding Wheel Corp Chemical mechanical polishing dresser and its manufacturing method
JP2017035751A (ja) * 2015-08-10 2017-02-16 株式会社ディスコ パッドドレッサー
TWI623382B (zh) * 2015-10-27 2018-05-11 中國砂輪企業股份有限公司 Hybrid chemical mechanical polishing dresser
CN109311141B (zh) * 2016-06-13 2021-01-05 阪东化学株式会社 研磨材
JP2018034257A (ja) * 2016-08-31 2018-03-08 信越半導体株式会社 ドレッサー
US10471567B2 (en) * 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
CN111315535A (zh) * 2017-10-04 2020-06-19 圣戈班磨料磨具公司 磨料制品及其形成方法
TWI681843B (zh) * 2017-12-01 2020-01-11 詠巨科技有限公司 拋光墊修整方法
CN108188933A (zh) * 2017-12-24 2018-06-22 哈尔滨秋冠光电科技有限公司 一种化学机械抛光垫的修整设备的结构及其制造方法
KR102555813B1 (ko) * 2018-09-27 2023-07-17 삼성전자주식회사 패드 컨디셔닝 디스크
CN110561272A (zh) * 2019-10-23 2019-12-13 无锡市兰天金刚石有限责任公司 一种修整砂轮用超硬工具及其制备方法
EP4087706A4 (en) * 2020-01-06 2024-01-24 Saint-gobain Abrasives, Inc ABRASIVE ARTICLES AND METHOD OF USE
CN111203800B (zh) * 2020-02-20 2021-11-05 长江存储科技有限责任公司 研磨垫修整器及化学机械研磨设备
TWI768692B (zh) * 2021-02-01 2022-06-21 中國砂輪企業股份有限公司 化學機械研磨拋光墊修整器及其製造方法
MX2023013751A (es) * 2021-05-27 2023-12-04 The Malish Corp Sistema de cepillos de pulir.
CN113635228B (zh) * 2021-09-03 2022-07-01 郑州磨料磨具磨削研究所有限公司 一种半导体材料加工用自修整砂轮及其制备方法和应用
WO2023055649A1 (en) * 2021-09-29 2023-04-06 Entegris, Inc. Double-sided pad conditioner
JP2024085517A (ja) * 2022-12-15 2024-06-27 株式会社荏原製作所 研磨装置

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* Cited by examiner, † Cited by third party
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US5547417A (en) * 1994-03-21 1996-08-20 Intel Corporation Method and apparatus for conditioning a semiconductor polishing pad
US6196911B1 (en) * 1997-12-04 2001-03-06 3M Innovative Properties Company Tools with abrasive segments
TW383644U (en) * 1999-03-23 2000-03-01 Vanguard Int Semiconduct Corp Dressing apparatus
JP3527448B2 (ja) * 1999-12-20 2004-05-17 株式会社リード Ｃｍｐ研磨布用ドレッサー及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451942B (zh) * 2010-09-21 2014-09-11 Ritedia Corp 具實質平坦顆粒尖端之超研磨工具及其相關方法
TWI608904B (zh) * 2013-10-17 2017-12-21 Shin Etsu Handotai Co Ltd Trimming device for polishing polyurethane foam pad
US9981361B2 (en) 2013-10-17 2018-05-29 Shin-Etsu Handotai Co., Ltd. Apparatus for dressing urethane foam pad for use in polishing

Also Published As

Publication number Publication date
KR20040023556A (ko) 2004-03-18
TW200408501A (en) 2004-06-01
JP4216025B2 (ja) 2009-01-28
CN1494984A (zh) 2004-05-12
KR100530905B1 (ko) 2005-11-23
US20040048557A1 (en) 2004-03-11
JP2004098214A (ja) 2004-04-02
CN1274465C (zh) 2006-09-13

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