TWI228066B - Abrasive cloth dresser and method for dressing an abrasive cloth with the same - Google Patents
Abrasive cloth dresser and method for dressing an abrasive cloth with the same Download PDFInfo
- Publication number
- TWI228066B TWI228066B TW092124643A TW92124643A TWI228066B TW I228066 B TWI228066 B TW I228066B TW 092124643 A TW092124643 A TW 092124643A TW 92124643 A TW92124643 A TW 92124643A TW I228066 B TWI228066 B TW I228066B
- Authority
- TW
- Taiwan
- Prior art keywords
- grindstone
- honing
- particles
- dresser
- honing cloth
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
- B24D3/10—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002263215A JP4216025B2 (ja) | 2002-09-09 | 2002-09-09 | 研磨布用ドレッサー及びそれを用いた研磨布のドレッシング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200408501A TW200408501A (en) | 2004-06-01 |
TWI228066B true TWI228066B (en) | 2005-02-21 |
Family
ID=31986432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092124643A TWI228066B (en) | 2002-09-09 | 2003-09-05 | Abrasive cloth dresser and method for dressing an abrasive cloth with the same |
Country Status (5)
Country | Link |
---|---|
US (1) | US20040048557A1 (ja) |
JP (1) | JP4216025B2 (ja) |
KR (1) | KR100530905B1 (ja) |
CN (1) | CN1274465C (ja) |
TW (1) | TWI228066B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI451942B (zh) * | 2010-09-21 | 2014-09-11 | Ritedia Corp | 具實質平坦顆粒尖端之超研磨工具及其相關方法 |
TWI608904B (zh) * | 2013-10-17 | 2017-12-21 | Shin Etsu Handotai Co Ltd | Trimming device for polishing polyurethane foam pad |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US20070060026A1 (en) | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
US20140120807A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Cmp pad conditioners with mosaic abrasive segments and associated methods |
US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US8974270B2 (en) | 2011-05-23 | 2015-03-10 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
US8398466B2 (en) | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
US20110275288A1 (en) * | 2010-05-10 | 2011-11-10 | Chien-Min Sung | Cmp pad dressers with hybridized conditioning and related methods |
US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
US8622787B2 (en) | 2006-11-16 | 2014-01-07 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
US20140120724A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Composite conditioner and associated methods |
US20170232576A1 (en) * | 2006-11-16 | 2017-08-17 | Chien-Min Sung | Cmp pad conditioners with mosaic abrasive segments and associated methods |
JP2008229820A (ja) * | 2007-03-23 | 2008-10-02 | Elpida Memory Inc | Cmp加工用のドレッサ及びcmp加工装置並びにcmp加工用の研磨パッドのドレッシング処理方法 |
JP5194516B2 (ja) * | 2007-03-30 | 2013-05-08 | 富士通セミコンダクター株式会社 | 化学機械研磨装置の管理方法 |
JP5002353B2 (ja) * | 2007-07-05 | 2012-08-15 | シャープ株式会社 | 化学的機械的研磨装置 |
CN104708539A (zh) * | 2007-09-28 | 2015-06-17 | 宋健民 | 具有镶嵌研磨块的cmp衬垫修整器和相关方法 |
WO2009064677A2 (en) | 2007-11-13 | 2009-05-22 | Chien-Min Sung | Cmp pad dressers |
TWI388402B (en) | 2007-12-06 | 2013-03-11 | Methods for orienting superabrasive particles on a surface and associated tools | |
KR100954225B1 (ko) * | 2008-01-30 | 2010-04-21 | 주식회사 디어포스 | 환형 연마제품 및 그 제조방법 |
JP5255860B2 (ja) * | 2008-02-20 | 2013-08-07 | 新日鉄住金マテリアルズ株式会社 | 研磨布用ドレッサー |
TWI380878B (zh) * | 2009-04-21 | 2013-01-01 | Sung Chien Min | Combined Dressing Machine and Its Making Method |
KR101148934B1 (ko) * | 2009-06-19 | 2012-05-22 | 치엔 민 성 | 조합식 드레서 |
TWI383860B (zh) * | 2009-06-19 | 2013-02-01 | Chien Min Sung | Modular dresser |
JP2012130995A (ja) * | 2010-12-22 | 2012-07-12 | Nitta Haas Inc | ドレッサ |
ITMI20110850A1 (it) * | 2011-05-16 | 2012-11-17 | Nicola Fiore | Utensile multi-abrasivo |
KR101191141B1 (ko) | 2011-08-19 | 2012-10-16 | 김제석 | 제습기 |
KR102089383B1 (ko) * | 2012-08-02 | 2020-03-16 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 정밀하게 형상화된 특징부를 갖는 연마 물품 및 그의 제조 방법 |
TWI511841B (zh) * | 2013-03-15 | 2015-12-11 | Kinik Co | 貼合式化學機械硏磨修整器及其製法 |
TWI546159B (zh) * | 2014-04-11 | 2016-08-21 | 中國砂輪企業股份有限公司 | 可控制研磨深度之化學機械研磨修整器 |
TW201600242A (zh) * | 2014-06-18 | 2016-01-01 | Kinik Co | 拋光墊修整器 |
JP6176671B2 (ja) * | 2014-11-19 | 2017-08-09 | 旭精機工業株式会社 | 研削装置 |
TWI616278B (zh) * | 2015-02-16 | 2018-03-01 | China Grinding Wheel Corp | 化學機械研磨修整器 |
TWI595973B (zh) * | 2015-06-01 | 2017-08-21 | China Grinding Wheel Corp | Chemical mechanical polishing dresser and its manufacturing method |
JP2017035751A (ja) * | 2015-08-10 | 2017-02-16 | 株式会社ディスコ | パッドドレッサー |
TWI623382B (zh) * | 2015-10-27 | 2018-05-11 | 中國砂輪企業股份有限公司 | Hybrid chemical mechanical polishing dresser |
CN109311141B (zh) * | 2016-06-13 | 2021-01-05 | 阪东化学株式会社 | 研磨材 |
JP2018034257A (ja) * | 2016-08-31 | 2018-03-08 | 信越半導体株式会社 | ドレッサー |
US10471567B2 (en) * | 2016-09-15 | 2019-11-12 | Entegris, Inc. | CMP pad conditioning assembly |
CN111315535A (zh) * | 2017-10-04 | 2020-06-19 | 圣戈班磨料磨具公司 | 磨料制品及其形成方法 |
TWI681843B (zh) * | 2017-12-01 | 2020-01-11 | 詠巨科技有限公司 | 拋光墊修整方法 |
CN108188933A (zh) * | 2017-12-24 | 2018-06-22 | 哈尔滨秋冠光电科技有限公司 | 一种化学机械抛光垫的修整设备的结构及其制造方法 |
KR102555813B1 (ko) * | 2018-09-27 | 2023-07-17 | 삼성전자주식회사 | 패드 컨디셔닝 디스크 |
CN110561272A (zh) * | 2019-10-23 | 2019-12-13 | 无锡市兰天金刚石有限责任公司 | 一种修整砂轮用超硬工具及其制备方法 |
EP4087706A4 (en) * | 2020-01-06 | 2024-01-24 | Saint-gobain Abrasives, Inc | ABRASIVE ARTICLES AND METHOD OF USE |
CN111203800B (zh) * | 2020-02-20 | 2021-11-05 | 长江存储科技有限责任公司 | 研磨垫修整器及化学机械研磨设备 |
TWI768692B (zh) * | 2021-02-01 | 2022-06-21 | 中國砂輪企業股份有限公司 | 化學機械研磨拋光墊修整器及其製造方法 |
MX2023013751A (es) * | 2021-05-27 | 2023-12-04 | The Malish Corp | Sistema de cepillos de pulir. |
CN113635228B (zh) * | 2021-09-03 | 2022-07-01 | 郑州磨料磨具磨削研究所有限公司 | 一种半导体材料加工用自修整砂轮及其制备方法和应用 |
WO2023055649A1 (en) * | 2021-09-29 | 2023-04-06 | Entegris, Inc. | Double-sided pad conditioner |
JP2024085517A (ja) * | 2022-12-15 | 2024-06-27 | 株式会社荏原製作所 | 研磨装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5547417A (en) * | 1994-03-21 | 1996-08-20 | Intel Corporation | Method and apparatus for conditioning a semiconductor polishing pad |
US6196911B1 (en) * | 1997-12-04 | 2001-03-06 | 3M Innovative Properties Company | Tools with abrasive segments |
TW383644U (en) * | 1999-03-23 | 2000-03-01 | Vanguard Int Semiconduct Corp | Dressing apparatus |
JP3527448B2 (ja) * | 1999-12-20 | 2004-05-17 | 株式会社リード | Cmp研磨布用ドレッサー及びその製造方法 |
-
2002
- 2002-09-09 JP JP2002263215A patent/JP4216025B2/ja not_active Expired - Fee Related
-
2003
- 2003-09-05 TW TW092124643A patent/TWI228066B/zh not_active IP Right Cessation
- 2003-09-08 US US10/656,212 patent/US20040048557A1/en not_active Abandoned
- 2003-09-09 CN CNB03156576XA patent/CN1274465C/zh not_active Expired - Fee Related
- 2003-09-09 KR KR10-2003-0062956A patent/KR100530905B1/ko not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI451942B (zh) * | 2010-09-21 | 2014-09-11 | Ritedia Corp | 具實質平坦顆粒尖端之超研磨工具及其相關方法 |
TWI608904B (zh) * | 2013-10-17 | 2017-12-21 | Shin Etsu Handotai Co Ltd | Trimming device for polishing polyurethane foam pad |
US9981361B2 (en) | 2013-10-17 | 2018-05-29 | Shin-Etsu Handotai Co., Ltd. | Apparatus for dressing urethane foam pad for use in polishing |
Also Published As
Publication number | Publication date |
---|---|
KR20040023556A (ko) | 2004-03-18 |
TW200408501A (en) | 2004-06-01 |
JP4216025B2 (ja) | 2009-01-28 |
CN1494984A (zh) | 2004-05-12 |
KR100530905B1 (ko) | 2005-11-23 |
US20040048557A1 (en) | 2004-03-11 |
JP2004098214A (ja) | 2004-04-02 |
CN1274465C (zh) | 2006-09-13 |
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Legal Events
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MK4A | Expiration of patent term of an invention patent |