TWI228066B - Abrasive cloth dresser and method for dressing an abrasive cloth with the same - Google Patents

Abrasive cloth dresser and method for dressing an abrasive cloth with the same Download PDF

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TWI228066B
TWI228066B TW092124643A TW92124643A TWI228066B TW I228066 B TWI228066 B TW I228066B TW 092124643 A TW092124643 A TW 092124643A TW 92124643 A TW92124643 A TW 92124643A TW I228066 B TWI228066 B TW I228066B
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Taiwan
Prior art keywords
grindstone
honing
particles
dresser
honing cloth
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TW092124643A
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Chinese (zh)
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TW200408501A (en
Inventor
Tadakatsu Nabeya
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Read Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B24D3/10Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements for porous or cellular structure, e.g. for use with diamonds as abrasives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental

Abstract

An abrasive cloth dresser is provided which is capable of adjusting the state of its dressing face so as to give an abrasive cloth a uniform polishing surface, and capable of giving the surfaces of an abrasive cloth a suitable polishing capability according to polishing objects, even if the dressing face state exhibits individual differences in, for example, the end shapes of abrasive grains. The abrasive cloth dresser 1 includes a base metal 2 having a ring-shaped dressing face 4 in the outer region of the base metal 2. First abrasive grain units 5 and second abrasive grain units 6 formed of abrasive grains with different grain sizes from each other are alternately arranged on the dressing face 4. The base metal 2 includes adjusters 7 for arbitrarily adjusting the height difference delta between reference planes S1 and S2 of the respective abrasive grain units 5 and 6. The reference planes S1 and S2 each include the ends of the abrasive grains with the largest grain size.

Description

1228066 ⑴ 玖、發明說明 【發明所屬之技術領域】 本發明是關於機械式化學硏磨(C h e m i c a 1 M e c h a n i c a 1 Polishing,以下簡稱爲 CMP )之中進行硏磨布的網目阻 塞或異物的除去之際所使用之硏磨布用修整器及其使用之 硏磨布的修整方法。 【先前技術】 一般在矽晶圓基板上製造半導體矽晶基板或積體電路 等微細的電子電路的過程中,以除去存在於基板表面的凹 凸或結晶缺陷爲目的而採用CMP加工。此CMP加工係一 面用預定的載重將晶圓基板壓貼在由已粘貼在硏磨裝置的 平台之發泡聚胺酯等所形成的硏磨布,一面供應漿劑的硏 磨液,使晶圓及硏磨布都旋轉而進行硏磨。 上述C Μ P加工用的漿劑,使用使氧化鐵、碳酸鋇、 氧化鈽、氧化鋁、膠質氧化矽等的硏磨顆粒浮游在氫氧化 鉀、稀鹽酸、稀硝酸、過氧化氫水、硝酸鐵等硏磨液之漿 劑,這些劑材則是依照硏磨速度及晶圓或晶圓基板上的前 述被加工物種類作適度選擇。 此C Μ Ρ加工由於用多數片的同種硏磨布或反覆多數 次來硏磨晶圓,由而隨著CMP加工的次數增多,被除去 之被加工物的粉屑或凝聚在一起的硏磨顆粒進到硏磨布的 微細空孔中而引起網目阻塞,造成晶圓硏磨速度的降低。 因而除去已網目阻塞之硏磨布的表層’再生硏磨布表面的 1228066 (2) 粗度而回復硏磨速度之被稱爲修整的作業必須隨時或定_ 進行,此作業使用有稱爲硏磨布用修整器的工具。 鑽石磨石顆粒是因爲對硏磨布的修整之優良的材料, 所以硏討利用鑽石磨石顆粒之硏磨布用修整器,經鎳電金度 將鑽石磨石粒子電塗膜在不銹鋼上的方法一般已被實用化 。除此之外還提案有用金屬焊材將鑽石磨石顆粒焊接在不 銹鋼上的方法(例如,參考日本專利特開平1 0 — 〇 1 2 5 7 9 號公報),經由燒結使鑽石磨石顆粒及保持材反應燒結加 以固著之方法(例如,參考日本專利特開 2 0 0 1 - 1 7 9 6 3 8 號公報)。另外,此獲得穩定的硏磨布的表層除去能力爲 目的,還提案有以等間隔排列磨石顆粒之CMP硏磨布修 整器(例如,參考日本專利特開2000 — Μ 12 04號公報、 特開2 002 — 1 2 7 0 1號公報)。 不過上述過去的硏磨布用修整器,由於其構造上無法 避免因磨石顆粒的前端形狀等造成修整面的狀態發生個體 差,所以即使使用相同硏磨布用修整器仍不易創出均一的 硏磨布表面;另外,硏磨布的表面狀態必須依照被加工物 加以調整,例如對於已在矽晶圓表面形成層間氧化膜之晶 圓,由於硏磨布的表面狀態仍是粗糙的狀態,因而以加強 所硏磨布的機械式除去加工爲主因而提高硏磨速度;另外 ,Cii配線則是以比硏磨布的機械式除去加工更要加強存 在於硏磨布表面之硏磨液(Slurry )的化學反應爲主因, 必須使硏磨布維持一定程度的表面粗度,因而對於修整硏 磨布的表面之硏磨布用修整器,必須準備所要數量之修整 1228066 (3) 面的狀態適於上述被加工物的硏磨布’而會有成本增高的 問題。 【發明內容】 本發明所欲解決之技術課題,是提供硏磨布用修整器 及其使用之硏磨布的修整方法。硏磨布用修整器由於能調 整修整面的狀態,因而即使磨石顆粒的前端形狀等造成修 整面的狀態發生個體差,經調整該修整面仍能創出均一的 硏磨布表面、或是能對硏磨布表面賦予對應被加工物之適 切的硏磨性能。 爲了解決上述課題,本發明的硏磨布用修整器,是在 可旋轉的金屬台的表面形成有修整面之硏磨布用修整器, 其特徵爲:在上述修整面朝該周方向並排設置有複數個磨 石顆粒群,在上述金屬台,設置有能調節全部或一部分的 磨石顆粒群中以多數個磨石顆粒的前端所分別形成之基準 面的上述修整面上的高低差之調節機構。 依據上述硏磨布用修整器,因藉由上述調節機構就能 任意地調節複數個磨石顆粒群中之上述各基準面的高低差 ,所以即使磨石顆粒的前端形狀等造成修整面的狀態發生 個體差,經由調節上述複數個磨石顆粒群之基準面的高低 差來調整修整面的狀態,仍能創出均一的硏磨布表面,或 是對於硏磨布表面也就是硏磨布的硏磨面能施加對應於被 加工物之適切的硏磨性能。此情況,基準面較高的磨石顆 粒群主要是作爲有助於對硏磨布表面的磨耗,基準面較低 1228066 (4) 的磨石顆粒主要是有助於用來調整硏磨布的表面粗度。 上述硏磨布用修整器’能製作成具有上述調節機構之 磨石顆粒群分別固著在與上述金屬台不同體所形成的上述 調節機構的基台上,沿著上述修整面之金屬台的周緣部而 呈環狀並排設置各磨石顆粒群。 上述磨石顆粒群分別形成爲從與上述修整面的周緣成 平行的圓環片形狀、與上述修整面的周緣成一定角度之螺 旋片形狀、小圓形狀當中所選出之1種或2種的平面形狀 ’則經由修整所除去之硏磨布的切削屑或凝聚在一起的漿 劑易於排出到修整器外部更加理想。 上述磨石顆粒群分別形成爲從上述平面形狀當中所選 出之2種的平面形狀時,這些平面形狀不同的2種磨石顆 粒群朝修整面的周方向交互地並排設置較爲適切。 另外,並排設置在修整面之各磨石顆粒群也能相互地 利用相同粒度的磨石顆粒來形成之同樣的磨石顆粒群、或 以不同粒度的磨石顆粒所形成之2種磨石顆粒群所構成。 然後,並排設置在上述修整面之磨石顆粒群相互地利 用不同粒度的磨石顆粒來形成之第1磨石顆粒群和第2磨 石顆粒群所構成時,朝修整面的周方向交互地並排設置這 些第1磨石顆粒群和第2磨石顆粒群較爲適切。該情況, 能以相同粒度的磨石顆粒或不同2種粒度的磨石顆粒來形 成上述第1磨石顆粒群。 此處,上述各磨石顆粒群,在於前述修整面上以二次 元且有規則地排列有磨石顆粒,且以正三角形成平行四邊 ί: - 7 - 1228066 (5) 形來排列相互地相鄰的磨石顆粒彼此間所組成之最小格子 ,則能使修整的穩定性或均一性更提升而更加理想。 進而,上述課題用藉由上述調節機構,在相鄰之磨石 顆粒群的上述基準面間設置一定的高度差,而將上述硏磨 布藉由修整之硏磨布的修整方法就能解決。 上述硏磨布的修整方法,當複數個磨石顆粒群由上述 第1磨石顆粒群及第2磨石顆粒群所構成時,利用上述調 節機構進行調節來使上述修整面之第1磨石顆粒群的基準 面的高度比第2磨石顆粒群的基準面高度還高出一定量的 方式,而將上述硏磨布修整較爲適切。 依據這種本發明的硏磨布用修整器及其使用之研磨布 的修整方法,因各磨石顆粒群以磨石顆粒的前端將分別形 成的磨石顆粒基準面之上述修整面上的高低差利用調節機 橇來任意地調節,就能將修整面調整成所期望的狀態,所 以即使在磨石顆粒的前端形狀等修整面的狀態發生個體差 ’仍能創出均一的砑磨布表面,而且即使對於硏磨布表面 也可以施加對應於被加工物之適切的硏磨性能。 【實施方式】 第1 A〜1 D圖爲表示本發明的硏磨布用修整器之磨石 頼粒群的不同配置形狀的第〗實施形態。硏磨布用修整器 1係由在其表面側的中心具有圓形的凹部2 a,並且在其周 _的金屬台表面3形成有環狀的修整面4之圓盤狀金屬台 2所構成,在上述修整面4,呈環狀並排設置有沿著周方 1228066 (6) 向而獨立的第1和第2磨石顆粒群5、6各複數個。換言 之,沿著金屬台表面3即是沿著上述金屬台2的周緣部而 呈環狀並排設置有複數個磨石顆粒群5、6而形成上述修 整面4。 然而,如第3圖所示,各磨石顆粒群5、6將包含粒 度最大的磨石顆粒的前端之平面設爲基準面S 1、S 2時, 爲了使修整面4可以任意地調節上述複數個磨石粒子群5 、6之各基準面S 1、S 2間相互的高低差5,所以在上述 金屬台2設置有調節機構7。 此處,無必要性一定要在上述金屬台2設置上述凹部 2 a ° 具體地說明,上述調節機構7係由位在表面固著有磨 石顆粒群5或6,可上下滑動自如地嵌入到上述金屬台2 的表面3所開口之凹部7 e之基台7 a、及設置在該基台7 a 的背靣’螺合在從上述金屬台2之凹部7e的底面貫穿到 該金屬台2的背面側之螺絲孔7 c之調節用螺絲7 b、及利 用該調節用螺絲7 b來調節固著在上述基台7 a的磨石顆粒 君ΐ ^、6之基準面的高度位置,而夾持在上述基台7 ^的背 面與上述凹邰7 e的底面之間的間隔件7 d所構成。然後, 讓分別固著在上述調節機構7之基台7 a的表面之複數個 磨石顆粒5、6沿著上述金屬台2的周緣部而呈環狀並排 設置,而形成上述修整面4。 因此,具有將上述磨石顆粒群5、6的基準面S 1、S2 調節到所期望的高度位置所必要的厚度之間隔件以,設 1228066 (7) 定在上述金屬台2的凹部7e內,藉由利用上述調節用螺 絲7 b使之夾持在該凹部7 e的底面與上述基台7 a的背面 之間,而能調節對於上述各磨石顆粒群5、6之基準面S 1 、S 2的金屬台表面3的高度位置,即是能調節複數個磨 石顆粒群5、6之各基準面S 1、S2間相互的高低差(5,而 調整修整面4的狀態。然而,在本實施形態之中,利用調 節機構7,製作成能對於上述基準面 S 1、S2的金屬台表 面 3的高度以0〜3 0 0 // m的範圍調節上述基準面SI、S2 對金屬座台3的高度。 上述磨石顆粒群當中,基準面較高的磨石顆粒群主要 是作爲有助於對硏磨布的磨耗,基準面較低的磨石顆粒群 有助於用來調整硏磨布的表面粗度。即是在基準面較高的 磨石顆粒群藉由集中性作用加諸在修整器全體的載重,因 而每單位面積的負荷載重增大’所以該負荷載重增大主要 是作爲有助於對硏磨布的磨耗;此外’基準面較低的磨石 顆粒群,直到一定程度爲止才負擔載重’而利用上述基準 靣較高的磨石顆粒群使硏磨布的磨耗速度減低。然而’基 準面間相互的高度差5極端大時’因爲基準面較低的磨石 顆粒群完全沒有負擔載重,所以不會發揮使硏磨布的磨耗 速度減低的效杲。此基準面較低的磨石顆粒群對排出硏磨 布的切削屑也有效地作用。 另外,在硏磨布用修整器1中’上述複數個磨石顆粒 群5、6係相互地利用不同粒度的磨石顆粒來形成之第1 磨石顆粒群5及第2磨石顆粒群6所構成。這些2種的磨 -10- 1228066 (8) 石顆粒群5、6沿著上述金屬台2的周緣部而朝其圓周方 向交互地並排設置而形成修整面4。1228066 ⑴ 发明, Description of the invention [Technical field to which the invention belongs] The present invention relates to the removal of the mesh of the honing cloth or the removal of foreign materials in mechanical chemical honing (C hemica 1 M echanica 1 Polishing (hereinafter referred to as CMP)). The dresser for honing cloth used in the world and the dressing method of the honing cloth used. [Prior technology] In the process of manufacturing fine electronic circuits such as semiconductor silicon substrates or integrated circuits on silicon wafer substrates, CMP processing is used for the purpose of removing bumps or crystal defects existing on the substrate surface. In this CMP process, a wafer substrate is pressed against a honing cloth formed of a foamed polyurethane and the like pasted on a platform of a honing device with a predetermined load, and a slurry honing liquid is supplied to the wafer and the wafer. The honing cloths are rotated for honing. The above-mentioned slurry for CMP processing uses honing particles such as iron oxide, barium carbonate, hafnium oxide, alumina, colloidal silica to float on potassium hydroxide, dilute hydrochloric acid, dilute nitric acid, hydrogen peroxide water, and nitric acid. The slurry of honing liquid such as iron, these materials are appropriately selected according to the honing speed and the type of the object to be processed on the wafer or wafer substrate. In this CMP process, since the wafers are honed with the same honing cloth of a plurality of pieces or repeatedly, as the number of CMP processes increases, the dust of the workpieces to be removed or the hones that are aggregated together are removed. Particles enter the fine pores of the honing cloth and cause the mesh to be blocked, resulting in a decrease in wafer honing speed. Therefore, the surface of the honing cloth that has been blocked by the mesh is removed. The surface of the recycled honing cloth is 1228066. (2) The thickness of the honing cloth and the honing speed is restored. The operation called trimming must be performed at any time or at regular intervals. Abrasive dressing tool. Diamond millstone particles are an excellent material for dressing honing cloths. Therefore, we use diamond dresser grain honing cloth dresser to electro-coat diamond millstone particles on stainless steel with nickel electro-metallic degree. The method has generally been put into practical use. In addition, a method of welding diamond grindstone particles to stainless steel with a metal welding material is also proposed (for example, refer to Japanese Patent Laid-Open Publication No. 10 — 〇1 2 5 7 9), and the diamond grindstone particles and A method of holding and sintering the holding material by reaction (for example, refer to Japanese Patent Laid-Open Nos. 2000-1-7 9 6 38). In addition, for the purpose of obtaining a stable surface removal ability of a honing cloth, a CMP honing cloth dresser in which grindstone particles are arranged at equal intervals is also proposed (for example, refer to Japanese Patent Laid-Open No. 2000-M 12 04, On 2 002 — 1 2 7 0 1). However, due to the structure of the conventional honing cloth dresser, the condition of the dressing surface due to the shape of the tip of the grindstone particles can not be avoided. Even if the same honing cloth dresser is used, it is not easy to create a uniform dressing. The surface of the abrasive cloth; in addition, the surface state of the honing cloth must be adjusted according to the object being processed. For example, for wafers that have formed an interlayer oxide film on the surface of the silicon wafer, the surface state of the honing cloth is still rough, so The honing speed is mainly enhanced by strengthening the mechanical removal of the honing cloth. In addition, the Cii wiring is to strengthen the honing liquid (Slurry) on the surface of the honing cloth more than the mechanical removal of the honing cloth. The chemical reaction of) is the main reason. It is necessary to maintain a certain degree of surface roughness of the honing cloth. Therefore, for a honing cloth dresser for trimming the surface of the honing cloth, a required number of trimming 1228066 (3) surfaces must be prepared. There is a problem that the honing cloth for the object to be processed increases in cost. SUMMARY OF THE INVENTION The technical problem to be solved by the present invention is to provide a dresser for a honing cloth and a method for dressing the honing cloth used therefor. Since the conditioner of the honing cloth can adjust the state of the finishing surface, even if the shape of the tip of the grinding stone particles causes an individual difference, the adjusted surface can still create a uniform honing cloth surface, or Appropriate honing performance corresponding to the object to be processed on the surface of the honing cloth. In order to solve the above problems, the honing cloth dresser of the present invention is a honing cloth dresser having a dressing surface formed on the surface of a rotatable metal table, and is characterized in that the dressing surfaces are arranged side by side in the circumferential direction. There are a plurality of grindstone particle groups, and the metal table is provided with an adjustment for adjusting the height difference on the trimming surface on the reference surface formed by the front ends of a plurality of grindstone particles in all or part of the grindstone particle groups. mechanism. According to the dresser for honing cloth, the height difference of the reference surfaces in the plurality of grindstone particle groups can be arbitrarily adjusted by the adjustment mechanism, so even if the shape of the tip of the grindstone particles causes the state of the dressing surface Individual differences occur, and the state of the trimmed surface can be adjusted by adjusting the height difference of the reference surfaces of the plurality of grindstone particle groups, which can still create a uniform honing cloth surface, or the honing cloth surface, which is the honing cloth. The abrasive surface can apply appropriate honing performance corresponding to the object to be processed. In this case, the group of grindstone particles with a higher reference surface is mainly used to help the wear of the honing cloth surface, and the stone particles with a lower reference surface of 1228066 (4) are mainly used to adjust the honing cloth. Surface roughness. The dresser for honing cloth can be made into a group of grindstone particles having the above-mentioned adjusting mechanism and fixed on a base of the above-mentioned adjusting mechanism formed by a body different from the above-mentioned metal table, along the metal table of the above-mentioned dressing surface. Each grinding stone particle group is arranged side by side in a ring shape at the periphery. The grindstone particle group is respectively formed from one or two selected from the shape of a ring plate parallel to the peripheral edge of the trimming surface, a spiral piece shape that forms an angle with the peripheral edge of the trimming surface, and a small circle shape. The “planar shape” is more ideal because the cuttings of the honing cloth removed by the dressing or the aggregated slurry are easily discharged to the outside of the dresser. When the grindstone particle groups are respectively formed into two kinds of planar shapes selected from the above-mentioned planar shapes, it is appropriate that the two kinds of grindstone particles with different planar shapes are alternately arranged side by side in the circumferential direction of the dressing surface. In addition, each grinding stone particle group disposed side by side on the finishing surface can also mutually use the same grinding stone particles of the same size to form the same grinding stone particle group, or two kinds of grinding stone particles formed of the grinding stone particles of different particle sizes. Group of people. Then, when the first grindstone particle group and the second grindstone particle group formed by the grindstone particle groups arranged side by side using the grindstone particles of different particle sizes are formed side by side, the grindstone particle groups are alternately oriented in the circumferential direction of the dressing surface. It is appropriate to arrange these first millstone particle groups and second millstone particle groups side by side. In this case, the first grindstone particle group can be formed with the grindstone particles of the same particle size or the grindstone particles of two different particle sizes. Here, the above-mentioned grinding stone particles are arranged in a two-dimensional and regular arrangement on the aforementioned trimming surface, and the parallel triangles are formed in a regular triangle. 7: 7-1228066 (5) to arrange the mutual phase The smallest lattice formed by adjacent millstone particles can improve the stability or uniformity of the dressing and is more ideal. Furthermore, the above-mentioned problem can be solved by the above-mentioned adjusting mechanism, in which a certain height difference is set between the reference planes of the adjacent grindstone particle groups, and the honing cloth can be trimmed by a trimming honing cloth. In the dressing method of the honing cloth, when the plurality of grindstone particle groups are composed of the first grindstone particle group and the second grindstone particle group, the first grinding stone of the dressing surface is adjusted by the adjustment mechanism. The reference plane height of the particle group is higher than the reference plane height of the second millstone particle group by a certain amount, and the honing cloth is more appropriately trimmed. According to the dresser for honing cloth and the dressing method of the dressing cloth used by the present invention, the heights of the above-mentioned dressing surfaces of the reference surface of the grindstone particles formed by the front ends of the grindstone particles of each grindstone particle group The adjustment can be adjusted arbitrarily by the adjustment skid to adjust the dressing surface to the desired state, so even if there is an individual difference in the condition of the dressing surface such as the tip shape of the grindstone particles, a uniform honing cloth surface can be created. In addition, even honing cloth surface can be provided with appropriate honing performance corresponding to the object. [Embodiments] Figs. 1A to 1D show the first embodiment of the different arrangement shapes of the grindstone particles of the dresser for a honing cloth of the present invention. The dresser 1 for honing cloth is constituted by a disc-shaped metal table 2 having a circular recess 2 a at the center of its surface side, and a ring-shaped dressing surface 4 formed on the metal table surface 3 of its periphery. A plurality of first and second grindstone particle groups 5 and 6 are provided side by side in a circular shape on the trimming surface 4 in a direction of 1228066 (6). In other words, a plurality of grindstone particle groups 5 and 6 are arranged side by side in a ring shape along the metal table surface 3, that is, along the peripheral edge portion of the metal table 2, to form the modified surface 4. However, as shown in FIG. 3, when each of the grinding stone particle groups 5 and 6 sets the plane of the tip of the grinding stone particle with the largest particle size as the reference planes S 1 and S 2, the above-mentioned can be arbitrarily adjusted for the trimming surface 4. The height difference 5 between the reference surfaces S 1 and S 2 of the plurality of millstone particle groups 5 and 6 is 5. Therefore, an adjustment mechanism 7 is provided on the metal table 2. Here, it is not necessary to provide the recessed portion 2 a in the metal table 2. Specifically, the adjustment mechanism 7 is composed of a grindstone particle group 5 or 6 fixed on the surface, and can be slidably inserted into the adjustment mechanism 7. The base 7a of the recessed portion 7e opened on the surface 3 of the metal table 2 and the back ′ provided on the base 7a are screwed to penetrate from the bottom surface of the recessed portion 7e of the metal table 2 to the metal table 2 The adjustment screw 7 b of the screw hole 7 c on the rear side of the rear side, and the height position of the reference plane of the grindstone particles ΐ, 6 fixed on the abutment 7 a using the adjustment screw 7 b, and The spacer 7 d is sandwiched between the back surface of the abutment 7 ^ and the bottom surface of the recess 7 e. Then, a plurality of grindstone particles 5, 6 fixed to the surface of the base table 7a of the adjustment mechanism 7 are arranged side by side in a ring shape along the peripheral edge portion of the metal table 2 to form the trimming surface 4. Therefore, a spacer having a thickness necessary to adjust the reference surfaces S 1 and S 2 of the grinding stone particle groups 5 and 6 to a desired height position is set to 1228066 (7) and set in the recess 7e of the metal table 2 By using the adjustment screw 7 b to hold it between the bottom surface of the recess 7 e and the back surface of the abutment 7 a, the reference surface S 1 for each of the grinding stone particle groups 5 and 6 can be adjusted. The height position of the metal table surface 3 of S and S 2 can adjust the height difference between the reference surfaces S 1 and S 2 of the plurality of grinding stone particle groups 5 and 6 (5, and adjust the state of the trimming surface 4. However, In this embodiment, the adjustment mechanism 7 is used to make the height of the metal table surface 3 of the reference planes S1 and S2 to adjust the reference plane SI and S2 pairs in the range of 0 to 3 0 0 // m. The height of the metal base 3. Among the above-mentioned grindstone particles, the grindstone particles having a higher reference surface are mainly used to help the honing cloth, and the grindstone particles having a lower reference surface are useful for Adjust the roughness of the surface of the honing cloth. The effect is added to the overall load of the dresser, so the load load per unit area increases. Therefore, the increase in the load load is mainly to help the wear of the honing cloth; in addition, the group of grinding stones with a lower reference surface The load will not be carried until a certain degree ', and using the above reference 靣 higher abrasive stone particle group reduces the wear rate of the honing cloth. However,' when the height difference between the reference surfaces is extremely large 5 'because the reference surface is lower The grindstone particle group has no load at all, so it will not exert the effect of reducing the abrasion rate of the honing cloth. The grindstone particle group with a lower reference level also effectively functions to discharge the cutting chips of the honing cloth. In the dresser 1 for honing cloth, the above-mentioned plurality of grindstone particle groups 5 and 6 are composed of a first grindstone particle group 5 and a second grindstone particle group 6 which are formed by using grindstone particles of different particle sizes. These two types of grinding-10- 1228066 (8) Stone particle groups 5, 6 are alternately arranged side by side along the peripheral edge portion of the metal table 2 in the circumferential direction to form a trimming surface 4.

具體上,上述第1磨石顆粒群5如第5、6圖所不’ 由大小2種粒度的磨石顆粒5 0、5 1所形成’這些的磨石 顆粒5 0、5 1,如第5圖所示,在於基台7a的轰面上’即 是在於前述修整面4上以2次元且有規則的等地排列’相 互地鄰接的磨石顆粒彼此間所組成的最小格子則是以正三 角形或平行四邊形來加以排列。然而,較大的磨石顆粒 5 〇彼此間的間隔比較小的磨石顆粒5 1彼此間的間隔更寬 此樣,有規則性均等地排列大小2種粒度的磨石顆粒 ,就能使修整的穩定性或均一性更提升。 此外,關於上述第2磨石顆粒群6,由粒度與上述第 1磨石顆粒群5的磨石顆粒的粒度不同之相同粒度的磨石 顆粒或複數種粒度的磨石顆粒的其中一種所形成亦可,不 過與上述第1磨石顆粒群5同樣地,期望是以二次元且有 規則性均等地排列磨石顆粒。 此處,形成上述磨石顆粒群5、6之磨石顆粒,例如 能採用鑽石磨石顆粒’其磨石顆粒的粒度,一般期望是在 •Π S B 4〗3 0所規定的粒度# 3 2 5 / # 4 0 0〜# 6 0 / # 8 0的範圍內。 另外’形成上述第1磨石顆粒群5之磨石顆粒無必要 性要用大小2種顆粒度的磨石顆粒5 〇、5 1,即使用相同 粒度的磨石顆粒亦可(參考第2A〜2D圖的實施形態)。 另外,上述調節機構7無必要性一定要設置在第1磨石顆 -11 - 1228066 (9) 粒群5及第2磨石顆粒群6的兩方,只設置在磨石顆粒群 的一部分,即是只設置在第1磨石顆粒群5或第2磨石顆 粒群6的一方亦可。此情況,不設置調節機構7之磨石顆 粒群,讓基台7 a直接固定在金屬台2的周緣部。 此樣,採用每個磨石顆粒群之不同粒度的磨石顆粒, 或是在於各磨石顆粒群中使不同粒度的磨石顆粒混入,則 較大粒度的磨石顆粒主要是作爲有助於硏磨布的磨耗,較 小粒度的磨石顆粒有助於用來調整硏磨布的表面粗度,經 由調整這些粒度,就能使硏磨布的表面粗度成爲特定對象 物進行CMP加工的狀態。 進而,如第1 A〜1D圖所示,在硏磨布用修整器]中 將上述第〗磨石顆粒群5及第2磨石顆粒群6的平面形狀 ,可以從小圓形狀、與上述金屬台2的周緣即是與修整面 4的周緣成平行的圓環片形狀、與上述金屬台2的周緣即 是與修整面4的周緣成一定角度之螺旋片形狀當中選擇1 種或2種。第1 A圖爲表示兩磨石顆粒群5、6都是小圓 形狀的情況。第】B圖爲表示第1磨石顆粒群5爲小圓形 狀而第2磨石顆粒群爲螺旋片形狀的情況。第1 C圖爲表 示兩磨石顆粒群5、6都是圓環片形狀的情況。.第1 〇圖 爲表示兩磨石顆粒群5、6都是螺旋片形狀的情況。沿著 金屬台表面3即是沿著金屬台2的周緣部而呈環狀排列此 種形成爲平面形狀的磨石顆粒群5、6,而藉由利用形成 修整面4,而修整來除去之硏磨布的切削屑或凝聚在一起 的漿劑,能容易排出到修整器的外部,另外能調整該排出 -12- 1228066 (10) 性能。 然而,上述磨石顆粒群5、6,如第3、6圖所示,藉 由保持材52來讓磨石顆粒保持而形成,藉由例用粘合劑 8等將保持該磨石顆粒之保持材5 2固著在上述調節機構7 之基台7a的表面,該磨石顆粒群5、6固著在上述基台 7a ± 〇 另外,作爲上述保持材5 2的磨石顆粒爲鑽石時,雖 然可以採用與鑽石磨石顆粒反應燒結之矽及/或矽合金, 惟若爲適於保持磨石顆粒之保持材,則沒有特別的限制, 也能利用一般的鎳電塗膜或焊材經結合來保持。 其次,說明有關‘藉由上述硏磨布用修整器1之硏磨布 的修整方法,藉由上述調節機構7,在交互地鄰接的第1 磨石顆粒群5和第2磨石顆粒群6的各基準面S 1、S2間 ,設置對金屬台表面3之一定的高低差(5,而將上述硏磨 布修整。換言之,藉由利用上述調節機構7來使第1磨石 顆粒群5的基準面S 1比上述第2磨石顆粒群6的基準面 s 2還在上述金屬台表面3的垂直方向的咼度以咼出一疋 量δ的方式調節,而適度調整上述修整面4的狀態,就能 將上述硏磨布表面修整成依照被加工物所期望的狀態。 如此依據上述硏磨布用修整器],由於經由調節基準 面S 1、S2的高度差(5,就能將修整靣4的狀態調整成能 發揮所期望的硏削性能,所以即使在修整面4的狀態發生 個體差,不僅仍能創出均一的硏磨布表面,而且還能對於 硏磨布表面而施加對應於被加工物之適切的硏磨性能。 -13- 1228066 (11) 第2A〜2D圖爲表示本發明的硏磨布用修整器之磨石 顆粒群的不同配置形狀之第2實施形態,在本實施形態之 硏磨布用修整器1 〇之中,複數個磨石顆粒群只以上述第 1磨石顆粒群5來形成,沿著金屬台2的周緣部呈環狀並 排設置這些相同的磨石顆粒群5而形成有修整面4。 另外,該磨石顆粒群5的平面形狀,與上述第1實施 形態的情況相同,可以從小圓形狀、與上述修整面4的周 緣成平行的圓環片形狀、與上述修整面4的周緣成一定角 度的螺旋片形狀當中選擇。第2A圖爲表示磨石顆粒群5 全部都是小圓形狀的情況。第2B圖爲表示磨石顆粒群5 爲小圓形狀和螺旋片形狀,具有這些2種不同的平面形狀 之磨石顆粒群5朝修整面4的周方向交互地並排設置的情 況。第2C圖爲表示磨石顆粒群5全部都是圓環片形狀的 情況。第2D圖爲表示磨石顆粒群5全部都是螺旋片形狀 的情況。 1 關於包含調節機構7的其他構成,因爲與上述第1實 施形態共通,所以爲了避免重複在此將說明省略。 然後,針對採甩上述硏磨布用修整器1 〇而修整硏磨 布,如第4圖所示,藉由調節機構7,在交互地鄰接之上 述磨石顆粒群5的基準面S】間設置對金屬台表面3的一 定的高度差(5而進行修整。 如此依據上述硏磨布用修整器1 〇,由於與上述硏磨 布用修整器1相同,適度調節上述相鄰之磨石顆粒群5的 基準面S 1間的高低差δ就能將修整面4的狀態調整成所 -14 - 1228066 (12) 期望的狀態,所以即使修整面4的狀態發生個體差,不僅 仍能創出均一的硏磨布表面,還能對於硏磨布表面對應於 被加工物之適切的硏磨性能施加到硏磨布表面。 然而,上述調節機構7本體的構成,並不侷限於參考 圖面已說明過的上述構成,還能採用在微細的範圍內可以 上下調整磨石顆粒群的基準面之各種機構。 以下,具體表示本發明的硏磨布用修整器及其使用的 修整方法之實施例及比較例。只不過本發明並沒有因這些 個實施例而受到任何的限定。 〔實施例1〕 第1磨石顆粒群5的磨石顆粒,分別採用相當於粒度 爲#120/11 40的1 50〜170 // m的範圍之鑽石磨石顆粒50、 及相當於粒度# 3 2 5 /#4 00的 55〜65//m的範圍之鑽石磨石 顆粒5 1,藉由使這些的磨石顆粒50、5 1與保持材52反 應燒結,因而獲得磨石顆粒50、51保持在保持材52的燒 結體。 此時,在於磨石顆粒排列面,以包含粒度#120/# 140 的磨石顆粒50的前端之平面與包含粒度#3 2 5/#4〇0的磨石 顆粒5 1的前端之平面的高低差爲4 0〜6 0 // m的方式來排 列上述2種磨石顆粒50、51,並且鄰接的磨石顆粒50、 5 1彼此間所組成的最小格子爲正三角形,以粒度 #1 20/# 140的磨石顆粒50之間隔爲2.0mm的等間隔,粒 度# 3 2 5 /#400的磨石顆粒51間隔爲〇.4mm的等間隔的方 > 15- χ228〇66 (13) 式來排列上述2種磨石顆粒5 Ο、5 1。 此外,作爲第2磨石顆粒群6的磨石顆粒係採用相 當於粒度# 6 0 /# 8 0之2 5 0〜3 2 0 // m的範圍之鑽石磨石顆粒 ’將這些磨石顆粒以間隔爲〇 . 8 m m的等間隔的方式來加 以排列。 然後,經此方式所得到的燒結體經由機械加工來加工 成預定的尺寸/形狀,而形成第1磨石顆粒群5及第2 磨石顆粒群6後,將這些的磨石顆粒群5、6用環氧樹脂 分別接著在調節機構7上之S U S 3 1 6 L不銹鋼製的直徑$ 1 OOmm的基台7a。然而’本實施例中,將上述第1磨石 顆粒群5及第2磨石顆粒群6的平面形狀製作成如第1 〇 圖所示的與修整面4的周緣成一定角度的螺旋片形狀。 經此方式所作成之硏磨布用修整器以1 9.6 kPa的壓力 押接到以]0 0 r p m旋轉之發泡聚胺醋製硏磨布,與該硏磨 布朝相同方向以80rpm旋轉,則同時一面以每分25ml供 應含有燻製二氧化砂(f u m e d s i 1 i c a )的硏磨漿劑(臼本 卡伯特 <譯音 >製SS - 25 ),一面進行硏磨布的硏削。 此時’將前述修整面4之對於前述第1磨石顆粒群5 的磨石顆粒前端基準面S 1與前述第2磨石顆粒群6的磨 石顆粒前端基準面S 2的金屬台表_ 3之高低差$,利用 上述調節機構7來調節成1 5、3 0、6 〇 // m的3程度,測 定修整速度(硏磨布的磨耗速度)及硏磨布的面狀態(硏 磨布的面粗度)後,測定用該硏磨布的晶圓硏磨速度,將 這些測定結果顯示在表1中。 -16- (14) 1228066 然而,在本實施例之中,η數即是樣本數爲20,算出 各樣本已被測定之上述各測定値的平均値(AVe ),顯示 在表1中。 然後,表1中σ 表示各測定結果的標準偏差。另 外,晶圓硏磨速度的測定,使用 ADE公司製的晶圓平坦 度測定器(Ultra gauge9 8 0 ),從硏磨前後的測定結果來 算出平均硏磨速度。 · 〔表1〕 實施例 磨石顆 第1磨石: #120/#140 2.0mm 粒間隔、\ 顆粒群.: #320/#400 0.4mm 第2磨石: 顆粒群 #60/#80 0.8 m'm 顆粒基準面之高低差(5 15 3 0 60 硏磨布磨耗速度 A v e. 69.2 108 12 (μ. m / Η ο υ r ) 〇 η - I 1 η o 1 . J J K 2 5 · 1.78 硏磨葙面粗度 A v e · 4.12 4.05 4.19 R a ( // m ) 〇 n - 1 0.12 0.15 0.14 晶圓硏磨速度 A v e . 126 129 12 1 (n m / m i n ) 〇 n - 1 6.7 7.2 5.6 傷痕發生率(%) 0.00 0.0 0 0.0 0 如這個表]所示,依據本發明的硏磨布用修整器,調 -17- 1228066 (15) 節複數個磨石顆粒群之磨石顆粒的粒度或各磨石顆粒群基 準面間的高低差5,就能將修整面調節成所期望的狀態, 特別是利用上述磨石顆粒群的基準面間高低差6得知磨耗 速度有很大的差。因而’利用1片硏磨布用修整器,就能 在種種的條件下穩定地進行硏磨布的修整。 另外,依據上述實施例的測量値’得知比以下說明之 比較例的測定側還提升全體性地性能’而且各種測定値的 標準偏差非常小,所以得知所取得的硏磨布極小偏差,對 於硏磨布用修整器賦予穩定的硏磨性能。 〔比較例1〕 採周過去的CMP硏磨布修整器,該CMP硏磨布修 整器是在磨石顆粒間隔排列成〇 . 2 5 m m的等間隔的狀態下 ,利用鎳電塗膜來固定相當於粒度#80/#1 00之:2·ι 〇〜2 5 0 μ m的範圍之鑽石磨石顆粒所構成,在與實施例1相同的條 件下,硏削發泡聚胺酯製硏磨布。其硏削結果顯示在表2 中。 〔比較例2〕 採用硏磨布用修整器,該硏磨布修整器是在於燒結體 的磨石顆粒排列面,相鄰的第1磨石顆粒彼此間所組成的 最小格子爲正三角形,以其一邊的磨石顆粒間隔爲2 . 1 m m 的等間隔的方式來排列相當於粒度#120〜#140之150〜170 "出的範圍之鑽石磨石.顆粒,由該磨石顆粒所形成之磨石 -18- 1228066 (16) 顆粒群的平面形狀,如第2C圖所示,形成爲與 周緣成平行之圓環片形狀,在與實施例丨相同的條 硏削發泡聚胺酯製硏磨布。其硏削結果與比較例i 不在表2中。 〔比較例3〕 與實施例1的第].磨石顆粒群同樣地,分別 當於粒度# 1 2 0 /# 1 4 〇之1 5 0〜1 7 0 // m的範圍之鑽石 粒一、及相當於粒度# 3 2 5 / # 4 0 0之 5 5〜6 5 // m的範圍 磨石顆粒。然後,在於燒結體的磨石顆粒排列面, 度爲#120/# M0的磨石顆粒的前端之平面與包含 # 3 2 5 ^400的磨石顆粒的前端之平面的高低差爲4〇| ’並且鄰接的磨石顆粒彼此間所組成的最小袼子爲 形,粒度#120/# 140的磨石顆粒的間隔爲2.0mm的 來排列上述這些磨石顆粒。然後,用硏磨布用修整 硏磨布用修整器是具有如此的磨石顆粒排列之磨石 ,形成爲如第2 C圖所示的與修整面的周緣成平行 片形狀’沿著修整面之金屬台的周緣部而呈環狀並 所構成,在與實施例].相同的條件下,硏削發泡聚 硏磨布。其硏削結果與比較例]、2 —起顯示在表2 整面的 件下, —起顯 採用相 磨石顆 之鑽石 包含粒 粒度爲 ~ 6 0 β m 正三角 等間隔 器,該 顆粒群 之圓環 排設置 胺酯製 中 。 -19- 1228066 (17) 〔表2〕 —---—-------^ 比較例1 比較例2 比較例3 _ 鑽石粒度 —-^ #80/#100 #120/#140 Φ #120/#140 ② #325/#4〇〇 磨石顆粒間隔 _ ___一 0.25mm 2.1mm φ 2 · 1 mm ② 0.4mm -------^ 磨石顆粒保持方法 電塗膜 燒結 硏磨布的磨耗速度 A v e . 6 1.6 1 8 9 13 8 _ (tu m / Η ο u r ) σ n丄 7.84 14.6 2.43 硏磨布的面粗度 _______ 3.0 1 3.32 3.45 R a ( β m ) 〇 Π -J, 0.3 6 0.3 6 0.13 晶_硏磨速度 △ V 6 . 105 98.3 120 (n m i m i n ) 〇 n - 35.2 25.3 9.6 傷痕發生率(%) 0.52 0.00 0.0 0Specifically, the first grindstone particle group 5 is not formed by the grindstone particles 50 and 51 of two sizes, as shown in Figs. 5 and 6, and these grindstone particles 50 and 51 are as shown in Figs. As shown in FIG. 5, the smallest grid formed by the adjacent grinding stone particles on the bombarding surface of the abutment 7 a is the two-dimensional and regular equal arrangement on the trimming surface 4. Regular triangles or parallelograms. However, the larger grindstone particles 50 are spaced apart from each other, and the smaller grindstone particles 51 are spaced apart from each other. In this way, the grindstone particles of two sizes can be arranged uniformly and regularly to make the dressing. The stability or uniformity is improved. In addition, the second grindstone particle group 6 is formed of one of a plurality of grindstone particles having the same particle size as that of the grindstone particles having a particle size different from that of the grindstone particles of the first grindstone particle group 5. It is also possible, but similar to the first grindstone particle group 5, it is desirable that the grindstone particles are arranged uniformly in a two-dimensional and regular manner. Here, for the grindstone particles forming the grindstone particle groups 5 and 6, for example, diamond grindstone particles can be used. The particle size of the grindstone particles is generally expected to be in the size specified by • Π SB 4 〖3 0 # 3 2 5 / # 4 0 0 to # 6 0 / # 8 0. In addition, 'the grinding stone particles forming the first grinding stone particle group 5 are not necessary to use the grinding stone particles 2 and 5 of two kinds of granularity, even if the grinding stone particles of the same particle size are used (refer to 2A ~ 2D image embodiment). In addition, the above-mentioned adjustment mechanism 7 need not necessarily be provided on both the first millstone particles -11-1228066 (9) both the grain group 5 and the second millstone particle group 6, and only on a part of the millstone particle group, That is, it may be provided only on the first grindstone particle group 5 or the second grindstone particle group 6. In this case, the grindstone particles of the adjustment mechanism 7 are not provided, and the abutment 7 a is directly fixed to the peripheral portion of the metal table 2. In this way, if different grindstone particles of different grindstone particle groups are used, or different sizes of grindstone particles are mixed in each grindstone particle group, the larger grindstone particles are mainly used to help The abrasiveness of the honing cloth, the smaller size of the grindstone particles help to adjust the surface roughness of the honing cloth. By adjusting these particle sizes, the surface roughness of the honing cloth can be made into a specific object for CMP processing. status. Furthermore, as shown in FIGS. 1A to 1D, in the dresser for honing cloth], the planar shape of the first grindstone particle group 5 and the second grindstone particle group 6 can be changed from a small circular shape to the metal The peripheral edge of the table 2 is a ring piece shape parallel to the peripheral edge of the dressing surface 4, and the peripheral edge of the metal table 2 is a spiral piece shape that forms an angle with the peripheral edge of the dressing surface 4. Fig. 1A shows a case where both of the millstone particle groups 5, 6 are small circles. Fig. B shows a case where the first grindstone particle group 5 has a small circular shape and the second grindstone particle group has a spiral plate shape. Fig. 1C shows a case where the two grindstone particle groups 5, 6 are in the shape of a ring plate. Fig. 10 shows a case where both of the millstone particle groups 5, 6 are in the shape of a spiral sheet. The grindstone particles 5 and 6 formed in a flat shape are arranged in a ring shape along the surface 3 of the metal table 2 along the periphery of the metal table 2 and are removed by trimming the trimming surface 4. The cuttings or agglomerated slurry of the honing cloth can be easily discharged to the outside of the dresser, and the discharge performance can be adjusted -12-1228066 (10). However, as shown in FIG. 3 and FIG. 6, the above-mentioned grindstone particle groups 5 and 6 are formed by holding the grindstone particles by the holding material 52. The holding material 5 2 is fixed on the surface of the abutment 7 a of the adjustment mechanism 7, and the grindstone particle groups 5 and 6 are fixed on the abutment 7 a ± 〇 When the grindstone particles as the holding material 5 2 are diamonds Although silicon and / or silicon alloys that are sintered by reacting with diamond millstone particles can be used, there is no particular limitation if it is a retaining material suitable for retaining the millstone particles, and ordinary nickel electrocoating films or welding materials can also be used. Combined to keep. Next, a description will be given of a method for dressing a honing cloth by the honing cloth dresser 1 described above. The first grindstone particle group 5 and the second grindstone particle group 6 which are adjacent to each other by the adjustment mechanism 7 will be described. Between each of the reference planes S1 and S2, a certain height difference (5) to the metal table surface 3 is set (5, and the honing cloth is trimmed. In other words, the first grinding stone particle group 5 is adjusted by using the adjustment mechanism 7 described above. The reference plane S 1 is higher than the reference plane s 2 of the second grindstone particle group 6 and is also adjusted in the vertical direction of the metal table surface 3 by an amount δ, and the trimming surface 4 is appropriately adjusted. State, the surface of the honing cloth can be trimmed to the desired state of the workpiece. In this way, according to the dresser for honing cloth described above, since the height difference between the reference planes S1 and S2 (5, The condition of the dressing pad 4 is adjusted so that the desired cutting performance can be exhibited. Therefore, even if there is an individual difference in the condition of the dressing surface 4, not only can the uniform honing cloth surface be created, but also the surface of the dressing cloth can be applied. Appropriate honing performance for the workpiece -13- 1228066 (11) Figures 2A to 2D are the second embodiment showing different arrangement shapes of the grindstone particle group of the honing cloth dresser of the present invention. In this embodiment, the honing cloth dresser 1 Among them, a plurality of grindstone particle groups are formed only by the first grindstone particle group 5 described above, and the same grindstone particle groups 5 are arranged side by side along the periphery of the metal table 2 to form a trimmed surface 4 In addition, the planar shape of the grindstone particle group 5 can be changed from a small circular shape, a circular ring shape parallel to the peripheral edge of the trimming surface 4, and a peripheral edge of the trimming surface 4 as in the case of the first embodiment. The shape of the spiral plate at a certain angle is selected. Fig. 2A shows the case where the grindstone particle group 5 is all in a small circle shape. Fig. 2B shows the grindstone particle group 5 is a small circle shape and a spiral plate shape. Two different planar shapes of the grindstone particle group 5 are alternately arranged side by side in the circumferential direction of the dressing surface 4. Fig. 2C shows the case where the grindstone particle group 5 is all in the shape of a ring. Fig. 2D is All millstone particle groups 5 are spiral Of the shape of the sheet. 1 Since the other configuration including the adjustment mechanism 7 is common to the first embodiment described above, the description will be omitted in order to avoid repetition. Then, the above-mentioned dressing device for honing cloth 1 is trimmed. As shown in FIG. 4, the honing cloth is adjusted by the adjusting mechanism 7 between the reference surfaces S of the above-mentioned grindstone particle group 5 alternately to a certain height difference (5 to trim the metal table surface 3). According to the above-mentioned dresser 1 for honing cloth, since it is the same as the dresser 1 for honing cloth, the height difference δ between the reference surfaces S 1 of the adjacent grindstone particle groups 5 can be adjusted appropriately. The state of surface 4 is adjusted to the desired state -14-1228066 (12) Even if there is an individual difference in the condition of trimming surface 4, not only can it create a uniform honing cloth surface, but it can also correspond to the surface of the honing cloth. Appropriate honing properties of the work are applied to the surface of the honing cloth. However, the configuration of the main body of the above-mentioned adjustment mechanism 7 is not limited to the above-mentioned configuration described with reference to the drawings, and various mechanisms that can adjust the reference surface of the grindstone particle group up and down within a fine range can also be adopted. Hereinafter, examples and comparative examples of the dresser for a honing cloth of the present invention and the dressing method used therefor will be specifically described. It is only that the present invention is not limited in any way by these embodiments. [Example 1] As the grinding stone particles of the first grinding stone particle group 5, diamond grinding stone particles 50 corresponding to a size ranging from 1 50 to 170 // m with a particle size of # 120/11 40 and a particle size equivalent to # 3 2 5 / # 4 00 The diamond grindstone particles 51 in the range of 55 to 65 // m are obtained by reacting and sintering these grindstone particles 50 and 51 with the holding material 52, thereby obtaining the grindstone particles 50, 51 is held in the sintered body of the holding material 52. At this time, on the grinding stone particle arrangement surface, the plane including the front end of the grinding stone particles 50 with the particle size # 120 / # 140 and the plane including the front end of the grinding stone particles 51 with the particle size # 3 2 5 / # 4〇0 The height difference is 4 0 ~ 6 0 // m to arrange the above two kinds of grinding stone particles 50, 51, and the smallest grid composed of adjacent grinding stone particles 50, 5 1 is a regular triangle, with a size of # 1 20 / # 140 millstone particles 50 are spaced at equal intervals of 2.0mm, and grain size # 3 2 5 / # 400 millstone particles 51 are spaced at equal intervals of 0.4mm.> 15- χ228〇66 (13 ) To arrange the two kinds of grinding stone particles 5 0 and 5 1. In addition, the grindstone particles as the second grindstone particle group 6 are diamond grindstone particles corresponding to a particle size # 6 0 / # 8 0 of 2 5 0 to 3 2 0 // m. Arranged at equal intervals of 0.8 mm. Then, the sintered body obtained in this way is processed into a predetermined size / shape by machining to form the first grindstone particle group 5 and the second grindstone particle group 6, and then these grindstone particle groups 5, An epoxy resin is attached to the abutment 7a of SUS 3 1 6 L stainless steel with a diameter of 100 mm on the adjusting mechanism 7 respectively. However, in this embodiment, the planar shapes of the first grindstone particle group 5 and the second grindstone particle group 6 are made into a spiral sheet shape at a certain angle to the peripheral edge of the trimming surface 4 as shown in FIG. 10. . The honing cloth made in this way was pressed with a dresser at a pressure of 19.6 kPa to a foamed polyurethane vinegar honing cloth rotating at 0 0 rpm, and the honing cloth was rotated in the same direction at 80 rpm. At the same time, a honing slurry containing fumedsi 1 ica (Usmoto Cabot < transliteration > SS-25) was supplied at 25 ml per minute while honing cloth was honing. At this time, 'the metal table of the aforementioned trimming surface 4 with respect to the grinding stone particle front end reference surface S 1 of the first grinding stone particle group 5 and the aforementioned grinding stone particle front end reference surface S 2 of the second grinding stone particle group 6_ The height difference of 3 $ is adjusted by using the above-mentioned adjustment mechanism 7 to a degree of 15, 30, 60 // m, and the dressing speed (abrasion rate of the honing cloth) and the surface state of the honing cloth (honing) are measured. The surface roughness of the cloth was measured. Then, the honing speed of the wafer using the honing cloth was measured, and these measurement results are shown in Table 1. -16- (14) 1228066 However, in this example, the number η is the number of samples of 20, and the average 値 (AVe) of each of the above-mentioned measurement 値 (AVe) in which each sample has been measured is calculated and shown in Table 1. In Table 1, σ indicates the standard deviation of each measurement result. The wafer honing speed was measured using a wafer flatness tester (Ultra gauge 9 8 0) manufactured by ADE, and the average honing speed was calculated from the measurement results before and after honing. · [Table 1] Example grinding stone: The first grinding stone: # 120 / # 140 2.0mm granular interval, \ particle group .: # 320 / # 400 0.4mm second grinding stone: particle group # 60 / # 80 0.8 m'm particle reference level difference (5 15 3 0 60 honing cloth abrasion speed A v e. 69.2 108 12 (μ. m / Η ο υ r) 〇η-I 1 η o 1. JJK 2 5 · 1.78 Honing surface roughness Ave · 4.12 4.05 4.19 R a (// m) 〇n-1 0.12 0.15 0.14 Wafer honing speed Ave. 126 129 12 1 (nm / min) 〇n-1 6.7 7.2 5.6 Occurrence rate of scratch (%) 0.00 0.0 0 0.0 0 As shown in this table], according to the dresser for honing cloth according to the present invention, adjust -17-1228066 (15) section of the grinding stone particles of a plurality of grinding stone particles. The particle size or the height difference between the reference surfaces of each grindstone particle group 5 can adjust the trimmed surface to the desired state. In particular, using the above-mentioned height difference between the reference surfaces of the grindstone particle group 6 shows that the wear rate is very large. Poor. "With a dresser for one honing cloth, the honing cloth can be trimmed stably under various conditions. In addition, according to the measurement of the above embodiment, the ratio is known. The measurement side of the comparative example described below also improves the overall performance. Moreover, the standard deviation of various measurement grates is very small. Therefore, it is known that the obtained honing cloth has a very small deviation, and it has a stable honing performance for the honing cloth dresser. [Comparative Example 1] A CMP honing cloth dresser used in the past of the harvesting week. The CMP honing cloth dresser used nickel electrocoating film to form a regular interval of 0.25 mm between the grindstone particles. It is composed of diamond grinding stone particles with a particle size of # 80 / # 1 00 in the range of 2 μm to 2 50 μm, and honing of foamed polyurethane under the same conditions as in Example 1 The honing results are shown in Table 2. [Comparative Example 2] A honing cloth dresser was used. The honing cloth dresser was on the arranging surface of the grindstone particles of the sintered body, and the adjacent first grindstone particles The smallest lattice formed by each other is a regular triangle, and the diamonds with a grain size of # 120 ~ # 140 in the range of 150 ~ 170 " are arranged in an equal interval such that the grinding stone particles on one side are 2.1 mm apart. Grinding stones. Grinding stones formed by the grindstone particles-18- 1228066 (16) As shown in FIG. 2C, the planar shape of the particle group is formed into a circular plate shape parallel to the periphery, and the foamed polyurethane honing cloth is cut in the same strip as in Example 丨. The cutting results and Comparative Example i are not shown in Table 2. [Comparative Example 3] As in the first example of Example 1. Millstone particle groups, respectively, diamond particles corresponding to a particle size # 1 2 0 / # 1 4 〇 of 1 50 to 1 7 0 // m range And millstone particles in the range of 5 to 6 5 // m corresponding to particle size # 3 2 5 / # 4 0 0. Then, in the arranging surface of the grindstone particles of the sintered body, the height difference between the plane of the front end of the grindstone particles with a degree of # 120 / # M0 and the plane of the front end of the grindstone particles including # 3 2 5 ^ 400 is 40%. 'And the smallest grindstones formed by the adjacent grindstone particles are shaped, and the grindstone particles with a size of # 120 / # 140 are spaced 2.0 mm apart to arrange these grindstone particles. Then, the dresser for dressing with a honing cloth is a grindstone having such a grindstone particle arrangement, and is formed into a parallel sheet shape with the periphery of the dressing surface as shown in FIG. 2C along the dressing surface. The peripheral edge portion of the metal table is formed in a ring shape, and under the same conditions as in Example]. Its cutting results and comparative examples], 2-are shown under the entire surface of Table 2,-diamonds using phase grind stones have been shown to include regular triangle equal spacers with a grain size of ~ 60 β m, the particle group The ring row is set in the urethane system. -19- 1228066 (17) [Table 2] —----------- ^ Comparative Example 1 Comparative Example 2 Comparative Example 3 _ Diamond Size —- ^ # 80 / # 100 # 120 / # 140 Φ # 120 / # 140 ② # 325 / # 4〇〇 Millstone particle interval _ _ 0.25mm 2.1mm φ 2 · 1 mm ② 0.4mm ------- ^ Grinding stone particle retention method Electrocoating film sintering Wear rate of honing cloth Ave. 6 1.6 1 8 9 13 8 _ (tu m / Η ο ur) σ n 丄 7.84 14.6 2.43 Face roughness of honing cloth _______ 3.0 1 3.32 3.45 R a (β m) 〇Π -J, 0.3 6 0.3 6 0.13 Crystal_Honing Speed △ V 6. 105 98.3 120 (nmimin) 〇n-35.2 25.3 9.6 Injury rate (%) 0.52 0.00 0.0 0

【圖式簡單說明】 第】A〜1 D圖爲表系本發明的硏磨布用修整器之磨石 顆粒群的不同配置形狀的第1實施形態之立體圖。 第2 A〜2〇圖爲表禾本發明的硏磨布周修整器之磨石 顆粒群的不同配置形狀的第2實施形態之立體圖。 弟3圖爲第1圖中的ΠΙ— 線之剖面Η。 第4圖爲第2圖中的IV — IV線之剖面圖。 第5圖爲表示第1磨石顆粒群5之磨石顆粒的排列狀 態之槪略圖。 - 20- 1228066 (18) 第6圖爲第3圖的部分擴大圖 元件對照表 1 :硏磨布用修整器 2 :金屬台 3 :金屬台表面 4 :修整面 5,6 :磨石顆粒群 7 :調節機構 7 a · 碁台 7 b :調節用螺絲 7c :螺絲孔 7d :間隔件 7 e :凹部 8 :粘合劑 ]0 :硏磨布用修整器 50,51 :磨石.顆粒. 52 :保持材 5 1、S2 :基準面 δ :高低差[Brief description of the drawings] Sections A to 1D are perspective views of the first embodiment of different arrangement shapes of the grindstone particles of the dresser for a honing cloth of the present invention. Figures 2A to 2O are perspective views of a second embodiment of different arrangement shapes of the grindstone particles of the honing cloth peripheral dresser of the present invention. Figure 3 is the cross section Π of the line II- in Figure 1. Fig. 4 is a cross-sectional view taken along the line IV-IV in Fig. 2. Fig. 5 is a schematic view showing the arrangement state of the grindstone particles of the first grindstone particle group 5. -20- 1228066 (18) Figure 6 is a partially enlarged view of Figure 3. Component comparison table 1: Dresser for honing cloth 2: Metal table 3: Metal table surface 4: Dressing surface 5, 6: Grinding stone particle group 7: Adjusting mechanism 7a. 碁 7b: Adjusting screw 7c: Screw hole 7d: Spacer 7e: Recess 8: Adhesive] 0: Dresser for honing cloth 50, 51: Grinding stone. Particles. 52: Holding material 5 1, S2: Reference surface δ: Height difference

Claims (1)

1228066 (υ 拾、申請專利範圍 1 . 一種硏磨布用修整器,是在可旋轉的金屬台的表 面形成有修整面之硏磨布用修整器,其特徵爲: 在上述修整面,朝其周方向並排設置有複數個磨石顆 粒群, 在上述金屬台,設置有能調節全部或一部分的磨石顆 粒群中以多數個磨石顆粒的前端所分別形成的基準面之上 述修整面的高低差之調節機構。 2 .如申請專利範圍第1項之硏磨布用修整器,其中 具有上述調節機構之磨石顆粒群,分別被固著在構成與上 述金屬台不同體所形成的上述調節機構的基台上,沿著上 述修整面之金屬台的周緣部而呈環狀並排設置有各磨石顆 粒群。 3 .如申請專利範圍第1項之硏磨布用修整器,其中 上述磨石顆粒群分別形成爲從與上述修整面的周緣成平行 之圓環片彤狀、與上述修整面的周緣成一定角度之螺旋片 形欣、小圓形狀當中所選出之1種或2種的平面形狀。 4.如申請專利範圍第3項之硏磨布用修整器,其中 上述磨石顆粒群分別形成爲從上述平面形狀當中所選出的 2種的平面形狀, · 這些平面形狀不同的2種磨石顆粒群朝修整面的周方 向交互地並排設置。 5 .如申請專利範圍第1或2項之硏磨布用修整器, 其中並排設置在修整面之各磨石顆粒群係相互地利用相同 -22 - 1228066 (2) 粒度的磨石顆粒來形成之磨石顆粒群、或是利用不同粒度 的磨石顆粒所形成之2種磨石顆粒群所構成。 6. 如申請專利範圍第5項之硏磨布用修整器,其中 並排設置在修整面之磨石顆粒群係相互地利用不同粒度的 磨石顆粒來形成之第1磨石顆粒群和第2磨石顆粒群所構 成, 這些第1磨石顆粒群.和第2磨石顆粒群,朝修整面的 周方向交互地並排設置。 7. 如申請專利範圍第6項之硏磨布用修整器.,其中 上述第].磨石顆粒群,利用相同粒度的磨石顆粒或2種粒 度的磨石顆粒來形成。 8 .如申請專利範圍第1或2項之硏磨布用修整器, 各磨石顆粒群,分別都是在於前述修整面上以2次元且有 規則地排列有磨石顆粒,且以正三角形或平行四邊形來並 排設置有相互地相鄰的磨石顆粒彼此間所組成的最小格子 c 9. 一種硏磨布的修整方法,是採用申請專利範權第 1、2、3、4、5、6、7或8項的任1項之硏磨布用修整器 的砑磨布之修整方法,其特徵爲: 藉由上述調節機搆,在相互地相鄰之磨石顆粒群的上 述基準面間設置一定的高低差,而將上述硏磨布修整。 1 〇 . —種硏磨布之修整方法,是採用申請專利範圍第 6、7或8項的任1項之硏磨布用修整器而將硏磨布修整 的方法,其特.徵爲: -23- 1228066 (3) 利用上述調節機來調節使上述修整面之第1磨石顆粒 群的基準面的高度比第2磨石顆粒群的基準面的高度還高 出一定量的方式,而將上述硏磨布修整。1228066 (υ, patent application scope 1. A dresser for honing cloth, which is a dresser for honing cloth with a dressing surface formed on the surface of a rotatable metal table, characterized in that: A plurality of grindstone particle groups are arranged side by side in the circumferential direction. The metal table is provided with a height that can adjust the reference surface formed by the front ends of a plurality of grindstone particles in all or part of the grindstone particle groups. Poor adjustment mechanism 2. As for the dresser for honing cloths according to item 1 of the scope of patent application, the grindstone particles having the above-mentioned adjustment mechanism are respectively fixed to the above-mentioned adjustment formed by forming a different body from the above-mentioned metal table. Each grinding stone particle group is arranged side by side along the peripheral edge of the metal table of the dressing surface on the base of the mechanism. 3. The dresser for honing cloths, such as the item 1 of the patent application scope, wherein the above grinding The stone particle groups are respectively formed from a ring-shaped sheet that is parallel to the periphery of the above-mentioned trimmed surface and a spiral-shaped sheet that is at an angle to the periphery of the above-mentioned trimmed surface. One or two kinds of planar shapes. 4. For the dresser for honing cloths according to item 3 of the patent application scope, wherein the grinding stone particle groups are respectively formed into two kinds of planar shapes selected from the above-mentioned planar shapes, · These two types of grindstone particles with different plane shapes are alternately arranged side by side in the circumferential direction of the dressing surface. 5. For example, the dresser for honing cloths in the scope of patent application No. 1 or 2 is arranged side by side on each of the dressing surface. The grindstone particle group is composed of two kinds of grindstone particle groups formed by grindingstone particles of the same -22-1228066 (2) grain size, or two kinds of grindstone particle groups formed by grinding stone particles of different particle sizes. 6. For the dresser for honing cloths, such as the scope of application for patent No. 5, in which the grindstone particle groups arranged side by side on the dressing surface use the grindstone particles of different particle sizes to form the first grindstone particle group and the second grindstone particle group The first grindstone particle group and the second grindstone particle group are alternately arranged side by side in the circumferential direction of the dressing surface. 7. For a dresser for honing cloth, such as in item 6 of the scope of patent application ., Of which above]]. 磨The particle group is formed by using the same size grindstone particles or two types of grindstone particles. 8. If the dresser for honing cloth is applied for item 1 or 2 of the patent application scope, each of the grindstone particle groups is On the aforementioned trimming surface, millstone particles are regularly and regularly arranged in a two-dimensional manner, and a minimum lattice c formed by mutually adjacent millstone particles is arranged side by side in a regular triangle or a parallelogram. 9. A honing cloth The trimming method is a trimming method for a honing cloth using a trimmer for a honing cloth according to any one of the patent application claims No. 1, 2, 3, 4, 5, 6, 7, or 8, which is characterized by: By the adjustment mechanism, a certain height difference is set between the reference surfaces of the grindstone particle groups adjacent to each other, so that the honing cloth is trimmed. 1 〇. — A honing cloth dressing method is a method for dressing a honing cloth by using a honing cloth dresser for any one of the items 6, 7 or 8 of the scope of application for a patent. Its characteristics are as follows: -23- 1228066 (3) Use the aforementioned regulator to adjust the height of the reference surface of the first grinding stone particle group of the trimming surface to be higher than the reference surface of the second grinding stone particle group by a certain amount, and Trim the above honing cloth. - 24-- twenty four-
TW092124643A 2002-09-09 2003-09-05 Abrasive cloth dresser and method for dressing an abrasive cloth with the same TWI228066B (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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Families Citing this family (55)

* Cited by examiner, † Cited by third party
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US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
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US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US20110275288A1 (en) * 2010-05-10 2011-11-10 Chien-Min Sung Cmp pad dressers with hybridized conditioning and related methods
US20140120724A1 (en) * 2005-05-16 2014-05-01 Chien-Min Sung Composite conditioner and associated methods
US20140120807A1 (en) * 2005-05-16 2014-05-01 Chien-Min Sung Cmp pad conditioners with mosaic abrasive segments and associated methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US20170232576A1 (en) * 2006-11-16 2017-08-17 Chien-Min Sung Cmp pad conditioners with mosaic abrasive segments and associated methods
JP2008229820A (en) * 2007-03-23 2008-10-02 Elpida Memory Inc Dresser for cmp processing, cmp processing device, and dressing treatment method of polishing pad for cmp processing
JP5194516B2 (en) * 2007-03-30 2013-05-08 富士通セミコンダクター株式会社 Management method for chemical mechanical polishing equipment
JP5002353B2 (en) * 2007-07-05 2012-08-15 シャープ株式会社 Chemical mechanical polishing equipment
CN101878094A (en) * 2007-09-28 2010-11-03 宋健民 CMP pad conditioners with mosaic abrasive segments and associated methods
CN101903131B (en) 2007-11-13 2013-01-02 宋健民 CMP pad dressers
US9011563B2 (en) 2007-12-06 2015-04-21 Chien-Min Sung Methods for orienting superabrasive particles on a surface and associated tools
KR100954225B1 (en) * 2008-01-30 2010-04-21 주식회사 디어포스 Ring-shaped grinding article
JP5255860B2 (en) * 2008-02-20 2013-08-07 新日鉄住金マテリアルズ株式会社 Polishing cloth dresser
TWI380878B (en) * 2009-04-21 2013-01-01 Sung Chien Min Combined Dressing Machine and Its Making Method
KR101148934B1 (en) * 2009-06-19 2012-05-22 치엔 민 성 Combination type dresser
TWI383860B (en) * 2009-06-19 2013-02-01 Chien Min Sung Modular dresser
JP2012130995A (en) * 2010-12-22 2012-07-12 Nitta Haas Inc Dresser
ITMI20110850A1 (en) * 2011-05-16 2012-11-17 Nicola Fiore MULTI-ABRASIVE TOOL
CN103329253B (en) 2011-05-23 2016-03-30 宋健民 There is the CMP pad dresser at planarization tip
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JP6176671B2 (en) * 2014-11-19 2017-08-09 旭精機工業株式会社 Grinding equipment
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WO2017217108A1 (en) * 2016-06-13 2017-12-21 バンドー化学株式会社 Abrasive
JP2018034257A (en) * 2016-08-31 2018-03-08 信越半導体株式会社 dresser
US10471567B2 (en) * 2016-09-15 2019-11-12 Entegris, Inc. CMP pad conditioning assembly
MX2020003717A (en) * 2017-10-04 2020-12-09 Saint Gobain Abrasives Inc Abrasive article and method for forming same.
TWI681843B (en) * 2017-12-01 2020-01-11 詠巨科技有限公司 Method for conditioning polishing pad
CN108188933A (en) * 2017-12-24 2018-06-22 哈尔滨秋冠光电科技有限公司 A kind of structure and its manufacturing method of the trimming device of chemical mechanical polishing pads
KR102555813B1 (en) * 2018-09-27 2023-07-17 삼성전자주식회사 Pad conditioning disk
CN110561272A (en) * 2019-10-23 2019-12-13 无锡市兰天金刚石有限责任公司 Superhard tool for dressing grinding wheel and preparation method thereof
JP2023504283A (en) * 2020-01-06 2023-02-02 サンーゴバン アブレイシブズ,インコーポレイティド Abrasive article and method of use thereof
CN111203800B (en) * 2020-02-20 2021-11-05 长江存储科技有限责任公司 Grinding pad dresser and chemical mechanical grinding equipment
TWI768692B (en) * 2021-02-01 2022-06-21 中國砂輪企業股份有限公司 Chemical mechanical polishing pad dresser and method of making the same
CA3218593A1 (en) * 2021-05-27 2022-12-01 Josh KINSEY Polishing brush system
CN113635228B (en) * 2021-09-03 2022-07-01 郑州磨料磨具磨削研究所有限公司 Self-dressing grinding wheel for processing semiconductor material and preparation method and application thereof
WO2023055649A1 (en) * 2021-09-29 2023-04-06 Entegris, Inc. Double-sided pad conditioner

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5547417A (en) * 1994-03-21 1996-08-20 Intel Corporation Method and apparatus for conditioning a semiconductor polishing pad
US6196911B1 (en) * 1997-12-04 2001-03-06 3M Innovative Properties Company Tools with abrasive segments
TW383644U (en) * 1999-03-23 2000-03-01 Vanguard Int Semiconduct Corp Dressing apparatus
JP3527448B2 (en) * 1999-12-20 2004-05-17 株式会社リード Dresser for CMP polishing cloth and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451942B (en) * 2010-09-21 2014-09-11 Ritedia Corp Superabrasive tools having substantially leveled particle tips and associated methods
TWI608904B (en) * 2013-10-17 2017-12-21 Shin Etsu Handotai Co Ltd Trimming device for polishing polyurethane foam pad
US9981361B2 (en) 2013-10-17 2018-05-29 Shin-Etsu Handotai Co., Ltd. Apparatus for dressing urethane foam pad for use in polishing

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