JP2012213833A - Sintered body for pad conditioning and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sintered body for pad conditioning which can obtain a polishing tool for conditioning a CMP polishing pad which polishes the surface of a semiconductor material for LSI etc. of an ultra high-density wiring rule of 0.35 μm rule or lower, and its manufacturing method.SOLUTION: The sintered body for polishing with polishing units aligned on a polishing surface of a super-abrasive sintered body processes the surface of the super-abrasive sintered body by laser cutting, thereby the polishing units can be formed precisely while maintaining sharp edges, and with its high density polishing unit lines, the polishing tool for conditioning the CMP polishing pad which polishes the surface of the semiconductor material for LSI etc. can be provided. From a material of the round super-abrasive sintered body, two polishing patches are cut out from a regular hexagon positioned at the center of a circular form and six polishing patches are cut out from six similar material pieces positioned outside the regular hexagon. Corners of the patches are rounded so as not to damage the polished material during the polishing.

Description

  The present invention relates to a polishing sintered body for a tool having a sintered body polishing portion and a method for manufacturing the same. In particular, the present invention provides a pad for a chemical-mechanical polishing (abbreviated as CMP) pad composed mainly of hard urethane or non-woven fabric for polishing the surface of various semiconductor materials, the disk surface of a hard disk, etc. The present invention relates to a polishing sintered body suitable for use in conditioning and a method for producing the same.

  In recent years, CMP has been used to flatten interlayer insulating films and metal film wafers such as silicon as wiring of multilayered VLSI devices progresses, and to flatten the disk surface of hard disks as the density of hard disks increases. It has been used. In order to maintain a high level of a polishing pad (generally made of rigid foamed polyurethane or non-woven fabric) used in CMP and to maintain a wafer polishing rate, it is necessary to condition the surface of the polishing pad constantly or intermittently.

  In the manufacturing process of memory chips and other LSI devices used in the electronics industry, it is indispensable to ultra-precision planarize silicon wafer surfaces and interlayer insulation films in multilayer structures. This is done by a system using a polishing pad. The polishing pad is generally made of rigid polyurethane foam or non-woven fabric, but in order to maintain flatness and wafer polishing rate, it is necessary to condition the surface of the pad constantly or intermittently. A tool in which diamond abrasive grains are fixed to a substrate by electrodeposition, or a tool (conditioner or dresser) provided with a row of pyramidal protrusions on a sintered diamond layer generally lined with a cemented carbide is known.

As an example of an electrodeposition-type conditioning tool, a hollow area in which no abrasive grains are arranged is arranged at the center of the circular surface of a disk-shaped base, and a first abrasive grain layer is formed on the outer side, and a second abrasive grain layer on the outer side. Each region is provided, and the first abrasive layer region is provided with a plurality of rows of small abrasive layer portions at intervals, and each small abrasive layer portion is formed on the surface of the raised portion having a substantially spherical shape, A rotating abrasive tool in which superabrasive grains are fixed with a metal plating layer, and the second abrasive layer area is formed by fixing superabrasive grains with a metal plating layer on a ring-shaped circumferential ridge. Is known (Patent Document 1).
Such electrodeposition type tools are not always satisfactory in holding power because the abrasive grains are only physically fixed to the substrate by the electrodeposited nickel. The abrasive grains fell off and the tool life was not sufficiently long.

Also known is a polishing tool having an abrasive layer in which abrasive grains made of diamond or the like are fixed on a circular rotation plane with a resin bond material, and slits are provided radially and concentrically on the surface of the abrasive layer (patent) Reference 2).
However, since the retention strength of the abrasive grains by the resin bond material is not always at a satisfactory level, a sufficient tool life cannot be obtained depending on the application, and the electrodeposition tool is not at a satisfactory level.

Also, a dresser is known in which a polycrystalline diamond thin film is formed on the working surface of a base metal having a convex portion by a vapor phase synthesis method (Patent Document 3).
However, it is difficult to form a diamond thin film faithfully to the small unevenness of the base metal by the vapor phase synthesis method, and sufficient accuracy cannot be obtained, and the bonding force between the thin film and the base metal is not sufficient. I can't say that.

  The conventional polishing tool (pad conditioner) as described above has a structure in which a plurality of abrasive grains having different particle diameters are fixed to a substrate (base metal), so that a uniform abrasive grain (vertex) level can be obtained. The conditioning process uses only the most protruding particles on the substrate (base metal) surface, resulting in excessive consumption of these particles that are subjected to excessive loads, before eventually reaching the original tool life. Often unavailable.

  Instead of individual superabrasive particles fixed with a metal plating layer as described above, the surface of a pyramid-shaped projection formed of sintered diamond, in particular, the surface of a semiconductor wafer or the like has high accuracy and high efficiency. A polishing tool used as a CMP pad conditioner suitable for conditioning a CMP pad that can be processed by the above-mentioned method and a manufacturing method thereof have been provided (Patent Document 4). In this prior art, a group of protrusions called a polishing unit is formed by cutting a sintered diamond layer lined with a cemented carbide with a wire cut. As the shape of the polishing unit, a pyramid type (quadrangular pyramid) or a quadrangular pyramid with an angle between planes of 90 °, a triangular pyramid, a triangular frustum, or the like is described.

  Also, a polishing tool in which a plurality of polishing units having a flat top surface located within a certain level with respect to the surface are arranged on the sintered diamond layer, and the polishing unit is formed by wire cutting or the like on the sintered diamond layer. The inventor has provided a polishing tool that forms a cutting edge on an aligned square or triangular prism or pyramid with a flat tip by cutting (Patent Document 5).

JP 2002-337050 A JP 2004-291184 A Japanese Patent Laid-Open No. 10-071559 International Publication WO2007-023949 JP2011-20182A

However, as the inventor researches in this field, even those disclosed in Patent Documents 4 and 5 are becoming particularly necessary in recent years, for example, for LSIs having ultra-high-definition wiring whose wiring width is 35 μm or less. As a conditioner for a CMP pad for polishing the surface of a semiconductor material such as the above, it is not always satisfactory.
An object of the present invention is to obtain a conditioner for rationally conditioning a pad for obtaining a semiconductor material surface suitable for an LSI having such an ultra-high-definition wiring with higher functionality.

  In order to solve the above problems, the present inventor is still eagerly studying, and as a pad conditioner having a polishing portion made of a superabrasive sintered body of diamond or the like, polishing the polishing sintered body in the polishing portion. By making the shape of the projection as a unit a minute dimension, a minute pitch, and a sharp edge that are not conventional, it is possible to suitably condition a CMP pad for polishing a semiconductor material surface particularly used for LSIs having a minute line width. As a result of further research, the present invention has been completed.

That is, the present invention relates to the following pad-conditioning sintered body, a method for producing the sintered body, a polishing patch comprising the sintered body, a method for producing the polishing patch, and a tool having the polishing patch.
[1] A superabrasive formed by aligning a plurality of polishing units having apexes substantially on the same plane with each other at a pitch of 200 μm or less by processing a superabrasive surface layer portion of a sintered body A sintered body for pad conditioning consisting of a grain sintered body.
[2] The polishing sintered body according to [1], wherein the processing is performed by laser processing.
[3] The polishing sintered body according to [2], wherein the laser is a blue laser.
[4] The sintered body for polishing according to any one of [1] to [3], wherein the pad is a CMP pad.
[5] The polishing sintered body according to any one of [1] to [4], wherein an angle formed between the top surface of the polishing unit and the uppermost portion of the side wall surface is 90 ° to 60 °.
[6] The top surface of the polishing unit is a polygon, or a shape in which a part or all of the sides of the polygon are replaced with a curved line curved inward or outward connecting adjacent vertices, and the length of one side of the polygon The polishing sintered body according to any one of [1] to [5], wherein is at least 30 μm.
[7] The polishing sintered body according to any one of [1] to [6], wherein the height from the bottom of the polishing unit is 50 μm or less.
[8] The sintered body for polishing according to any one of [1] to [7], wherein the superabrasive grains are diamond.
[9] By polishing a surface portion of a polished portion made of a diamond sintered body by laser processing including a blue laser, polishing units having top portions that are substantially on the same plane with each other have a pitch of 200 μm or less. A method for manufacturing a sintered body for polishing, wherein a plurality of the sintered bodies are formed.

[10] A polishing patch comprising a pad-conditioning sintered body comprising the superabrasive sintered bodies of [1] to [8] above, and a straight line passing through the center of the disc-shaped sintered body material (1). The line (2) and the radii (3), (3 ′) perpendicular to the straight line are divided into two equal points (4), (4 ′), and the line parallel to the straight line (2) and the disc Parallel to the straight line (2) connecting the intersections (8), (9), (10) and (11) with two straight lines (6) and (7) passing through the center and forming an angle of 60 ° with the diameter. Of the four divided pieces obtained by dividing the disk into regular hexagons each having a straight line segment (12), (12 ′) as one side and the straight line (2), are located outside the regular hexagon. Two concatenated pieces (13), (14), (15), (16), obtained by further dividing the two portions into three parts by the two straight lines (6) and (7), respectively. (17), 18), and two trapezoidal divided pieces having three sides and a diameter of a regular hexagon as sides, and two sintered body divided pieces (19) and (20) substantially congruent with the six divided sides. 8) The substantially congruent shaped polishing patches, which are obtained by cutting out both end corners of the arc-shaped side of the eight substantially congruent sintered body divided pieces obtained by cutting out the same).
[11] Eight congruent sintered body divided pieces according to [10] are further divided into two or more patch pieces by an arc (23) concentric with the circular arc forming the outer shape of the disk. A polishing patch comprising a plurality of sets of eight substantially congruent polishing patches obtained by rounding the corners of both ends of an arc-shaped side.
[12] In the polishing patch described in [10], the two outer side sintered pieces (19) and (20) inside the regular hexagon are in contact with one side of the regular hexagon. A set of two substantially concatenated sections (28) and (29) having a saddle-shaped constriction combined with the divided pieces (13) and (14) and four trapezoid-like pieces each having a circular arc. 6 polishing patches consisting of a set of substantially congruent sections (14), (15), (17) and (18).
[13] The polishing patch according to any one of [10] to [12] is provided so that one or more types of polishing patches are evenly arranged in a circumferential direction on an outer peripheral portion of a circular substrate. A polishing tool.
[14] A straight line (2) made of the polishing sintered body according to the above [1] to [8], passing through the center of the disk-shaped sintered body material (1), and a radius ( 3) Two straight lines (3 ′) and (3 ′) are divided into two equal lines (4), (4 ′) and parallel to the straight line through the center of the disk and at an angle of 60 ° with the diameter. 6) and a regular hexagon with one side of line segments (12) and (12 ′) parallel to the straight line connecting the intersection points (8), (9), (10) and (11) with (7) Six concatenated divided pieces obtained by dividing the disc into four pieces and further dividing the two portions located outside the regular hexagon into three pieces by the two straight lines (6) and (7), respectively. (13), (14), (15), (16), (17), (18), and two trapezoidal split pieces (19) having three sides and a diameter of a regular hexagon as sides. 20) To obtain a disk-shaped of eight from the sintered body material sintered body split pieces, grinding the patch production method.
[15] In the method according to the above [14], the outer sintered body that is in contact with the two sintered body divided pieces (19) and (20) on the inner side of the regular hexagon, each on one side of the regular hexagon. A trapezoidal shape in which one side is a circular arc is left as two concatenated sections (28), (29) having a saddle-shaped constriction without cutting between the body segment pieces (13), (14) By cutting out from a set of four conjoint sections (14), (15), (17), (18) and two conjoint sections (28), (29) having a saddle-shaped constriction, This is a method for producing six polishing patches from a disk-shaped sintered material.

A conditioner having a short pitch of the polishing unit rows is obtained by forming a row of polishing units on a superabrasive sintered body such as diamond by blue laser processing.
This sintered body is preferably formed of a diamond sintered body in which the polishing portion is sintered and integrated with the backing material of the cemented carbide, and the polishing unit is formed by processing so as to engrave the polishing portion. .
Further, since the laser processing enables fine processing, the top surface of the polishing unit is a polygonal or a polishing unit having a polyhedral top surface having a curved outline. Processed.

Since the present invention forms a polishing unit by processing a super-abrasive sintered body for pad conditioning by laser processing, the pitch of a row of polishing units is significantly shorter than conventional wire cutting, In addition, since the action of blunting the edge of the sintered body is remarkably less, a pad conditioning tool having a more accurate polishing unit shape than that of a conventional polishing tool can be obtained.
Therefore, the super-abrasive sintered body for pad conditioning according to the present invention can be used for an LSI or the like of an ultra-fine wiring rule that could not be achieved with a conventional polishing tool for a super-abrasive sintered body by wire cutting. A CMP pad for obtaining a semiconductor material surface could be realized.
Furthermore, the superabrasive sintered body for pad conditioning according to the present invention can condition a CMP pad for polishing a surface of a semiconductor material for an ultra-fine wiring rule, and has a great effect of preventing wear due to the conditioning of the CMP pad. However, the polishing effect of the CMP pad by the conditioning is high, and there is an exceptional effect that has never existed before.
This conditioner is a conditioner having a polishing portion made of a superabrasive sintered body such as diamond, and a blue laser that is powerful at a short wavelength when forming a plurality of polishing units in the polishing portion made of a superabrasive sintered body. By processing, a polishing unit with a short pitch can be formed.

  The sintered body for polishing according to the present invention is advantageous in that it is sintered at a temperature equal to or higher than the melting temperature of the binder, so that the fixing strength of the superabrasive grains is large and there is substantially no dropout. Particularly when diamond particles are used as superabrasive grains, diamond is subjected to temperature and pressure conditions in which the binder metal is melted and the diamond is thermodynamically stable in the manufacturing process, and the diamond fine particles become the binder metal. Because of the strong integration through partial dissolution, the fixing strength is further increased, so that there is virtually no dropout.

  In addition, the polishing part in which the polishing unit is formed is composed of a superabrasive sintered body with a sufficient thickness on the surface, so that even if the polishing unit is worn out by use, the polishing unit can be easily regenerated. Thus, it can be reused as the tool of the present invention.

It is a top view which shows the surface of an example (a grinding | polishing unit is a thing of a square pyramid) of the sintered compact for conditioning by this invention. It is a photograph of an example of the sintered compact for conditioning by this invention. It is explanatory drawing (plan view and side view) which shows the various examples of the grinding | polishing unit of the sintered compact for conditioning by this invention. It is explanatory drawing which shows the manufacturing method of the sintered compact for conditioning by this invention. It is a figure which shows the example of a cut-out of the Example of the sintered compact for conditioning by this invention. It is a top view of the processing tool of the Example using the sintered compact for conditioning by this invention. It is a figure explaining 8 sheet | seat patch cutting out by this invention. It is a figure which shows 8 sheet | seat patch cutout by this invention. It is a figure which shows 16-sheet polishing patch cut-out by another aspect of this invention. It is a figure which shows 6 sheet | seat grinding | polishing patch cut-out by another aspect of this invention. It is a figure which shows the polishing tool using the polishing patch by this invention. It is the top view and side view which show the polishing tool using the polishing patch by another aspect of this invention. It is the top view and side view which show the polishing tool using 2 types of polishing patches by another aspect of this invention.

The superabrasive sintered body as a material of the polishing sintered body of the present invention is obtained by treating superabrasive powders such as diamond and c-BN (cubic boron nitride) in an ultrahigh pressure and high temperature process by a conventional method. can get. Since the sintered body in this state has a large strain in the superabrasive sintered body, it is preliminarily flattened by die discharge machining or the like. Next, by forming the grooves and the side surfaces of the protrusions in a stepwise manner in a manner specified by the present invention, a polishing unit, that is, a protrusion portion that directly contacts the object to be polished is created. When a commercially available product is used as the superabrasive sintered body, although depending on the specifications, since the surface is flattened, the flattening pretreatment can be omitted.
For the formation of the groove, a laser cut, in particular, a blue laser, for example, a YAG laser, is used to form a polishing unit at a short pitch and to process the polishing unit with a sharp edge. Can do.

  In the polishing sintered body of the present invention, the above-mentioned polishing unit can be created, for example, by cutting with a laser processing machine into an annular sintered body layer having a circular or concentric central circular hole. The laser processing machine can perform cutting into the sintered body layer in the desired shape by scanning operation without damaging the sintered body layer, so any shape with less edge dullness can be obtained. Can be formed. Taking the efficiency of the laser processing operation into consideration, it is preferable to scan linearly.

  A shape in which the polishing unit has a linear ridge line at the top (FIG. 3; No. 1 triangular frustum, No. 3 hexagonal frustum, No. 4 quadrangular frustum) or a curved ridge line (FIG. 3; No. 2) may be used. Since the polishing unit is formed by a laser processing machine, it can be formed with a much finer density compared to wire-cut electric discharge machining, and the shape of the polishing unit is also sharper than that of wire-cut electric discharge machining. It is leaning.

  In the above example, since each polishing unit functions as an effective polishing portion, the top edge of each polishing unit is sufficiently sharp, and adjacent polishing units are separated from each other by an unprecedented short interval of 200 μm or less. As for the length of the edge, each polishing unit top has a polygonal shape, and the length of one side is 30 μm or more. The angle formed between the top surface of the polishing unit and the upper end of the polishing unit side wall is about 90 to 60 °, preferably about 90 to 75 °.

  The depth of the groove (height from the groove bottom of the polishing unit) should be 50 μm or less, and it should be deep enough to eliminate chips. If the groove is too deep, the strength of the polishing unit will be insufficient and an excessive superabrasive layer thickness will be required, but in laser processing, precise processing is possible and the pitch can be shortened. Therefore, it is possible to realize a groove having a shallower depth than the conventional one.

The shape of the polishing unit is preferably as shown in FIG. 3 in which each side surface of the polishing unit is inclined to have a frustum shape, for example, a quadrangular frustum shape or a triangular frustum shape.
In addition, in the aligned prismatic or prismatic polishing units, so-called "blading" that sharpens the edge or vertex of the top by polishing one or more sides of a rectangle or triangle with a dedicated tool. If done, a better sharpness can be achieved. When the polishing unit is a polygonal column or a polygonal frustum, and the top is a polygon (typically a triangle or a quadrangle), cutting is performed on at least one side of the top surface, but the polishing unit is a quadrangular pyramid. In the case of a shape or a triangular pyramid shape, a sufficient sharpness can be achieved without cutting.

  As a sintered superabrasive layer, one surface of a diamond sintered body (PCD) or c-BN sintered body (PcBN) is cemented with a hard metal, that is, a tungsten carbide based composite material, or a group 6a metal of the periodic table. The composite material is composed of a composite material block consisting mainly of carbides, and the composite material side is fixed to the tool substrate with an adhesive or the like, and a division groove is formed on the opposite side to be used as a polishing portion.

  As such a sintered body, a disk-shaped one typically prepared by a uniaxial pressurization type high temperature ultrahigh pressure isostatic press is commercially available.

  In the production of the square frustum-shaped polishing unit, for example, as shown in FIG. 4, parallel groove groups and frustums in the first direction at a constant groove interval (pitch) on the surface of the polishing portion with a laser processing machine such as a YAG laser After forming both side surfaces of the body, rotate the substrate 90 ° around the center axis of the ring together with the substrate to which the polishing part is fixed, and in the same way, parallel groove groups in the second direction are formed at a constant groove interval and in each groove. By forming adjacent frustum body inclined side surfaces, two sets of parallel groove groups orthogonal to each other and a quadrangular frustum-shaped polishing unit aligned along the grooves may be obtained.

  Even in the case of a triangular pyramid, after forming the parallel groove group in the first direction and the inclined surface of the truncated pyramid adjacent to the groove, the sintered body material is rotated by 120 ° around the central axis, and the constant groove spacing is similarly applied. Then, the parallel groove groups in the second direction and the adjacent inclined side surfaces are formed by laser cutting. After the operation is completed, the polishing unit is further rotated by 120 °, and the same operation is performed, so that parallel groove groups in the third direction intersecting at 120 ° and the adjacent inclined side surfaces and the triangular frustum-shaped polishing units aligned along the grooves. May be obtained.

In the above polishing unit, the protruding height of the top of the frustum-like body with respect to the groove bottom can be 50 μm or less for both the triangle and the quadrangle. Due to the fine processing because of laser cutting, the alignment pitch of the polishing unit is 200 μm or less, so even if the protrusion is shallower than before, the polishing unit body does not come in direct contact with the work such as the pad, and the polishing unit In this case, there is no need for insufficient strength or excessive superabrasive layer thickness.
Furthermore, since it is a laser cut, there is little blunting of the edge, and a sufficient polishing action can be obtained even with a small protruding height as in the present invention.

  The polishing performance of the polishing unit depends on the particle size of the superabrasive grains contained at the top of the cone-shaped body. When the superabrasive grains are diamond particles, that is, when the sintered body constituting the polished portion is a sintered diamond (PCD) layer, the diamond particles have a nominal particle size of 40-60 μm or less, for example, 8-16 μm. PCD layers of various nominal particle sizes such as 0-2 μm can be used, but a nominal particle size of 8-16 μm or less is preferred, and a nominal particle size of 0-2 μm is particularly preferred.

The diamond sintered body that can be used for the polishing sintered body according to the present invention is diamond-thermodynamically stable together with a cemented carbide as a backing material and, if necessary, a binder metal such as cobalt. It is obtained by subjecting to ultrahigh pressure and high temperature conditions. Processing from the sintered body to the super-abrasive sintered body for pad conditioning of the present invention can be realized by forming a polishing unit by processing the surface by laser cutting, typically blue laser cutting.
In contour cutting for cutting out a sintered sintered body from a sintered body material, general processing means such as wire cut electric discharge machining can be used in addition to laser cutting.

In the present invention, a polygonal frustum such as a triangular frustum or a quadrangular frustum of a polishing unit is formed by laser cutting, so that the edge is sharp and the cotton density of the edge is also high. In particular, effective conditioning of a CMP pad used for polishing the surface of a semiconductor material for an LSI having an ultra-fine wiring rule of 0.35 μm or less is possible for the first time, and unnecessary wear of the CMP pad during conditioning can be reduced.
In addition, since the polishing unit row has a short pitch, the cotton density of the edge that performs the polishing action is increased, and the necessary superabrasive sintered body material is less than that of the conventional long pitch.
Further, it is not necessary to increase the height of the polishing unit as in the prior art, and the required thickness of the superabrasive sintered body portion is smaller than in the prior art.
Next, the present invention will be specifically described with reference to examples.

[Example 1]
A sintered diamond layer having a thickness of 0.5 mm and a diameter of 60 mm and a cemented carbide block integrated with a cemented carbide block is cut into a disc-shaped diamond sintered body having a total thickness of 3.2 mm as shown in FIG. Eight arc-shaped patches of shape, each of two types, large and small, were cut out. The larger arcs had a length of about 27 mm for 8 pieces, the smaller arcs had a length of about 21 mm, and the width at the center of the arc was about 7 mm, the same for 16 pieces.
Take 5 pieces of each of these arc-shaped sintered compacts, large and small, and fix them on a flat metal plate with their orientations aligned, and cut each diamond layer surface with a blue laser to make a square pyramid with a height of 50 μm from the bottom. A group of polishing units was formed in a lattice pattern with a pitch of 130 μm to form a polishing patch. The top of the polishing unit was a square shape with a side of 30 μm, and the side wall surface was inclined 15 ° with respect to the axial direction.

Five of these polishing patches were alternately arranged on the outer circumference of a circular substrate having an outer diameter of 108 mm on each concentric circle every 72 °. Each patch was arranged with its longitudinal direction inclined at 30 ° with respect to the circumferential direction at the center, and fixed with an adhesive to obtain the tool shown in FIG.
This tool was subjected to a polishing test of nonwoven fabric and hard urethane (both manufactured by Ciba Technologies), and the results shown in Table 1 were obtained.
This value is disclosed in, for example, Patent Document 5, a conventional diamond sintered body polishing tool in which a polishing unit is formed by wire cutting, which is 100 μm in length of the side of the top quadrangular surface of the polishing unit and 1500 μm in pitch. The cut rate is more than 100 times lower than that of the conventional technology of 80 to 120 μm / h, that is, the reduction of the hard urethane to be conditioned is small. However, it means that the surface roughness is equivalent or superior to that of the prior art diamond sintered body polishing tool.

  The sintered body for pad conditioning according to the present invention is extremely excellent as a CMP pad conditioner, particularly as a C <P pad conditioner for use in polishing the surface of a semiconductor material for LSI manufactured with a high-definition circuit rule.

The present invention also provides a superabrasive that can most efficiently utilize a disk-shaped material suitable for use in a rotary polishing tool having a polishing portion made of a superabrasive sintered body such as diamond as described above. The present invention relates to a sintered body polishing patch and a method for producing the same.
Such a polishing patch and its manufacturing method, in combination with the above-described technology related to a sintered body having a laser-cut fine pitch, small protrusions, and sharp edges, not only enables high-performance conditioning to the pad, It is possible to provide a very reasonable and economical conditioner.
In the present invention, the circle in the case of “disc shape” does not refer only to a true circle in a strict mathematical sense, but is substantially circular in an actual substance such as a sintered body. In other words, the center of which can be approximately determined at one point is also included.

In the superabrasive sintered body such as diamond, the sintered body material is disk-shaped, and in order to cut the sintered body polishing patch for a rotary polishing tool from the disk most effectively without waste, A diameter of an arbitrary position of the disk is determined, and a radius perpendicular to the diameter is divided into two, passing through a point parallel to the diameter and the center of the disk, and forming an angle of 60 ° with the diameter 2 A regular hexagon having a line parallel to the diameter connecting the intersection with the diameter of the book as one side and the diameter divides the disk into four pieces, and two portions located outside the regular hexagon are The above six sheets cut out from six congruent divided pieces obtained by further dividing each of the two pieces into two diameters and two trapezoidal divided pieces having three sides and a diameter of a regular hexagon as sides. A book consisting of eight congruent sintered body divided pieces obtained by cutting out two sintered body divided pieces congruent with Sintered body polishing patches invention can be obtained.
Furthermore, the sintered body polishing patch according to the present invention is obtained by the sintered body polishing patch comprising two sets of congruent 8 sheets obtained by dividing into two arcs that are concentric with the arc that has formed the outer shape of the disk. It is done.
Further, in another aspect of the present invention, instead of dividing the disc into four pieces by the regular hexagon and the diameter, the diameter and four sides not parallel to the diameter of the regular hexagon, And two congruent one sides obtained by dividing the disc into two regular hexagons of two diameters that pass through the center of the disc and form an angle of 60 ° with the diameter of the disc. A material consisting of a set of sections with a saddle-shaped constriction and a trapezoid-like set of four pieces with a circular arc on one side is obtained, and the saddle-shaped section has two vertices of the constriction. By processing a linear part so that it has a symmetric outer shape with a line connecting the two, a congruent four trapezoidal pieces and a jointed trapezoidal piece with a straight side facing the arcuate side Are obtained.
In order to improve the polishing effect, the corners on the arc side of the 8, 16, or 6 polishing patches of these modes are rounded so that they do not bite into the workpiece during polishing. Preferably it is.

The polishing patch of the present invention is capable of cutting out a superabrasive sintered body for obtaining a polishing patch in which a number of polishing units are formed on a polishing surface by laser cutting from a disk-shaped sintered body material without waste. Since it is a superabrasive sintered body polishing patch, it is possible to manufacture by using the superabrasive sintered body, which is difficult and expensive, without waste.
Further, since the congruent shape of the polishing patch can be obtained from a plurality of disc-shaped sintered bodies, it is not necessary to adjust the size when creating a polishing tool for bonding and manufacturing the polishing patch. Since the size of the polishing patch is not more finely divided than necessary, it is possible to prevent the polishing patch adhering work when creating the polishing tool from becoming unreasonably complicated.

1 Y: Polishing unit top surface 1: Surface of sintered body for pad conditioning 2: Polishing unit top surface edge 3: Groove bottom surface between polishing units 1: Front view and side view of a polishing unit that is a triangular frustum 2: Front view and side view of a polishing unit which is a quadrangular frustum having a curved side. 3: Front view and side view of polishing unit that is a hexagonal frustum 4: Front view and side view of a polishing unit which is a quadrangular pyramid FIG. 4 5: Diamond sintered body 6: Laser scanning unit 7: YAG laser FIG. 5 8: Arc-shaped sintered body piece (large)
9: Arc-shaped sintered compact (small)
Fig. 6 10: Tool circular substrate 11: Sintered body polishing patch

Claims (15)

  Superabrasive sintering in which a plurality of polishing units having apexes on substantially the same plane as each other are formed by aligning a plurality of polishing units on the surface of the superabrasive grain of the sintered body at a pitch of 200 μm or less. A sintered body for pad conditioning.   The polishing sintered body according to claim 1, wherein the processing is performed by laser processing.   The polishing sintered body according to claim 2, wherein the laser is a blue laser.   The polishing sintered body according to any one of claims 1 to 3, wherein the pad is a CMP pad.   The polishing sintered body according to any one of claims 1 to 4, wherein an angle formed between the top surface of the polishing unit and the uppermost portion of the side wall surface is 90 ° to 60 °.   The top surface of the polishing unit is a polygon, or a part or all of the sides of the polygon are replaced with a curved line curved inward or outward connecting adjacent vertices, and the length of one side of the polygon is 30 μm. It is the above, The sintered compact for grinding | polishing of any one of Claims 1-5.   The sintered compact for polishing according to any one of claims 1 to 6, wherein the height from the bottom of the polishing unit is 50 µm or less.   The polishing sintered body according to any one of claims 1 to 7, wherein the superabrasive grains are diamond.   By polishing the surface of the polished portion made of a diamond sintered body by laser processing including blue laser, a plurality of polishing units having apexes on substantially the same plane are formed at a pitch of 200 μm or less. A method for manufacturing a sintered body for polishing.   A straight line (2) passing through the center of the disk-shaped sintered body material (1), and a radius (3) orthogonal to the straight line (3 ' ) Are divided into two equal parts (4), (4 '), two straight lines (6) passing through the center of the disk and a line parallel to the straight line (2) and forming an angle of 60 ° with the straight line , (7) A regular hexagon with one side of line segments (12), (12 ′) parallel to the straight line connecting the lines (8), (9), (10), (11) and the straight line ( 2) Divide the two parts of the four divided pieces obtained by dividing the disc into the outer sides of the regular hexagon into three parts by the two straight lines (6) and (7). 6 concatenated divided pieces (13), (14), (15), (16), (17), (18), and two pieces having three sides of a regular hexagon and a diameter as sides From the trapezoidal split piece Of the eight substantially congruent sintered body divided pieces obtained by cutting out two sintered body divided pieces (19) and (20) substantially congruent to the six divided sides, Eight substantially congruent polishing patches made of rounded corners at both ends.   The eight congruent sintered body divided pieces according to claim 10 are further divided into two or more patch pieces by a circular arc (23) concentric with the circular arc that has formed the outer shape of the disk. A polishing patch comprising a plurality of sets of eight substantially congruent polishing patches, obtained by rounding the corners on both ends of the side. 11. The outer sintered body divided piece according to claim 10, wherein the two sintered body divided pieces (19) and (20) inside the regular hexagon are in contact with each other at one side of the regular hexagon. (13) A set of two substantially congruent sections (28) and (29) having a saddle-shaped constriction combined with (14) and four substantially congruent trapezoidal pieces each having a circular arc. Consisting of a set of sections (14), (15), (17), (18),
6 polishing patches.   A polishing tool, wherein the polishing patch according to any one of claims 10 to 12 is provided on an outer peripheral portion of a circular substrate so that one or more types of polishing patches are evenly arranged in a circumferential direction.   A straight line (2) passing through the center of the disk-shaped sintered body material (1), and a radius (3) orthogonal to the straight line (3 ' ) Is divided into two equal parts (4), (4 ') and a line parallel to the straight line and the center of the disc, and two straight lines (6), (7) A disc with a regular hexagon with one side of line segments (12), (12 ′) parallel to the straight line (2) connecting the intersections (8), (9), (10), (11) with Six concatenated pieces (13) obtained by dividing the two parts divided into four and further dividing the two portions located outside the regular hexagon into three by the two straight lines (6) and (7), respectively. ), (14), (15), (16), (17), (18), and two trapezoidal split pieces (19), (20) having three sides and a diameter of a regular hexagon as sides. By cutting out from Obtaining a disk-shaped sintered body eight sintered body split pieces from the material, the polishing patch production method.   15. The method according to claim 14, wherein the outer hexagonal sintered pieces (19) and (20) are in contact with one side of the regular hexagon, respectively. 13) and (14) are not cut and left as two congruent sections (28) and (29) having a saddle-shaped constriction. Disc-shaped firing by cutting out from a set of various sections (14), (15), (17), (18) and two joint sections (28), (29) having a saddle-shaped constriction A method of manufacturing six polishing patches from a combined material.