JP2012213834A - Super-abrasive sintered body polishing patch, and method for manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing patch constituted of a super-abrasive sintered body such as a sintered body for pad conditioning and capable of being cut from a circular sintered body material without waste.SOLUTION: The polishing patch is one in which two sheets of polishing patches are cut from a regular hexagon located at a circular center and six sheets of polishing patches cut from six sheets of congruent material pieces located at the outside of the regular hexagon in a circular super-abrasive sintered body material. Eight sheets of polishing patch materials in total are congruent, and patch corners are rounded in contour not to damage a material to be polished during polishing. The congruent patches may be further made into eight sheets of congruent patches of a plurality of pairs which are divided along lines forming concentric circles with circular arc shaped sides. This invention further includes a method for manufacturing the polishing patches and a polishing tool using the polishing patches.

Description

  The present invention relates to a superabrasive sintered body for a tool having a superabrasive sintered body polishing section and a method for manufacturing the same. In particular, the present invention provides a pad for a chemical-mechanical polishing (abbreviated as CMP) pad composed mainly of hard urethane or non-woven fabric for polishing the surface of various semiconductor materials, the disk surface of a hard disk, etc. The present invention relates to a polishing patch for a sintered body that is difficult to manufacture such as a polishing superabrasive sintered body used for conditioning, and a method for manufacturing the same.

  In recent years, CMP has been used to planarize metal film wafers such as interlayer insulating films and silicon as the number of wiring layers in VLSI devices has increased. In order to maintain a high level of a polishing pad (generally made of rigid foamed polyurethane) used in CMP and a wafer polishing rate, it is necessary to condition the surface of the polishing pad constantly or intermittently.

  In the manufacturing process of memory chips and other LSI devices used in the electronics industry, it is indispensable to ultra-precision planarize silicon wafer surfaces and interlayer insulation films in multilayer structures. This is done by a system using a polishing pad. The polishing pad is generally made of rigid polyurethane foam, but in order to maintain flatness and wafer polishing rate, it is necessary to condition the surface of the pad at all times or completely, and for this purpose, diamond polishing is mainly used. A tool in which grains are fixed to a substrate by electrodeposition or a tool (conditioner or dresser) in which a row of pyramidal protrusions is provided on a sintered diamond layer generally lined with a cemented carbide is known.

  Instead of individual superabrasive particles fixed with metal plating layer, a tool with pyramid-shaped projections formed of sintered diamond, especially CMP that can process the surface of semiconductor wafers with high accuracy and high efficiency A polishing tool used as a CMP pad conditioner suitable for pad conditioning and a manufacturing method thereof have been provided (Patent Document 1). In this technique, a group of protrusions called a polishing unit is formed by cutting a sintered diamond layer lined with a cemented carbide with a wire cut. As the shape of the polishing unit, a pyramid type (quadrangular pyramid) or a quadrangular pyramid with an angle between planes of 90 °, a triangular pyramid, a triangular frustum, or the like is described.

  Also, a polishing tool in which a plurality of polishing units having a flat top surface located within a certain level with respect to the surface are arranged on the sintered diamond layer, and the polishing unit is formed by wire cutting or the like on the sintered diamond layer. An inventor has provided a polishing tool that forms a cutting edge on an aligned square or triangular prism or pyramid with a flat tip by cutting (Patent Document 2).

International Publication WO2007-023949 JP2011-20182A

  However, the superabrasive sintered bodies of Patent Documents 1 and 2 are particularly required in recent years, such as for ICs having ultrahigh-definition wiring in which the wiring width of the IC chip is, for example, 35 μm or less. As a material to be processed into a conditioner for a CMP pad for polishing the surface of a semiconductor material, it is difficult to process and is valuable as a material. Therefore, it is desirable to establish a cut-out aspect from a material as a specific polishing patch so that the sintered body material can be used as a tool without waste.

  In order to solve the above-mentioned problems, the present inventor has repeatedly studied and generally uses a polishing sintered body having a polishing portion made of a superabrasive sintered body such as diamond, which is generally formed in a disk shape, for polishing. A high-performance polishing tool can be configured as a patch, and the shape and dimensions of a polishing patch that uses a sintered body material most efficiently are found, and the present invention has been completed.

That is, the present invention provides the following superabrasive sintered body that can be most efficiently used as a disk-shaped material suitable for use in a rotary polishing tool having a polishing portion made of a superabrasive sintered body such as diamond. The present invention relates to an abrasive patch and a method for producing the same.
In the present invention, the circle in the case of “disc shape” does not refer only to a true circle in a strict mathematical sense, but is substantially circular in an actual substance such as a sintered body. In other words, the center of which can be approximately determined at one point is also included.

[1] A polishing patch cut out from a disk-shaped sintered material (1),
A fan-shaped unit in which an equilateral triangle having a side passing through a point separated from the center side by half the radius of the contour circle is removed from one of the sector shapes obtained by dividing the contour circle of the disk into six at a central angle of 60 °. The polishing patch having a contour shape in which both corners on the arc side are smoothly rounded.
[2] A polishing patch having a contour shape in which two polishing patches according to the above [1] are joined at sides facing an arc.
[3] Points (4), (4) obtained by dividing a straight line (2) passing through the center of the disk-shaped sintered material (1) and radii (3) and (3 ′) perpendicular to the straight line into two equal parts. '), And the intersections (8) and (9) ), (10), and (11) obtained by dividing the disc into a regular hexagon having one side of the line segments (12) and (12 ′) parallel to the straight line and the diameter (2) 4 Six concatenated pieces (13) obtained by further dividing the two portions of the divided pieces outside the regular hexagon into three parts by the two diameters (6) and (7), respectively. ), (14), (15), (16), (17), (18), and two trapezoidal divided pieces having three sides and a diameter of a regular hexagon as sides. Two pieces that are almost congruent with one piece 8 substantially composed of 8 pieces of substantially congruent sintered body divided pieces obtained by cutting out the divided pieces (19) and (20) and rounded corners of both ends of the arc-shaped side. Polished patch of the same shape.
[4] Eight congruent sintered body divided pieces according to [3] are further divided into two or more patch pieces by an arc (23) that is concentric with the arc that has formed the outer shape of the disk. A polishing patch comprising a plurality of sets of eight substantially congruent polishing patches, obtained by rounding the corners of both ends of an arc-shaped side.
[5] In the set of polishing patches according to [3], the two sintered body divided pieces (19) and (20) on the inside of the regular hexagon, and the outer side in contact with each of them on one side of the regular hexagon In place of the sintered body divided pieces (13) and (14), two substantially congruent sections (28) and (29) having a saddle-shaped constriction having a contour joined at one side in contact with each other. Six polishing patches comprising four substantially trapezoidal sections (14), (15), (17), and (18) in a trapezoidal shape, each side being an arc.
[6] The polishing patch according to any one of [1] to [5] is provided on the outer peripheral portion of the circular substrate so that one or more types of polishing patches are evenly arranged in the circumferential direction. , Polishing tools.
[7] Points (4), (4) obtained by dividing a straight line (2) passing through the center of the disk-shaped sintered material (1) and radii (3) and (3 ′) perpendicular to the straight line into two equal parts Crossing points (8), (9), (2) passing through the straight line parallel to the straight line and the two straight lines (6), (7) passing through the center of the disk and forming an angle of 60 ° with the straight line. 10), dividing the disc into four with a regular hexagon having one side of the line segment (12), (12 ′) parallel to the straight line (2) connecting (11) and the straight line (2), Six concatenated pieces (13), (14), obtained by further dividing the two portions located outside the regular hexagon into three parts by the two straight lines (6) and (7), respectively. By cutting out from (15), (16), (17), (18) and two trapezoidal split pieces (19), (20) having three sides and a diameter of a regular hexagon as sides, Plate-like sintering Obtaining eight sintered body split pieces from the material, the polishing patch production method.
[8] In the method according to [7], the outer sintered body is in contact with the two inner hexagonal sintered pieces (19) and (20) at one side of the regular hexagon. A trapezoidal shape in which one side is a circular arc is left as two concatenated sections (28), (29) having a saddle-shaped constriction without cutting between the body segment pieces (13), (14) By cutting out from a set of four conjoint sections (14), (15), (17), (18) and two conjoint sections (28), (29) having a saddle-shaped constriction, A method for producing six polishing patches from a disk-shaped sintered material.
[9] The method according to [7] or [8], further including a step of rounding corner portions of the cut polishing patches so that the polishing patches are substantially congruent with each other.

In the superabrasive sintered body such as diamond, the sintered body material is disk-shaped, and in order to cut the sintered body polishing patch for a rotary polishing tool from the disk most effectively without waste, Determine the arbitrary diameter of the disk, pass through a point that bisects the radius orthogonal to the diameter, pass through a line parallel to the diameter and the center of the disk, and form an angle of 60 ° with the diameter. A regular hexagon having a line parallel to the diameter connecting the intersection with the diameter as one side and the diameter is used to divide the disk into four pieces, and the two portions located outside the regular hexagon are The six divisions cut out from six congruent division pieces obtained by further dividing each of the two pieces into two and a trapezoidal division piece having three sides and a diameter of a regular hexagon as sides. Eight congruent sintered body divided pieces obtained by cutting out two conjoined sintered body divided pieces, and By obtaining a sintered body polishing patch in which two sets of eight congruent pieces obtained by dividing into two arcs that are concentric with the arc that was formed, the sintered body polishing patch of the present invention was obtained. It is done.
Further, in another aspect of the present invention, instead of dividing the disc into four pieces by the regular hexagon and the diameter, the diameter and four sides not parallel to the diameter of the regular hexagon, And two congruent one sides obtained by dividing the disc into two regular hexagons of two diameters that pass through the center of the disc and form an angle of 60 ° with the diameter of the disc. A material consisting of a set of sections with a saddle-shaped constriction and a trapezoid-like set of four pieces with a circular arc on one side is obtained, and the saddle-shaped section has two vertices of the constriction. By processing a linear part so that it has a symmetric outer shape with a line connecting the two, a congruent four trapezoidal pieces and a jointed trapezoidal piece with a straight side facing the arcuate side Are obtained.
In order to improve the polishing effect, the 16 or 6 polishing patches of these aspects are processed so that the corners on the arc side are rounded so that they do not bite into the workpiece during polishing. preferable.

The present invention is, for example, a superabrasive sintered body for obtaining a polishing patch in which a large number of polishing units are formed on the polishing surface by laser cutting, and can be cut out from a disk-shaped sintered body material without waste. Since it is an abrasive-sintered body polishing patch, it is possible to manufacture by using the super-abrasive sintered body that is difficult and expensive to use without waste.
Further, since the congruent shape of the polishing patch can be obtained from a plurality of disc-shaped sintered bodies, it is not necessary to adjust the size when creating a polishing tool for bonding and manufacturing the polishing patch. Since the size of the polishing patch is not more finely divided than necessary, it is possible to prevent the polishing patch adhering work when creating the polishing tool from becoming unreasonably complicated.
The polishing patch of the invention according to claim 1 has a dimension obtained by removing an equilateral triangle from a fan shape so as to be a half width of a radius of an arc that forms a part of a contour, and only a thing of this dimension is It is of a shape and size that can cut a polishing patch from a disk-shaped sintered material with the least waste. The polishing patch of the invention according to claim 2 has a contour in which two polishing patches that can be cut out most efficiently from the disk-shaped material are combined, and is cut out from the disk-shaped material together with two single polishing patches. It is possible to cut out without any waste.

  The sintered body for polishing according to the present invention is advantageous in that it is sintered at a temperature equal to or higher than the melting temperature of the binder, so that the fixing strength of the superabrasive grains is large and there is substantially no dropout. Particularly when diamond particles are used as superabrasive grains, diamond is subjected to temperature and pressure conditions in which the binder metal is melted and the diamond is thermodynamically stable in the manufacturing process, and the diamond fine particles become the binder metal. Because of the strong integration through partial dissolution, the fixing strength is further increased, so that there is virtually no dropout.

  In addition, the polishing part in which the polishing unit is formed is composed of a superabrasive sintered body with a sufficient thickness on the surface, so that even if the polishing unit is worn out by use, the polishing unit can be easily regenerated. Thus, it can be reused as the tool of the present invention.

It is a figure explaining 8 sheet | seat patch cutting out by this invention. It is a figure which shows 8 sheet | seat patch cutout by this invention. It is a figure which shows 16-sheet polishing patch cut-out by another aspect of this invention. It is a figure which shows 6 sheet | seat grinding | polishing patch cut-out by another aspect of this invention. It is a figure which shows the polishing tool using the polishing patch by this invention. It is the top view and side view which show the polishing tool using the polishing patch by another aspect of this invention. It is the top view and side view which show the polishing tool using 2 types of polishing patches by another aspect of this invention. 1 is a plan view of a laser-cut polishing unit that is representative of a polishing surface of a polishing patch according to the present invention. It is a photograph of the Example of the laser-cut grinding | polishing unit typical as a grinding | polishing surface of the grinding | polishing patch by this invention. It is a figure which shows the structure of various grinding | polishing units typical as a grinding | polishing surface of the grinding | polishing patch by this invention. It is a figure which shows the formation method of a polishing unit typical as a polishing surface of the polishing patch by this invention.

The superabrasive sintered body used as a material for the polishing sintered body of the polishing patch of the present invention is obtained by subjecting superabrasive powder such as diamond or c-BN (cubic boron nitride) to a high pressure and high temperature process by a conventional method. What is obtained by processing is preferred. Since the sintered body in this state has a large strain in the superabrasive sintered body, it is preliminarily flattened by die discharge machining or the like. Next, the grooves and the side surfaces of the protrusions are formed stepwise to create a polishing unit, that is, a protrusion portion that directly contacts the object to be polished. FIG. 8 shows a plan view of a row of polishing units. When a commercially available product is used as the superabrasive sintered body, although depending on the specifications, since the surface is flattened, the flattening pretreatment can be omitted.
For the formation of the groove, a laser cut, in particular, a blue laser, for example, a YAG laser, is used to form a polishing unit at a short pitch and to process the polishing unit with a sharp edge. Can do.

  In the sintered body for polishing a polishing patch of the present invention, the polishing unit can be created by cutting the circular sintered body layer with a laser processing machine. The laser processing machine can perform cutting into the sintered body layer in the desired shape by scanning operation without damaging the sintered body layer, so any shape with less edge dullness can be obtained. Can be formed. Taking the efficiency of the laser processing operation into consideration, it is preferable to scan linearly.

  A shape in which the polishing unit has a linear ridge line at the top (FIG. 10; No. 1 triangular frustum, No. 3 hexagonal frustum, No. 4 quadrangular frustum) or a curved ridge line (FIG. 10; No. 2) may be used. Since the polishing unit is formed by a laser processing machine, it can be formed with a much finer density compared to wire-cut electric discharge machining, and the shape of the polishing unit is also sharper than that of wire-cut electric discharge machining. It is leaning.

  In the above example, since each polishing unit functions as an effective polishing portion, the top edge of each polishing unit is sufficiently sharp, and adjacent polishing units are separated from each other by an unprecedented short interval of 200 μm or less. As for the length of the edge, each polishing unit top has a polygonal shape, and the length of one side is 30 μm or more. The side wall surface of the polishing unit has an angle of 0 ° to 30 °, preferably 0 ° to 15 °, with respect to the direction of the rotation axis of the polishing tool perpendicular to the top surface of the polishing unit.

  The depth of the groove (height from the groove bottom of the polishing unit) should be 50 μm or less, and it should be deep enough to eliminate chips. If the groove is too deep, the strength of the polishing unit will be insufficient and an excessive superabrasive layer thickness will be required, but in laser processing, precise processing is possible and the pitch can be shortened. Therefore, it is possible to realize a groove having a shallower depth than the conventional one.

As the shape of the polishing unit, it is preferable that each side surface of the polishing unit is inclined to form a frustum shape, for example, a quadrangular frustum shape or a triangular frustum shape.
In addition, in the aligned prismatic or prismatic polishing units, so-called "blading" that sharpens the edge or vertex of the top by polishing one or more sides of a rectangle or triangle with a dedicated tool. If done, a better sharpness can be achieved. When the polishing unit is a polygonal column or a polygonal frustum, and the top is a polygon (typically a triangle or a quadrangle), cutting is performed on at least one side of the top surface, but the polishing unit is a quadrangular pyramid. In the case of a shape or a triangular pyramid shape, a sufficient sharpness can be achieved without cutting.

  As a sintered superabrasive layer, one surface of a diamond sintered body (PCD) or c-BN sintered body (PcBN) is cemented with a cemented carbide, that is, a tungsten carbide based composite material, or a group 6a metal of the periodic table. The composite material is composed of a composite material block consisting mainly of carbides, and the composite material side is fixed to the tool substrate with an adhesive or the like, and a division groove is formed on the opposite side to be used as a polishing portion.

  As such a sintered body, a disk-shaped one typically prepared by a uniaxial pressurization type high temperature ultrahigh pressure isostatic press is commercially available.

  In the production of the quadrangular frustum-shaped polishing unit, for example, as shown in FIG. 11, the parallel groove group and the frustum-shaped body on both sides of the first direction at a fixed groove interval (pitch) on the surface of the polishing portion with a laser processing machine. Then, the substrate to which the polishing part is fixed is rotated by 90 ° around the central axis of the ring, and in the same way, parallel groove groups in the second direction are formed at a constant groove interval, and the frustum adjacent to each groove. By forming the body inclined side surfaces, two sets of parallel groove groups orthogonal to each other and a truncated pyramid shaped polishing unit aligned along the grooves may be obtained.

  Even in the case of a triangular pyramid, after forming the parallel groove group in the first direction and the inclined surface of the truncated pyramid adjacent to the groove, the sintered body material is rotated by 120 ° around the central axis, and the constant groove spacing is similarly applied. Then, the parallel groove groups in the second direction and the adjacent inclined side surfaces are formed by laser cutting. After the operation is completed, the polishing unit is further rotated by 120 °, and the same operation is performed, so that parallel groove groups in the third direction intersecting at 120 ° and the adjacent inclined side surfaces and the triangular frustum-shaped polishing units aligned along the grooves. May be obtained.

In the above polishing unit, the protruding height of the top of the frustum-like body with respect to the groove bottom can be 50 μm or less for both the triangle and the quadrangle. Due to the fine processing because of laser cutting, the alignment pitch of the polishing unit is 200 μm or less, so even if the protrusion is shallower than before, the polishing unit body does not come in direct contact with the work such as the pad, and the polishing unit In this case, there is no need for insufficient strength or excessive superabrasive layer thickness.
Furthermore, since it is a laser cut, there is little blunting of the edge, and a sufficient polishing action can be obtained even with a small protruding height as in the present invention.

  The polishing performance of the polishing unit depends on the particle size of the superabrasive grains contained at the top of the cone-shaped body. When the superabrasive grains are diamond particles, that is, when the sintered body constituting the polished portion is a sintered diamond (PCD) layer, the diamond particle size (nominal particle size) is 40-60 μm or less, 8-16 μm PCD layers of various particle sizes such as 0-2 μm can be used, but nominal particle sizes of 8-16 μm or less are preferred, with 0-2 μm being particularly preferred.

The diamond sintered body that can be used for the polishing sintered body of the polishing patch of the present invention is composed of diamond particles together with a cemented carbide as a backing material and, if necessary, a binder metal such as cobalt, and the diamond is thermodynamic. It is obtained by subjecting to ultra-high pressure and high temperature conditions that are stable to high temperatures. Processing from the sintered body to the super-abrasive sintered body for pad conditioning of the present invention can be realized by forming a polishing unit by processing the surface by laser cutting, typically blue laser cutting.
In contour cutting for cutting out a sintered sintered body from a sintered body material, general processing means such as wire cut electric discharge machining can be used in addition to laser cutting.

In the polishing sintered body that can be used for the polishing patch of the present invention, a polygonal frustum such as a triangular frustum or a quadrangular frustum of a polishing unit is formed by laser cutting, so that the edge becomes sharp, Since the cotton density of the edge is also high, it is possible for the first time to effectively condition a CMP pad used for polishing the surface of a semiconductor material for an LSI with an ultrafine wiring rule of 0.35 μm or less for the first time. Can reduce unnecessary wear.
In addition, since the polishing unit row has a short pitch, the cotton density of the edge that performs the polishing action is increased, and the necessary superabrasive sintered body material is less than that of the conventional long pitch.
Further, it is not necessary to increase the height of the polishing unit as in the prior art, and the required thickness of the superabrasive sintered body portion is smaller than in the prior art.

One embodiment of the present invention will be described with reference to FIGS.
A straight line (2) passing through the center of an arbitrary disk of the disk-shaped sintered body material (1) is determined, and the radius (3) perpendicular to the straight line is divided into two equal parts (4), Intersections (8), (9), (10), (11) with two straight lines (6), (7) passing through the center of the disk parallel to the diameter and forming an angle of 60 ° with the diameter The disc is divided into four parts by a regular hexagon with one side of a line segment (12) parallel to the straight line (2) connecting the two and the straight line (2), and two parts located outside the regular hexagon (13) and (14) are further divided into three by the two straight lines (6) and (7), respectively, and six concatenated pieces (15), (16), (17), (18), (19), (20) and 2 congruent with the six divided pieces cut out from two trapezoidal divided pieces having three sides of the regular hexagon and the straight line (2) as sides. Single sintered body By cutting out the split pieces (21) and (22), eight congruent sintered body split pieces (15), (16), (17), (18), (19), (20), (21 ) And (22) are obtained.

  In this way, the congruent patch can be cut out most efficiently from one disc-shaped material, but the contour of the congruent patch cut out in this way is centered on the contour circle of the disc-shaped material. A fan-shaped shape obtained by removing an equilateral triangle having a side passing through a point separated from the center side by a half of the radius of the contour circle from one of the fan-shaped sections divided into six. The size of the regular triangle to be removed has a side that passes through a point separated by exactly half the radius of the contour circle, and even if it is larger or smaller than this, a wasteful part is generated in the cutting.

  Also, FIG. 3 includes two sets of eight congruent pieces obtained by dividing the one in FIG. 1 into two by an arc (23) that is concentric with the arc that had formed the outer shape of the disk. Since 16 sintered compact polishing patches are shown, and the original one in FIG. 1 has the most contour shape / dimension cut out without waste, it is still the least waste contour / shape.

  Furthermore, in another aspect of the present invention shown in FIG. 4, in FIG. 1, the two sintered body divided pieces (21) and (22) inside the regular hexagon are each connected to one side of the regular hexagon. A set of two congruent sections (28) and (29) having a saddle-shaped constriction combined with an outer sintered body divided piece in contact with each other, and four trapezoid-like pieces each having an arc on one side 6 shows six polishing patches comprising a set of congruent sections (30) (31) (32) (33).

The section having the saddle-shaped constriction is a shape obtained by joining two of the above-mentioned eight congruent patches that can be cut out most efficiently from a disk-shaped material. The length exactly matches the radius of the disk-shaped material.
In these aspects, the 8, 16, or 6 polishing patches are rounded at the corners on the arc side in order to improve the polishing effect, so that they do not bite into the workpiece during polishing. It is preferable that

FIG. 5 shows an embodiment of a polishing tool using the polishing patch according to the present invention.
In this example, two polishing patches of the size shown in FIG. 1 are used.

  FIG. 6 shows another embodiment of an abrasive tool using an abrasive patch according to the present invention. In this embodiment, a polishing tool using only a trapezoidal section of the polishing patch shown in FIG. 2 is shown.

  FIG. 7 shows still another embodiment of an abrasive tool using an abrasive patch according to the present invention. In this embodiment, both the saddle-shaped section and the trapezoidal section shown in FIG. 2 are used.

6 and 7 are provided with a plurality of congruent polishing patches on the peripheral edge of the circular substrate, but one polishing patch has a relatively large area, and the above-mentioned polishing units are densely provided. In the case of a polishing patch, a polishing tool that exhibits a sufficient polishing effect can be obtained by simply attaching a relatively small number of polishing patches to a circular substrate.
In addition, since the polishing patches are arranged at the peripheral edge with a space therebetween, it is possible to uniformly provide the portions without the patches, and there is an effect that the polishing dust is effectively discharged.
Next, a specific example of the tool according to the embodiment of the present invention will be described.

[Example 1]
A disc-shaped diamond sintered body having a total thickness of 3.2 mm, in which a sintered diamond layer having a thickness of 0.5 mm and a diameter of 60 mm is integrated with a cemented carbide block, is cut by wire cutting as shown in FIG. Eight arc-shaped patches of shape, each of two types, large and small, were cut out. The larger arcs had a length of about 27 mm for 8 pieces, the smaller arcs had a length of about 21 mm, and the width at the center of the arc was about 7 mm, the same for 16 pieces.
Take 5 pieces of each of these arc-shaped sintered compacts, large and small, and fix them on a flat metal plate with their orientations aligned, and cut each diamond layer surface with a blue laser to make a square pyramid with a height of 50 μm from the bottom. A group of polishing units was formed in a lattice pattern with a pitch of 130 μm to form a polishing patch. The top of the polishing unit was a square shape with a side of 30 μm, and the side wall surface was inclined by 15 ° with respect to the axial direction.

Five of these polishing patches were alternately arranged on the outer periphery of a circular substrate having an outer diameter of 108 mm on each concentric circle every 72 °. Each patch was arranged with its longitudinal direction inclined at 30 ° with respect to the circumferential direction at the center, and fixed with an adhesive.
This tool was subjected to a polishing test of nonwoven fabric and hard urethane (both manufactured by Ciba Technologies), and the results shown in Table 1 were obtained.
This value is disclosed in, for example, Patent Document 5, a conventional diamond sintered body polishing tool in which a polishing unit is formed by wire cutting, which is 100 μm in length of the side of the top quadrangular surface of the polishing unit and 1500 μm in pitch. The cut rate is more than 100 times lower than that of the conventional technology of 80 to 120 μm / h, that is, the reduction of the hard urethane to be conditioned is small. However, it means that the surface roughness is equivalent or superior to that of the prior art diamond sintered body polishing tool.

  The polishing patch of the present invention is particularly useful as a polishing patch for a superabrasive polishing tool in which polishing units are formed at a fine pitch, which can provide an excellent tool as in the above embodiment. This is because a superabrasive sintered body having a fine-pitch polishing unit is produced through a time-consuming process called laser cutting, and is therefore valuable and particularly useless. .

  In the polishing of the superabrasive sintered body of the present invention, the polishing patch can be cut out so that there is no waste of the superabrasive sintered body material. Therefore, for example, as a CMP pad conditioner, an LSI manufactured with a high-definition circuit rule. It is extremely beneficial if applied with respect to an extremely excellent polishing patch as a conditioner for a CMP pad for use in polishing a semiconductor material surface.

1: Disk-shaped superabrasive sintered body 2: Diameter 3: Radius perpendicular to diameter 4: Radius midpoint 6: Diameter 2 intersects at 60 ° Diameter 7: Another diameter intersects with diameter 2 at 60 ° 8, 9, 10, 11: Intersection points 13, 14, 15, 16, 17, 18, 19, 20: 8 of the line passing through the midpoint 4 of the radius and parallel to the diameter 2 and the diameter intersecting the diameter 2 at 60 ° Sheets of congruent polishing patches 28, 29: vertical polishing patch FIG. 8 1: polishing patch surface FIG. 8 2: top of a truncated pyramid shaped polishing unit FIG. 8 3: groove between polishing units

Claims (9)

A polishing patch cut out from a disk-shaped sintered material (1),
A fan-shaped unit in which an equilateral triangle having a side passing through a point separated from the center side by half the radius of the contour circle is removed from one of the sector shapes obtained by dividing the contour circle of the disk into six at a central angle of 60 °. The polishing patch having a contour shape in which both corners on the arc side are smoothly rounded.   A polishing patch cut out from a disk-shaped sintered material (1), wherein the polishing patch has a contour shape in which two polishing patches according to claim 1 are joined at sides facing an arc.   A straight line (2) passing through the center of the disk-shaped sintered material (1) and a point (4) obtained by dividing a radius (3) perpendicular to the straight line into two equal parts are parallel to the straight line (2). Connecting the intersections (8), (9), (10), (11) with two straight lines (6), (7) passing through the center of the line and the disk and forming an angle of 60 ° with the straight line, Two parts located outside the regular hexagon of four divided pieces obtained by dividing a disc into a regular hexagon having one side of a line segment (12) parallel to the straight line and the straight line (2) Are obtained by further dividing each of the two straight lines (6) and (7) into three, respectively, and six concatenated pieces (13), (14), (15), (16), (17) , (18) and two trapezoidal divided pieces having three sides and a diameter of a regular hexagon as sides, and two sintered body divided pieces (19) substantially congruent with the six divided pieces, (20) Obtained by cutting, the eight substantially congruent sintered body split pieces, consist of rounded both ends angle of the arc-shaped sides, polishing patch eight substantially congruent shapes.   The eight congruent sintered body divided pieces according to claim 3 are further divided into two or more patch pieces by an arc (23) that is concentric with the arc that has formed the outer shape of the disk, A polishing patch comprising a plurality of sets of eight substantially congruent polishing patches, obtained by rounding the corners on both ends of the side. 4. The polishing patch according to claim 3, wherein the two sintered body divided pieces (19) and (20) on the inner side of the regular hexagon and the outer sintered body divided pieces respectively in contact with one side of the regular hexagon. Instead of (13) and (14), a set of two substantially congruent sections (28) and (29) having a saddle-shaped constriction, each having a contour joined by one side in contact with each other, and 1 It consists of a set of four substantially congruent sections (14), (15), (17), (18) in a trapezoidal shape whose sides are arcs.
6 polishing patches.   A polishing tool in which the polishing patch according to any one of claims 1 to 5 is provided on an outer peripheral portion of a circular substrate so that one or more types of polishing patches are evenly arranged in a circumferential direction.   Points (4) and (4 ') obtained by dividing a straight line (2) passing through the center of the disk-shaped sintered material (1) and radii (3) and (3') perpendicular to the straight line into two equal parts. And intersections (8), (9), (10) (2) of two straight lines (6), (7) passing through the center of the disk and a line parallel to the straight line and forming an angle of 60 ° with the straight line. 11) A regular hexagon with one side of the line segments (12) and (12 ′) parallel to the straight line (2) connecting the straight line (2) and the straight line (2) are divided into four disks, Six concatenated pieces (13), (14), (15), (16) obtained by further dividing the two portions located outside by the two straight lines (6) (7), respectively. ), (17), (18) and two trapezoidal split pieces (19), (20) each having three sides of the regular hexagon and the straight line (2) as a disk, Sintering Obtaining eight sintered body split pieces from the material, the polishing patch production method.   The method according to claim 7, wherein the two sintered body divided pieces (19) and (20) inside the regular hexagon are in contact with one side of the regular hexagon, respectively. 13) and (14) are not cut and left as two congruent sections (28) and (29) having a saddle-shaped constriction. By cutting out from a set of sections (14), (15), (17), (18) and two joint sections (28), (29) having a saddle-shaped constriction, A method of manufacturing six polishing patches from a sintered material.   The method according to claim 7 or 8, further comprising the step of rounding corners of the cut abrasive patch so that the abrasive patches are substantially congruent with each other.