TWI383860B - Modular dresser - Google Patents

Description

Combined dresser

The present invention relates to a dresser, and more particularly to a combined dresser for a CMP pad and a method of making same.

Chemical Mechanical Planarization (CMP) is currently the most attractive technology in the process of flattening the surface of semiconductor wafers. In the chemical mechanical polishing process, the function of the polishing pad is to stably and uniformly transfer the polishing liquid between the wafer and the polishing pad, and to deposit a deposition layer on the wafer under the interaction of chemical etching and mechanical grinding. Remove.

In order to meet the demand for wafer processing and to maintain the stability of the quality, it is necessary to use a diamond dresser to trim the polishing pad in a timely manner during the chemical mechanical polishing process, except to remove the polishing by-products of the surface. The rough surface of the polishing pad improves its ability to hold the slurry and restores the pores on the surface of the polishing pad and its ability to hold and transport the polishing liquid. This saves the cost of the polishing pad and meets the requirements for stable quality during wafer mass production. .

The traditional diamond dresser is to fix the average particle size of the diamond particles on a metal plate. This diamond dresser is suitable for trimming hard polishing pads (such as IC1000). The function of the traditional dresser is not only to remove the waste generated when polishing the wafer, but also to cut a polishing pad to restore the roughness of the polishing pad, but this traditional type of diamond dresser is not suitable for 45 CMP process below m (nm). Due to the increasingly small line width of integrated circuits, such as the 65 nm process started in 2006, the wafer surface flattening and smoothness requirements are getting higher and higher, and the trimmer requirements for dressing polishing pads are getting higher. The higher the coming. It is expected that the 45nm process in 2010 must be polished at very low pressure to avoid wear through the nano-scale copper wire and the fragile low dielectric constant (Low K) resistance layer. Therefore, the trimmed polishing pad requires higher flatness and needs to be redesigned to meet the needs of large-size wafers. In addition to the diamond particle distribution rules of the dresser, the future diamond dresser has higher requirements for the leveling of the tip; in addition, the dresser needs to engrave a finer and more uniform engraving on the polishing pad. However, on the contrary, the dresser has a lower removal rate of the polishing pad, which is not possible with conventional dressers.

Patent application No. 1,228,066 discloses a dressing device for a polishing cloth and a dressing method for the polishing cloth used therefor, comprising a metal table provided with an adjusting mechanism for adjusting all or a part of the group of grindstone particles. The height difference of the reference plane formed by the front ends of the majority of the grindstone particles.

The diamond dresser disclosed in Taiwan Patent Publication No. 200821093 includes a different type of diamond enamel adhered to each diamond enamel bonding portion, and the diamond 黏 particle bonding portion and the dresser substrate are fixed by bolts or The adhesive is fixed.

A trimmer disclosed in U.

International Patent Publication No. WO 00/64630 discloses that an abrasive layer comprises a plurality of abrasive particles comprising an organic resin, a metal salt and diamond abrasive particles interspersed between a plurality of abrasive particles.

A finisher disclosed in U.S. Patent No. 2,060,128,288, which includes a plurality of diamond particles fixed to a metal substrate by a metal bond layer.

The finisher disclosed in Japanese Laid-Open Patent Publication No. JP2006-315088 includes a disk-shaped abutment combined with a plurality of circular PCD diamond pieces.

Generally, the size of the dresser is about 108 mm (mm). Because the area is large, the amount of deformation is large. It is not easy to combine abrasive grains of various sizes, shapes and materials, and the apexes of most abrasive particles are the same. The height and the large area of the dresser are higher.

The present invention has been proposed in order to make it easier for a larger area finisher to incorporate abrasive grains of various sizes, shapes, materials, and to have the apexes of a plurality of abrasive particles at the same height.

SUMMARY OF THE INVENTION A primary object of the present invention is to provide a combined dresser in which a same polishing end surface of a large substrate is combined with a plurality of small substrates having abrasive grains, which makes it easier to make the cutting ends of a plurality of abrasive grains at the same height, and is easier to combine various types. Abrasive particles of size, shape and material.

For other purposes and functions of the present invention, please refer to the drawings and the embodiments, which are described in detail below.

As shown in FIGS. 1 and 2, the combined refiner 1 of the first embodiment of the present invention, particularly as a dresser for a CMP pad, comprises a large substrate 11 and a plurality of polishing units 12.

As shown in FIG. 2, the large substrate 11 is provided with a bonding surface 110, a bottom surface 111, and a plurality of penetration holes 112 corresponding to the plurality of polishing units 12; the plurality of penetration holes 112 respectively accommodate the plurality of polishing units 12, and the plurality of polishing units 12 are protruded and combined. The surface 110; the plurality of polishing units 12 and the large substrate 11 are fixedly bonded by a bonding agent 13.

The plurality of polishing units 12 respectively include a small substrate 120 and a plurality of abrasive grains 121; one surface 122 of the small substrate 120 is combined with a plurality of abrasive grains 121; the abrasive grains 121 have a cutting end 123 capable of cutting a workpiece; and the small substrate 120 is opposite to the substrate The other surface 124 of the plurality of abrasive grains 121 is on the same reference plane 14 as the bottom surface 111 of the large substrate 11. The plurality of inner walls 113 of the large substrate 11 forming the plurality of penetration holes 112 and the plurality of outer walls 125 of the plurality of polishing units 12 respectively have a plurality of concave and convex structures 114, 126. When the bonding agent 13 is infiltrated into the plurality of concave-convex structures 114, 126, respectively, after bonding the plurality of inner walls 113 and the plurality of outer walls 125, the combination of the large substrate 11 and the plurality of polishing units 12 is more stable, and the plurality of polishing units 12 are relatively opposed in the grinding operation. Since the large substrate 11 cannot be vertically moved, it is not separated from the large substrate 11. The plurality of concave and convex structures 114 and 126 may not be provided in the plurality of inner walls 113 and the plurality of outer walls 125, or only one of the plurality of concave and convex structures 114 and 126 may be provided.

As shown in FIG. 1, the cross section of the plurality of penetration holes 112 and the plurality of grinding units 12 of the large substrate 11 may be circular or polygonal, such as a square or the like.

The plurality of polishing units 12 of the present embodiment are higher than the large substrate 11, and the height of the plurality of polishing units 12 determines the height of the plurality of cutting ends 123 of the plurality of abrasive grains 121 protruding from the bonding surface 110 of the large substrate 11. The difference in height of the plurality of cutting ends 123 protruding from the large substrate 11 is within 20 microns, so that the difference in height between the plurality of cutting ends 123 and a plane 15 is within 20 microns. The plurality of cutting ends 123 protrude from the joint surface 110 of the large substrate 11 to a height of 0.05 to 5 mm.

As shown in FIGS. 2 and 3, the combined dresser 2 of the second embodiment of the present invention is compared with the structure of the combined dresser 1 of the first embodiment described above, except that the plurality of penetration holes 212 of the large substrate 21 are tapered. The aperture is upper and lower, and the inner wall 213 has a different inclination angle of 1 to 15 degrees, and the rest of the structure is substantially the same. The large substrate 21 is provided with a bonding surface 210, a bottom surface 211 and a plurality of penetration holes 212 corresponding to the plurality of polishing units 12, and the plurality of inner walls 213 of the large substrate 21 forming the plurality of penetration holes 212 also have a plurality of concave and convex portions opposite to the plurality of concave and convex structures 126. Structure 214; the plurality of grinding units 12 are respectively disposed in the plurality of penetration holes 112, and the other surfaces 124 of the plurality of abrasive grains 121 are respectively embedded in the lower end of the plurality of penetration holes 212 having a narrow aperture, and are in the same reference plane as the bottom surface 211 14. The binding is then fixed by the bonding agent 22. In the grinding operation, the plurality of grinding units 12 are prevented from moving vertically when subjected to pressure, and the plurality of penetrating holes 212 are tapered so that when the plurality of grinding units 12 are subjected to pressure, the side of the small number of the penetrating holes 212 cannot be reciprocated. And more solid. The plurality of concave and convex structures 214 and 126 may not be provided in the plurality of inner walls 213 and the plurality of outer walls 125, or only one of the plurality of concave and convex structures 214 and 126 may be provided.

As shown in Figs. 2, 4A and 4B, the combined dresser 3 of the third embodiment of the present invention is compared with the structure of the combined dresser 1 of the first embodiment described above, except that the plurality of grinding units 31 are shorter than the large substrate 11, respectively. The other structures are substantially the same except that the height of the bonding surface 31 of the large substrate 11 is different by controlling the thickness of the template 32 to control the plurality of polishing units 31. The plurality of grinding units 31 are also composed of a plurality of small substrates 310 combined with a plurality of abrasive grains 311; one side 312 of the small substrate 310 is combined with a plurality of abrasive grains 311; the abrasive grains 311 have a cutting end 313 capable of cutting a workpiece; The other surface 314 provided with the plurality of abrasive grains 311 is placed in the penetration hole 112 of the large substrate 11, and the other surface 314 is higher than the bottom surface 111; the bonding agent 13 closes the penetration hole 112 of the bottom surface 111 of the large substrate 11. The plurality of inner walls 113 of the large substrate 11 forming the plurality of penetration holes 112 and the plurality of outer walls 315 of the plurality of polishing units 31 respectively have opposite complex concave and convex structures 114, 316. The plurality of concave-convex structures 214 and 316 may not be provided in the plurality of inner walls 213 and the plurality of outer walls 315, or only one of the plurality of concave-convex structures 214 and 316 may be provided. The template 232 can be a metal plate.

As shown in FIG. 4B, in the embodiment, the template 32 is combined with the large substrate 11, and the cutting ends 313 of the plurality of polishing units 31 are respectively passed through the plurality of penetration holes 112 of the large substrate 11 and the template 32, and the template 32 is used. The thickness controls the amount of protrusion of the plurality of polishing units 31, and then the bonding agent 13 is injected from the plurality of penetration holes 112 of the large substrate 11, the large substrate 11 is fixedly coupled to the plurality of polishing units 31, and then the template 32 is detached from the large substrate 11, forming The combined dresser 3 shown in Figure 4A.

As shown in FIG. 2 and FIG. 5, the combined refiner 4 of the fourth embodiment of the present invention is compared with the structure of the combined dresser 1 of the first embodiment, except that the large substrate 41 is provided with a plurality of accommodating slots 411 instead of The plurality of through holes 112 of the substrate 11 are substantially the same except for the plurality of penetrating holes 112. The plurality of inner walls 412 of the large substrate 41 forming the plurality of accommodating grooves 411 also have a plurality of concave and convex structures 413; the plurality of accommodating grooves 411 of the large substrate 41 respectively accommodate the plurality of polishing units 12, and the plurality of polishing units 12 protrude from the bonding surface 410; The unit 12 and the large substrate 11 are fixedly bonded by a bonding agent 13. The small substrate 120 is on the same reference plane 14 as the plurality of bottom walls 414 of the large substrate 41 forming the bottom of the plurality of receiving grooves 411 with respect to the other surface 124 on which the plurality of abrasive grains 121 are provided.

As shown in FIGS. 5 and 6, the combined dresser 5 of the fifth embodiment of the present invention is compared with the structure of the combined dresser 4 of the fourth embodiment, except for the groove of the plurality of receiving grooves 511 of the large substrate 51. The plurality of accommodating grooves 411 of the larger substrate 41 have a small groove diameter and are slightly smaller than the outer diameter of the small substrate 120, and the remaining structures are substantially the same. The plurality of accommodating grooves 511 of the large substrate 51 respectively accommodate the plurality of polishing units 12; the plurality of polishing units 12 and the large substrate 11 are fixedly coupled by tight fitting. In the present embodiment, the polishing unit 12 is mechanically pressed into the accommodating groove 511 of the large metal substrate 51, and the polishing unit 12 is fixed by the deformation amount of the uneven structure. Finally, the gap can be filled with the bonding agent.

As shown in FIGS. 5 and 7, the combined dresser 6 of the sixth embodiment of the present invention is compared with the structure of the combined dresser 4 of the fourth embodiment described above, except that the depth of the plurality of receiving grooves 611 of the large substrate 61 is smaller. The depth of the plurality of accommodating grooves 411 of the large substrate 41 is longer than the height of the small substrate 120, and the remaining structures are substantially the same. The plurality of accommodating grooves 611 of the large substrate 61 respectively accommodate the plurality of polishing units 12; the plurality of polishing units 12 and the large substrate 61 are fixedly coupled by the bonding agent 13. The plurality of small substrates 120 are spaced apart from the other bottom surface 612 of the large substrate 61 forming the bottom of the plurality of receiving grooves 611 with respect to the other surface 124 provided with the plurality of abrasive grains 121; the bonding agent 13 is filled in the plurality of abrasive grains 121, respectively. The other side 124 is between the plurality of bottom walls 612.

As shown in FIGS. 3 and 8, the combined dresser 7 of the seventh embodiment of the present invention is compared with the structure of the combined dresser 2 of the second embodiment, except that the large substrate 71 is provided with a plurality of receiving grooves 711 instead of the large one. The plurality of through holes 212 of the substrate 21 are substantially the same except for the plurality of penetrating holes 212. The groove diameter of the plurality of accommodating grooves 711 is an upper width and a narrower shape, and the inner wall 713 has an inclination angle of 1 to 15 degrees; the small substrate 120 is respectively opposed to the other surface 124 provided with the plurality of abrasive grains 121. The plurality of polishing units 12 are protruded from the lower end of the plurality of accommodating grooves 711, and the plurality of polishing units 12 protrude from the bonding surface 710; the plurality of inner walls 713 of the large substrate 71 forming the plurality of accommodating grooves 711 also have a plurality of concave and convex structures 714; 12 is fixedly bonded to the large substrate 71 by the bonding agent 22. The small substrate 120 is on the same reference plane 14 as the plurality of bottom walls 715 of the large substrate 71 forming the bottom of the plurality of receiving grooves 711 with respect to the other surface 124 on which the plurality of abrasive grains 121 are provided.

As shown in FIG. 9, the combined refiner 8 of the eighth embodiment of the present invention comprises a large substrate 81 and a plurality of polishing units 82. The large substrate 81 and the plurality of polishing units 82 are bonded or tightly bonded by a bonding agent 83. The structure may be as shown in the above-described combined dressers 1, 2, 3, 4, 5, 6, and 7 of the first to seventh embodiments of the present invention, respectively. The inner side of the large substrate 81 of the present embodiment is provided with eight polishing units 82 arranged at equal intervals in a ring shape, and four polishing units 82 arranged at equal intervals are provided inside the eight polishing units 82 arranged in a ring shape. In this embodiment, the plurality of polishing units 82 are arranged in a special manner to avoid the screw holes provided in the lower end surface of the large substrate 81.

The material of the abrasive particles of the present invention may be artificial or non-artificial diamond, polycrystalline diamond (PCD), cubic boron nitride (CBN), polycrystalline cubic boron nitride (PCBN), hardest crystal, polycrystalline material, or The above materials are composed of a mixed material or the like. The abrasive grains of the present invention can be combined with small substrates by means of high temperature and high pressure bonding, brazing, sintering, electroplating, plastic bonding or ceramic bonding.

The material of the large substrate of the present invention comprises a metal, a metal alloy, a plastic material, a ceramic product, a carbon product, and a mixture of the above materials, preferably 316L stainless steel material.

The material of the bonding agent of the present invention comprises a metal, a metal alloy, a plastic material, a ceramic material, and a mixture of the above materials, wherein the plastic material is representative of the embodiment, and a solder alloy material may also be included.

The large substrate of the present invention may be in the shape of a disk having a diameter of about 90 to 120 millimeters (mm). The small substrate may be in the shape of a disk having a diameter of about 10 to 30 mm and preferably 20 mm. The size of the abrasive particles is from 100 to 500 micrometers, preferably from 160 to 200 micrometers. The preferred embodiment of the large substrate of the present invention is made of stainless steel; the preferred embodiment of the bonding agent may be a resin material; the preferred embodiment of the method of fixing the abrasive particles to the small substrate may be by resin bonding or by containing chromium or titanium. The copper-zinc alloy is bonded; the outer surface of the small substrate has a nickel-containing plating layer.

The invention utilizes a combined method to first make a plurality of grinding units. The small grinding unit is relatively easy to make the cutting ends of the plurality of abrasive grains at the same height, and then the large substrate is combined with the plurality of grinding units to form a large-area combined dresser. It is easier to make the cutting ends of the majority of the abrasive particles of the large area combined dresser at the same height. The invention has the advantages that the manufacturing of the small grinding unit is low in cost, and the combined dresser can change different abrasive grains as needed. For example, the outer ring of the combined dresser can use a larger size diamond, and the inner ring can be made smaller in size. Diamonds; or the outer ring can be used with poor cutting ability, but more wear-resistant, crystal-shaped diamonds, the inner ring can be used with good cutting ability, but not wear-resistant, crystal-shaped diamonds. The diamond particles of the same small grinding unit have the same size, shape and material, but the diamond particles of the plurality of grinding units in the combined dresser may have the same or different diamond size, shape and material. By combining a plurality of grinding units into a larger combined dresser, the cutting speed and wear rate of the combined dresser can be controlled.

The above description is only for the embodiments of the present invention, and any modifications and variations made by those skilled in the art using the present invention are the scope of the invention claimed, and are not limited to the embodiments disclosed.

1, 2, 3, 4, 5, 6, 7, 8. . . Combined dresser

11, 21, 41, 51, 61, 71, 81. . . Large substrate

110, 210, 410, 710. . . Joint surface

111, 211. . . Bottom

112, 212. . . Penetrating hole

113, 213, 412, 713. . . Inner wall

114, 214, 126, 316, 413, 714. . . Concave structure

12, 31, 82. . . Grinding unit

120, 310. . . Small substrate

121, 311. . . Abrasive grain

122, 312. . . surface

123, 313. . . Cutting end

124, 314. . . the other side

125, 315. . . Outer wall

13, 22, 83. . . Binding agent

14. . . Datum plane

15. . . flat

32. . . template

411, 511, 611, 711. . . Locating slot

414, 612, 715. . . Bottom wall

1 is a schematic view of a combined dresser according to a first embodiment of the present invention.

FIG. 2 is a schematic view of the AA cross section of FIG. 1. FIG.

3 is a schematic cross-sectional view of a combined dresser in accordance with a second embodiment of the present invention.

4A is a schematic cross-sectional view of a combined dresser in accordance with a third embodiment of the present invention.

4B is a schematic view showing a combined dresser according to a third embodiment of the present invention.

Figure 5 is a schematic view of a combined dresser in accordance with a fourth embodiment of the present invention.

Figure 6 is a cross-sectional view showing a combined dresser in accordance with a fifth embodiment of the present invention.

Figure 7 is a cross-sectional view showing a combined dresser according to a sixth embodiment of the present invention.

Figure 8 is a cross-sectional view showing a combined dresser in accordance with a seventh embodiment of the present invention.

Figure 9 is a cross-sectional view showing a combined dresser in accordance with an eighth embodiment of the present invention.

1. . . Combined dresser

11. . . Large substrate

110. . . Joint surface

111. . . Bottom

112. . . Penetrating hole

113. . . Inner wall

114, 126. . . Concave structure

12. . . Grinding unit

120. . . Small substrate

121. . . Abrasive grain

122. . . surface

123. . . Cutting end

124. . . the other side

125. . . Outer wall

13. . . Binding agent

14. . . Datum plane

15. . . flat

Claims (22)

A combined dresser, which is a trimmer for a CMP polishing pad, comprising: a large substrate, which is provided with a bonding surface, a bottom surface, and a plurality of through holes or a plurality of receiving grooves; the plurality of through holes are In the shape of a cone, the aperture of the plurality of through holes is a shape of an upper width and a lower width; the plurality of accommodating grooves have a tapered shape, and a groove diameter of the plurality of accommodating grooves is a shape of an upper width and a lower width; and the plurality of grinding units respectively have a plurality of shapes The plurality of abrasive grains respectively have a plurality of cutting ends; the plurality of grinding units respectively have a small substrate; and the plurality of small substrates are respectively provided with the plurality of abrasive grains; wherein the plurality of small substrates are opposite to the plurality of abrasive grains The other side of the lower end of the plurality of apertures that are embedded in the plurality of through holes or the one of the lower ends of the plurality of slots that are respectively embedded in the plurality of receiving slots, so that the plurality of through holes or the plurality of holes One of the plurality of accommodating grooves respectively accommodating the plurality of grinding units, wherein the plurality of cutting ends respectively protrude the bonding surface; and the plurality of grinding units and the large substrate are fixed by bonding or tightly bonding one of the bonding materials Combine A plurality of abrasive grains and a plurality of end cutting plane height differences within 20 microns, respectively. The combination dresser of claim 1, wherein the large substrate is provided with a plurality of through holes; the small substrate is identical to the bottom surface of the large substrate with respect to the other surface on which the plurality of abrasive grains are provided Datum plane. The combined dresser of claim 1, wherein the large substrate is provided with a plurality of accommodating grooves; and the small substrate forms the complex volume with the large substrate with respect to the other surface on which the plurality of abrasive grains are provided The bottom walls of the bottom of the groove are in the same reference plane. The combination dresser of claim 1, wherein the large substrate forms a plurality of inner walls of the plurality of penetration holes at an inclination angle of 1 to 15 degrees. The combined dresser of claim 1, wherein the large substrate forms a plurality of inner walls of the plurality of receiving grooves at an inclination angle of 1 to 15 degrees. The combination dresser according to any one of the preceding claims, wherein the large substrate forms a plurality of inner walls of the plurality of through holes or one of the plurality of receiving grooves and the plurality of grinding At least one of the plurality of outer walls of the unit has a plurality of concave and convex structures. The combination dresser of claim 6, wherein the material of the large substrate comprises one of a metal, a metal alloy, a plastic material, a ceramic product, a carbon product, and a mixture of the above materials. The combination dresser of claim 7, wherein the material of the large substrate is 316L stainless steel. The combination dresser of claim 8, wherein the plurality of abrasive particles and the small substrate are fixedly bonded by one of high temperature and high pressure bonding, brazing, sintering, electroplating, plastic bonding or ceramic bonding. The combination dresser of claim 9, wherein the large substrate is disc-shaped and has a diameter of 90-120 mm. The combination dresser of claim 10, wherein the small substrate is disc-shaped and has a diameter of 10-30 mm. The combination dresser of claim 11, wherein the abrasive particles have a size of from 100 to 500 microns. The combination dresser of claim 12, wherein the abrasive particles have a size of from 160 to 200 microns. The combined dresser of claim 6, wherein one of the plurality of penetration holes or the plurality of accommodating grooves and the plurality of grinding units has a circular or polygonal cross section. The combination dresser of claim 14, wherein the inner side of the large substrate is provided with eight polishing units arranged at equal intervals in a ring shape. The combination dresser of claim 15, wherein the inner sides of the eight polishing units are provided with four polishing units arranged at equal intervals. The combination dresser of claim 16, wherein the plurality of abrasive particles and the small substrate are fixedly bonded by one of high temperature and high pressure bonding, brazing, sintering, electroplating, plastic bonding or ceramic bonding. The combination dresser of claim 17, wherein the bonding agent is respectively infiltrated into the plurality of concave and convex structures, and respectively bonded to the plurality of inner walls and the plurality of outer walls; the material of the bonding agent comprises a metal, a metal alloy, Plastic material, ceramic material, and a mixture of the above materials. The combination dresser of claim 18, wherein the material of the bonding agent is an epoxy resin material. The combination dresser of claim 6, wherein the bonding agent is respectively infiltrated into the plurality of concave and convex structures, and respectively bonded to the plurality of inner walls and the plurality of outer walls; the material of the bonding agent comprises a metal, a metal alloy, Plastic material, ceramic material, and a mixture of the above materials. The combination dresser of claim 20, wherein the material of the bonding agent is an epoxy resin material. The combination dresser of claim 21, wherein the plurality of abrasive particles and the small substrate are fixedly bonded by one of high temperature and high pressure bonding, brazing, sintering, electroplating, plastic bonding or ceramic bonding.