TW569256B - Electrode materials with improved hydrogen degradation resistance and fabrication method - Google Patents
Electrode materials with improved hydrogen degradation resistance and fabrication method Download PDFInfo
- Publication number
- TW569256B TW569256B TW091105777A TW91105777A TW569256B TW 569256 B TW569256 B TW 569256B TW 091105777 A TW091105777 A TW 091105777A TW 91105777 A TW91105777 A TW 91105777A TW 569256 B TW569256 B TW 569256B
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- Taiwan
- Prior art keywords
- layer
- electrode
- metal
- forming
- ferroelectric
- Prior art date
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- 239000001257 hydrogen Substances 0.000 title claims abstract description 21
- 229910052739 hydrogen Inorganic materials 0.000 title claims abstract description 21
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000007772 electrode material Substances 0.000 title description 10
- 230000015556 catabolic process Effects 0.000 title description 4
- 238000006731 degradation reaction Methods 0.000 title description 4
- 238000004519 manufacturing process Methods 0.000 title description 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 30
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 27
- 238000000151 deposition Methods 0.000 claims abstract description 18
- 238000002161 passivation Methods 0.000 claims abstract description 16
- 239000010936 titanium Substances 0.000 claims abstract description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000001301 oxygen Substances 0.000 claims abstract description 13
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 13
- 229910052741 iridium Inorganic materials 0.000 claims abstract description 10
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 10
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 5
- 230000002079 cooperative effect Effects 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 4
- 229910052786 argon Inorganic materials 0.000 claims 2
- 229910044991 metal oxide Inorganic materials 0.000 claims 1
- 150000004706 metal oxides Chemical class 0.000 claims 1
- 150000002739 metals Chemical class 0.000 abstract description 6
- 238000000137 annealing Methods 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 description 15
- 239000007789 gas Substances 0.000 description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000005621 ferroelectricity Effects 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- -1 pt or Ir) Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/75—Electrodes comprising two or more layers, e.g. comprising a barrier layer and a metal layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/0223—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate
- H01L21/02244—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by oxidation, e.g. oxidation of the substrate of a metallic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/02227—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process
- H01L21/02255—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a process other than a deposition process formation by thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/3165—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation
- H01L21/31683—Inorganic layers composed of oxides or glassy oxides or oxide based glass formed by oxidation of metallic layers, e.g. Al deposited on the body, e.g. formation of multi-layer insulating structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/55—Capacitors with a dielectric comprising a perovskite structure material
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
Description
569256 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(1 ) 發明範圍 本發明係關於I C電極材料,特定言之,係關於具有 改良之抗氫降解性的電極材料。 發明背景 鉑(P t )曾被廣泛用於以鐵電爲主的電容器和裝置 之頂和底電極。可以進行高溫氫鍛鍊以測試鐵電積層的整 體性和性質。使用P t作爲頂電極的主要缺點在於其於氫 存在時的催化本質。已發現P t頂電極的整體性在4 0 0 °C形成氣鍛鍊3 0秒鐘期間內便會嚴重受損。此請參考 Fuj isaki 等人,Degradation- free ferroelectric (P b ( Z r,T i )〇3) thin film capacitor swith I r 0 2 top electrode (具I r〇2頂電極的無降解鐡電( Pb(Zr,Ti)〇3)薄膜電容器),Integrated Ferroelectrics, 24_, 83-85(1998)。此外,P t 加速 Η 2 分子分 解成原子態氫,此氫會攻擊以氧化物爲主的鐵電材料其使 其去氧化,因此降低其鐵電性。 已經知道氧化鈦(T i 0 2 )在氫常態鍛煉時具有鈍化 性。非常薄的A 1 2〇3層也能夠有效保護鐡電電容器’但 使用T i〇2或A 1 2〇3須要額外澱積步驟(以藉c V D 爲佳)以達到良好的逐步覆蓋率。 發明槪述 鐡電裝置中所用電極包括底電極;鐵電層;和頂電極 (請先閲讀背面之注意事項再填寫本頁) -裝· 訂 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -4- 569256 A7 B7 五、發明説明(2 ) (請先閲讀背面之注意事項再填寫本頁) ’形成於鐵電層上並製自金屬組合,包括第一種金屬(選 自鉑和銥)和第一種金屬(選自銘和欽),其中,頂電極 作爲鈍化層。 形成鐵電裝置中之具抗氫電極的方法包括形成底電極 ,在底電極上形成鐵電層;在鐵電層上激積頂電極;包括 同時澱積第一種金屬(選自鉑和銥)和第二種金屬(選自 鋁和鈦);及藉由在氧環境中鍛鍊前述步驟得到的結構, 在頂電極上形成氧化物鈍化層地形成鈍化層。 本發明的一個目的是要提出一種電極材料,其可用於 非短暫記憶裝置、D R A Μ、電容器、熱電紅外光感知器 、光學顯示器、光學開關、壓電能量轉換器和表面聲波裝 置。 本發明的另一目的是提出一種具有改良之抗氫降解性 的電極材料。 本發明的另一目的是提出一種在鐵電電容器或裝置經 歷溫度範圍約3 0 0 °C至5 0 0 t的典型氫常態鍛鍊之後 ’能夠維持整體性和鐵電性的電極材料。 經濟部智慧財產局員工消費合作社印製 提出本發明的槪述和目的以便能夠更迅速瞭解本發明 的本質。參考本發明的較佳實施例詳述和附圖,能夠更瞭 解本發明。 附圖簡沭 附圖1是經Ti〇2覆蓋的I r— Al — 0/ΡΖΤ/ P t/I r電容器在形成氣體鍛鍊之前和之後的磁滯圖。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X抓公釐) -5- 569256 A7 B7____ 五、發明説明(3 ) (請先閱讀背面之注意事項再填寫本頁} 附圖2是附圖1之經T i〇2覆蓋的I r — A 1 一 〇 P Z T/P t / I r電容器在形成氣體鍛鍊之前和之後的 漏電電流圖。 附圖3是經Ti〇2覆蓋的P t/PZT/P t/I r 電容器在形成氣體於4 Ο 0 鍛鍊1 〇分鐘之則和之後的 磁滯圖。 附圖4是附圖3之經T i〇2覆蓋的P t / Ρ Ζ 丁/ P t/I r電容器在形成氣體於4 0 0 °C鍛鍊1 0分鐘之 前和之後的漏電電流圖。 附圖5是I r 一 Al —〇/PZT/Pt/I r電容 器在形成氣體於4 0 0 °C鍛鍊之前和之後的磁滯圖。 附圖6是附圖5的I r— A 1 — 0/ΡΖΤ/Ρ t/ I r電容器在形成氣體於4 Ο 0 °C鍛鍊之前和之後的漏電 電流圖。 附圖 7 是 P t-A 1 — 0/PZT/P t/I r 電容 器在形成氣體鍛鍊之前和之後的磁滯圖。 附圖8是附圖7的P t— A 1 — 0/ΡΖΤ/Ρ t/ 經濟部智慧財產局員工消費合作社印製 I r電容器在形成氣體鍛鍊之前和之後的漏電電流圖。 較佳實施例之詳述 此處所述材料可以作爲底和頂電極且特別適合作爲頂 電極,以防止以鐵電爲基礎的電容器和非短暫記憶體於製 程中的氫常態鍛鍊期間內之鐵電性質降低。這些材料亦可 用以製造D R A Μ、感知器、顯示器和電能轉換器。本發 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) -6 - 569256 Α7 Β7 五、發明説明(4 ) (請先閱讀背面之注意事項再填寫本頁) 明的電極材料包括貴重或惰性金屬(如:p t或I r ), 其與另一高導電性金屬(如:A 1或T i )同時澱積。此 電極材料可藉由在氫環境中鍛鍊之前,在氧常態環境下一 倂噴濺或物理蒸鍍(P V D ) P t或I r和A丨或丁 i而 澱積。 通常須要後澱積鍛鍊以使得頂電極的抗氫常態锻鍊性 更有效。以S E Μ分析,此膜於氧環境中鍛鍊之後,發現 I r - A 1 —〇電極表面上有充電情況,顯示在表面上形 成絕緣材料薄層。此絕緣層可能是A 1 2 〇 3層或富含 A 1 2〇3的層。此於原處形成的A 1 2〇3層作爲鈍化層以 於氫常態鍛鍊期間內保護電極和位於下方的鐵電材料。四 點探針測試顯示I r - A 1 -〇膜在此氧常態鍛鍊之後仍 具導電性。 經濟部智慧財產局員工消費合作社印製 例如,I r — A 1 — ◦層可藉由在含有A r和〇2流( 流率比介於約1 : 1 0至1 0 : 1 )的〇2常態環境中,於 槽壓介於約2毫托耳至1 0 0毫托耳之間的條件下,在約 5 0瓦至5 0 0瓦於各標的上以D C —倂噴濺I r和A 1 標的而澱積。後澱積鍛鍊於〇2常態下於約4 0 0 °C至 7 0 〇 °C進行1 0秒鐘至1小時。可於類似條件下澱積和 鍛鍊P t - A 1 - ◦層。此處所謂的高溫鍛鍊是指於或高 於4〇0 °C鍛鍊。 形成三種不同電極組成物:P t (示於附圖3和4 ) 、I r— A1 —〇(示於附圖1 、2、5和6)及Pt — A 1 —〇(示於附圖8 )澱積於P b ( Z I* ,T i )〇3鐵 本紙張ϋ適用中國國家標準( CNS ) A4規格(210X297公釐) 一 569256 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(5 ) 電氧化物(P z T )上作爲頂電極’藉此得到試驗結果。 一些Pt和I r 一 A1—〇電極被Ti〇2所覆蓋’此 T i〇2藉噴濺而澱積,此分別示於附圖3和4及1和2, 未經覆蓋者示於附圖5和6。結構之製造包括形成底電極 (藉P t或I r澱積而形成),在底電極上形成鐵電層, 及形成根據本發明之頂電極。具A 1或T i金屬結構作爲 頂電即的一部分先在〇2環境中鍛鍊。抗氫損壞性的測試方 式是:整個結構在含5 % Η 2的形成氣體於4 0 0 °C鍛鍊。 這樣的測試可於約3 %至1 5 %氫環境中進行,剩餘的百 分比是氮,試驗溫度介於約3 ◦ 0 °C至5 0 0 t之間。 於4 0 0 °C鍛鍊僅3 0秒鐘之後,裸露的P t頂電極 嚴重剝落。覆有T i〇2的P t電極(附圖3和4 )於鍛鍊 1 6分鐘之後仍維持良好整體性。無論是否有T i〇2層存 在,I r 一 A 1 - 0電極在鍛鍊之後仍維持良好整體性( 附圖1、2、5和6 )。類似地,無論是否有T i〇2層存 在,P t - A 1 - ◦電極於持續鍛鍊1 5分鐘之後亦維持 良好整體性(附圖7和8 )。 Pt/PZT/Pt/I r 和 I r— A1—〇/ PZT/P t/I r形成並覆有T i〇2層的電極在經過形 成氣鍛鍊之後仍維持約2 / 3原有極化性,但在形成氣鍛 鍊期間內’這些結構的漏電電流提高,隨著鍛鍊時間增長 ,漏電提商,此不於附圖1 — 4。I r— A1—〇/ PZT/P t/I r結構(附圖5和6)因爲有T i〇2覆 蓋結構,所以漏電情況未擴大。持續於形成氣中鍛鍊1 6 (請先閱讀背面之注意事項再填寫本頁} 本紙張尺度適用中.國國家標準(CNS ) A4規格(210X297公釐) -8- 569256 A7 B7 五、發明説明(6 ) 分鐘之後,極化性約減半。沒有任何T i〇2保護的p t 一 A 1 —〇/ P Z T / P t / I r結構得到最佳結果(附圖 7和8 ),其中,即使持續於形成氣中鍛鍊1 6分鐘,極 化性維持幾乎相同。 總言之,可藉PVD、CVD或MOCVD法顧積而 使用數種電極材料形成鐵電裝置,如·· I r 一 A 1 _ 〇、 I r— Ti —〇、Pt-Al — 〇、Pt-Ti —〇。所 澱積的Ir-Al —〇、Ir-Ti —〇、 P t — A 1 —〇、p t 一 T i —〇膜在氧中於4 〇 〇。〇至 7 Ο 0 °C鍛鍊1 〇秒鐘至1小時,以在複合電極表面上得 到A 1 2〇3絕緣薄層、富含a 1 2〇3的層、T i〇2層或 富含T i〇2的層,以作爲鈍化層之用。 因此’提出一種使具有改良之抗氫降解性的電極材料 澱積的方法及其製法。應瞭解能夠在所附申請專利範圍定 我出的本發明範圍內作出進一步變化和修飾。 (請先閱讀背面之注意事項再填寫本頁) -裝- 、11 經濟部智慧財產局員工消費合作社印製 本紙張尺度適财酬家辟(CNS) (2丨Gx297公慶) -9 -
Claims (1)
- 569256 A8 B8 C8 D8 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 1 1 · 一種用於鐵電裝置的電極,其特徵爲其包含: 底電極; 鐵電層;及 頂電極,形成於鐵電層上並製自金屬組合,包括第一 種金屬(選自鉑和銥)和第二種金屬(選自鋁和鈦),其 中,該頂電極作爲鈍化層。. 2 ·如申請專利範圍第1項之電極,其中,該頂電極 包括金屬和金屬‘氧化物之組合,選自I r — A 1 -〇、 I r— Ti —〇、Pt— A1 — 〇和 Pt-I r —〇。 3 .如申§靑專利範圍第2項之電極,其中,金屬氧化 物選自A 1 2〇3和T i〇2。 4 ·如申請專利範圍第1項之電極,其中,經過在氫 環境中高溫鍛鍊之後,該頂電極維持導電性。 5 · —種形成在鐵電裝置中之抗氫電極的方法,其特 徵爲其包含: a) 形成底電極; b) 在底電極上形成鐵電層; c )在鐵電層上澱積頂電極,其中,該澱積包括同時 澱積第一種金屬(選自鉑和銥)和第二種金屬(選自鋁和 鈦);及 d )藉由使步驟a ) - c )得到的結構在氧環境中鍛 鍊而在頂電極上形成氧化物鈍化層地形成鈍化層。 6 ·如申請專利範圍第5項之方法,其中,·該d )形 成鈍化層包括形成氧化物層,此氧化物層選自A 1 2 0 3層 (請先閲讀背面之注意事 -項再填· 窝本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -10- 569256 A8 B8 C8 D8 經濟部智慧財產局員工消費合作社印製 六、申請專利範圍 2 ,富含A 1 2〇3的層、T i〇2層和富含τ i〇2的層。 7 ·如申請專利·範圍第5項之方法,其中,該d )形 成鈍化層包括使結構在氧環境中於約4 0 0 °C至7 0 0 °C 鍛鍊約1 0秒鐘至1小時。 8 ·如申請專利範圍第5項之方法,其中,該c )澱 積包括於約5 0瓦和5 0 .0瓦之間於氧環境(氬和氧流率 介於約1 : 1 ◦和1 0 : 1之間)中,槽壓介於約2毫托 耳和1 0 0毫托耳之間的條件下,以D C —倂噴濺第一種 金屬和第二種金屬。 9 · 一種形成鐵電裝置中之抗氫電極的方法,其特徵 爲其包含= a )形成底電極; b)在底電極上形成鐵電層; c )在鐵電層上澱積頂電極,其中,該澱積包括同時 澱積第一種金屬(選自鉑和銥)和第二種金屬(選自銘和 鈦);及 d )形成鈍化層,包括形成氧化物層(選自a 1 2〇3 層,富含A 1 2〇3的層、T i〇2層和富含T i〇2的層) ,及使步驟a ) - c )得到的結構在氧環境中鍛鍊而在頂 電極上形成氧化物鈍化層。 1 0 .如申請專利範圍第9項之方法,其中,該d ) 形成鈍化層包括使結構在氧環境中於約4 0 〇 °c至7 0 0 °C鍛鍊約1 〇秒鐘至1小時。 1 1 ·如申請專利範圍第9項之方法,其中,該c ) (請先閲讀背面之注意事 •1 項再填 裝-- 寫本頁) 訂 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公嫠) -11 - 569256 A8 B8 C8 D8六、申請專利範圍 3 澱積包括於約5 0瓦和5 0 0瓦之間於氧環境(氬和氧流 率介於約1 : 1 0和.1 0 : 1之間)中,槽壓介於約2毫 托耳和1 0 0毫托耳之間的條件下,以D C —倂噴濺第一 種金屬和第二種金屬。 (請先閲讀背面之注意事項再填寫本頁) _ 項再填」 裝· 訂 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -12-
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TW396602B (en) * | 1997-06-30 | 2000-07-01 | Hyundai Electronics Ind | Highly integrated memory cell and method of manufacturing thereof |
DE19737323A1 (de) * | 1997-08-28 | 1999-03-11 | Philips Patentverwaltung | Dünnschichtkondensator mit Schichtelektrode |
KR20000045234A (ko) * | 1998-12-30 | 2000-07-15 | 김영환 | 반도체 소자의 커패시터 형성방법 |
US6190963B1 (en) * | 1999-05-21 | 2001-02-20 | Sharp Laboratories Of America, Inc. | Composite iridium-metal-oxygen barrier structure with refractory metal companion barrier and method for same |
US6399521B1 (en) * | 1999-05-21 | 2002-06-04 | Sharp Laboratories Of America, Inc. | Composite iridium barrier structure with oxidized refractory metal companion barrier and method for same |
JP2000349245A (ja) * | 1999-06-02 | 2000-12-15 | Sony Corp | 誘電体キャパシタおよびメモリならびにそれらの製造方法 |
-
2001
- 2001-03-26 US US09/817,712 patent/US6440752B1/en not_active Expired - Fee Related
-
2002
- 2002-03-18 JP JP2002075137A patent/JP3942159B2/ja not_active Expired - Fee Related
- 2002-03-25 DE DE60236708T patent/DE60236708D1/de not_active Expired - Lifetime
- 2002-03-25 EP EP02006830A patent/EP1246231B1/en not_active Expired - Lifetime
- 2002-03-25 TW TW091105777A patent/TW569256B/zh not_active IP Right Cessation
- 2002-03-25 KR KR10-2002-0016142A patent/KR100515179B1/ko not_active IP Right Cessation
- 2002-08-27 US US10/229,603 patent/US6833572B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1246231A3 (en) | 2004-12-15 |
JP3942159B2 (ja) | 2007-07-11 |
US6440752B1 (en) | 2002-08-27 |
US20030007319A1 (en) | 2003-01-09 |
EP1246231B1 (en) | 2010-06-16 |
US6833572B2 (en) | 2004-12-21 |
EP1246231A2 (en) | 2002-10-02 |
JP2002319660A (ja) | 2002-10-31 |
KR20020076148A (ko) | 2002-10-09 |
KR100515179B1 (ko) | 2005-09-16 |
DE60236708D1 (de) | 2010-07-29 |
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