TW564565B - Passivation-material for an electric component as well as piezo-electrical component in several-layer construction - Google Patents
Passivation-material for an electric component as well as piezo-electrical component in several-layer construction Download PDFInfo
- Publication number
- TW564565B TW564565B TW091108460A TW91108460A TW564565B TW 564565 B TW564565 B TW 564565B TW 091108460 A TW091108460 A TW 091108460A TW 91108460 A TW91108460 A TW 91108460A TW 564565 B TW564565 B TW 564565B
- Authority
- TW
- Taiwan
- Prior art keywords
- blunt
- piezoelectric
- layer
- patent application
- scope
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 142
- 238000010276 construction Methods 0.000 title abstract 2
- 229920002635 polyurethane Polymers 0.000 claims abstract description 20
- 239000004814 polyurethane Substances 0.000 claims abstract description 20
- 239000000919 ceramic Substances 0.000 claims description 23
- 229920003023 plastic Polymers 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004816 latex Substances 0.000 claims description 3
- 229920000126 latex Polymers 0.000 claims description 3
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- -1 polyparaxylylene Polymers 0.000 claims description 2
- 229920000962 poly(amidoamine) Polymers 0.000 claims 1
- 238000002161 passivation Methods 0.000 abstract description 7
- 229920002379 silicone rubber Polymers 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 87
- 239000002184 metal Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000005060 rubber Substances 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 7
- 230000035882 stress Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 235000004977 Brassica sinapistrum Nutrition 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000032798 delamination Effects 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 150000004702 methyl esters Chemical class 0.000 description 5
- 244000188595 Brassica sinapistrum Species 0.000 description 4
- 238000005187 foaming Methods 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920001973 fluoroelastomer Polymers 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- 240000002791 Brassica napus Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241001247287 Pentalinon luteum Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000002522 swelling effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
Landscapes
- Fuel-Injection Apparatus (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Ceramic Capacitors (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10121270A DE10121270A1 (de) | 2001-04-30 | 2001-04-30 | Passivierungsmaterial für ein elektrisches Bauteil sowie piezoelektrisches Bauteil in Vielschichtbauweise |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW564565B true TW564565B (en) | 2003-12-01 |
Family
ID=7683335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091108460A TW564565B (en) | 2001-04-30 | 2002-04-24 | Passivation-material for an electric component as well as piezo-electrical component in several-layer construction |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6930438B2 (enExample) |
| EP (1) | EP1393386B1 (enExample) |
| JP (1) | JP4465154B2 (enExample) |
| CN (1) | CN100373650C (enExample) |
| AT (1) | ATE415709T1 (enExample) |
| DE (2) | DE10121270A1 (enExample) |
| TW (1) | TW564565B (enExample) |
| WO (1) | WO2002089225A2 (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10055241A1 (de) * | 2000-11-08 | 2002-05-29 | Epcos Ag | Piezoaktor |
| DE10259949A1 (de) * | 2002-12-20 | 2004-07-01 | Robert Bosch Gmbh | Piezoaktor |
| DE10347774B4 (de) * | 2003-10-14 | 2006-04-13 | Siemens Ag | Aufnahmehülse für einen Aktorkörper |
| US7564169B2 (en) * | 2003-10-14 | 2009-07-21 | Siemens Aktiengesellschaft | Piezo actuator and associated production method |
| DE102004005227A1 (de) * | 2004-02-03 | 2005-08-18 | Robert Bosch Gmbh | Piezoaktor mit mindestens einem Paar Innenelektroden |
| US7786652B2 (en) * | 2004-03-29 | 2010-08-31 | Kyocera Corporation | Multi-layer piezoelectric element |
| US7077379B1 (en) * | 2004-05-07 | 2006-07-18 | Brunswick Corporation | Fuel injector using two piezoelectric devices |
| JP4983010B2 (ja) * | 2005-11-30 | 2012-07-25 | 富士通株式会社 | 圧電素子及びその製造方法 |
| GB0602955D0 (en) * | 2006-02-14 | 2006-03-29 | Delphi Tech Inc | Piezoelectric actuator |
| WO2007093921A2 (en) * | 2006-02-14 | 2007-08-23 | Delphi Technologies, Inc. | Barrier coatings for a piezoelectric device |
| JP4752562B2 (ja) * | 2006-03-24 | 2011-08-17 | ヤマハ株式会社 | 鍵駆動装置及び鍵盤楽器 |
| DE102006019047A1 (de) * | 2006-04-25 | 2007-10-31 | Robert Bosch Gmbh | Piezoaktor mit einer Ummantelung |
| JP5211553B2 (ja) * | 2006-06-27 | 2013-06-12 | コニカミノルタアドバンストレイヤー株式会社 | アクチュエータ素子、及びアクチュエータ素子の製造方法 |
| US7681290B2 (en) * | 2006-10-20 | 2010-03-23 | The Boeing Company | Piezoelectric bimorph beam manufacturing method |
| US8410663B2 (en) * | 2006-10-20 | 2013-04-02 | Kyocera Corporation | Piezoelectric actuator unit having a stress relieving layer and method for manufacturing the same |
| US8212451B2 (en) * | 2006-10-31 | 2012-07-03 | Kyocera Corporation | Multi-layer piezoelectric element having a plurality of junction sections and injection apparatus employing the same |
| DE102007016871A1 (de) * | 2007-04-10 | 2008-10-16 | Robert Bosch Gmbh | Piezoelektrischer Aktor |
| DE102007037500A1 (de) * | 2007-05-11 | 2008-11-13 | Epcos Ag | Piezoelektrisches Vielschichtbauelement |
| DE102007037553A1 (de) * | 2007-08-09 | 2009-02-12 | Robert Bosch Gmbh | Piezoelektrisches Aktormodul |
| DE102007056553A1 (de) | 2007-11-23 | 2009-05-28 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Piezoaktormoduls mit einer Umhüllung und ein so hergestelltes Piezoaktormodul |
| DE102008029185A1 (de) | 2008-06-19 | 2009-12-24 | Epcos Ag | Piezoelektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Kontaktes |
| DE102012207276B4 (de) | 2011-08-01 | 2018-04-05 | Continental Automotive Gmbh | Vollaktiver Piezostack mit Passivierung |
| DE102011090156A1 (de) * | 2011-12-30 | 2013-07-04 | Continental Automotive Gmbh | Piezostack mit Passivierung und Verfahren zur Passivierung eines Piezostacks |
| JP5842635B2 (ja) * | 2012-01-27 | 2016-01-13 | Tdk株式会社 | 積層型圧電素子 |
| JP5720647B2 (ja) * | 2012-09-03 | 2015-05-20 | トヨタ自動車株式会社 | 半導体装置及びその製造方法 |
| CN108002865B (zh) * | 2017-11-29 | 2020-05-29 | 歌尔股份有限公司 | 功能陶瓷元件及在功能陶瓷层上形成电极的方法 |
| US10748564B2 (en) * | 2018-01-25 | 2020-08-18 | Magnecomp Corporation | Multi-layer microactuators for hard disk drive suspensions |
| JP7431798B2 (ja) | 2018-07-18 | 2024-02-15 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | バリスタパッシベーション層及びその製造方法 |
| GB2579039A (en) * | 2018-11-15 | 2020-06-10 | Xaar Technology Ltd | Electrical component |
| DE102023119064A1 (de) * | 2023-07-19 | 2025-01-23 | Vega Grieshaber Kg | Vibrationssensor mit Schutzschicht und Verfahren zur Herstellung eines Vibrationssensors |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2879496A (en) * | 1948-09-30 | 1959-03-24 | Research Corp | Plastic cast ring stack transducer |
| US3509427A (en) * | 1968-05-21 | 1970-04-28 | Gen Electric | Electrolytic capacitor casing structure |
| CA1002234A (en) | 1970-12-11 | 1976-12-21 | Westinghouse Electric Corporation | Compositions and methods for preparing thermoplastic imide polymers and their precursors |
| DE7230947U (de) | 1971-08-30 | 1973-05-03 | Isec | Elektrischer Kondensator |
| MX143980A (es) | 1974-10-03 | 1981-08-17 | Physics Int Co | Mejoras a aparato que emplea una pluralidad de discos piezoelectricos |
| US4011474A (en) * | 1974-10-03 | 1977-03-08 | Pz Technology, Inc. | Piezoelectric stack insulation |
| JPS54110266A (en) * | 1978-02-17 | 1979-08-29 | Asahi Chem Ind Co Ltd | Heat resistant resin composition dispersed with fine metal powder |
| US4377652A (en) * | 1978-02-17 | 1983-03-22 | Asahi Kasei Kogyo Kabushiki Kaisha | Polyamide-imide compositions and articles for electrical use prepared therefrom |
| DE3201963C2 (de) | 1982-01-22 | 1985-08-22 | Rudolf 7896 Wutöschingen Klaschka | Kondensatorbechergehäuse, Verfahren und Vorrichtung zu seiner Herstellung |
| US4546415A (en) * | 1981-12-10 | 1985-10-08 | North American Philips Corporation | Heat dissipation aluminum electrolytic capacitor |
| US4987518A (en) * | 1988-04-11 | 1991-01-22 | Sprague Electric Company | Metal-cased electrolytic capacitor |
| US6186619B1 (en) * | 1990-02-23 | 2001-02-13 | Seiko Epson Corporation | Drop-on-demand ink-jet printing head |
| DE4201937C2 (de) * | 1991-01-25 | 1997-05-22 | Murata Manufacturing Co | Piezoelektrisches laminiertes Stellglied |
| US5218259A (en) * | 1992-02-18 | 1993-06-08 | Caterpillar Inc. | Coating surrounding a piezoelectric solid state motor stack |
| JPH065742A (ja) | 1992-06-22 | 1994-01-14 | Mitsubishi Electric Corp | 半導体装置、その封止に用いられる樹脂および半導体装置の製造方法 |
| JPH1022177A (ja) | 1996-07-05 | 1998-01-23 | Hitachi Aic Inc | ケース入りコンデンサ |
| DE19646676C1 (de) * | 1996-11-12 | 1998-04-23 | Siemens Ag | Piezoaktor mit neuartiger Kontaktierung und Herstellverfahren |
| JP3789020B2 (ja) * | 1997-02-12 | 2006-06-21 | マニー株式会社 | 縫合針及び持針器 |
| DE19818036B4 (de) * | 1998-04-22 | 2005-05-19 | Siemens Ag | Verfahren zur Herstellung eines elektrotechnischen Bauteils mit einer kunststoffpassivierten Oberfläche, derartiges Bauteil und Anwendung dieses Bauteils |
| TW432731B (en) * | 1998-12-01 | 2001-05-01 | Murata Manufacturing Co | Multilayer piezoelectric part |
| DE19909452C1 (de) * | 1999-03-04 | 2000-03-23 | Bosch Gmbh Robert | Piezoelektrischer Aktor |
| DE19910111B4 (de) * | 1999-03-08 | 2007-06-06 | Siemens Ag | Verfahren zur Herstellung eines elektrotechnischen Bauteils mit einer kunststoffpassivierten Oberfläche und Vorrichtung zum Durchführen des Verfahrens |
| DE19929598C2 (de) * | 1999-06-28 | 2001-04-26 | Epcos Ag | Elektrolyt-Kondensator mit hoher Schwingbelastbarkeit |
| DE10042893A1 (de) * | 1999-08-31 | 2001-04-26 | Kyocera Corp | Laminiertes piezoelektrisches Stellglied |
| DE10016866C2 (de) | 2000-04-05 | 2002-03-14 | Epcos Ag | Ethylenglykolmischung, Al-Elektrolyt-Kondensator mit der Ethylenglykolmischung und Verwendung der Ethylenglykolmischung |
| JP2002203997A (ja) * | 2000-12-28 | 2002-07-19 | Denso Corp | 圧電アクチュエータ |
| JP4248777B2 (ja) * | 2000-12-28 | 2009-04-02 | 株式会社デンソー | インジェクタ用圧電体素子及びその製造方法，並びにインジェクタ |
-
2001
- 2001-04-30 DE DE10121270A patent/DE10121270A1/de not_active Ceased
-
2002
- 2002-04-18 EP EP02726081A patent/EP1393386B1/de not_active Expired - Lifetime
- 2002-04-18 WO PCT/DE2002/001444 patent/WO2002089225A2/de not_active Ceased
- 2002-04-18 CN CNB028091736A patent/CN100373650C/zh not_active Expired - Lifetime
- 2002-04-18 DE DE50213060T patent/DE50213060D1/de not_active Expired - Lifetime
- 2002-04-18 AT AT02726081T patent/ATE415709T1/de not_active IP Right Cessation
- 2002-04-18 US US10/476,209 patent/US6930438B2/en not_active Expired - Lifetime
- 2002-04-18 JP JP2002586415A patent/JP4465154B2/ja not_active Expired - Lifetime
- 2002-04-24 TW TW091108460A patent/TW564565B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| ATE415709T1 (de) | 2008-12-15 |
| US20040145276A1 (en) | 2004-07-29 |
| JP4465154B2 (ja) | 2010-05-19 |
| CN1528023A (zh) | 2004-09-08 |
| US6930438B2 (en) | 2005-08-16 |
| DE10121270A1 (de) | 2003-02-06 |
| CN100373650C (zh) | 2008-03-05 |
| EP1393386A2 (de) | 2004-03-03 |
| JP2004526328A (ja) | 2004-08-26 |
| WO2002089225A2 (de) | 2002-11-07 |
| DE50213060D1 (de) | 2009-01-08 |
| WO2002089225A3 (de) | 2003-06-12 |
| EP1393386B1 (de) | 2008-11-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MK4A | Expiration of patent term of an invention patent |