ATE415709T1 - Passivierungsmaterial für ein elektrisches bauteil sowie piezoelektrisches bauteil in vielschichtbauweise - Google Patents

Passivierungsmaterial für ein elektrisches bauteil sowie piezoelektrisches bauteil in vielschichtbauweise

Info

Publication number
ATE415709T1
ATE415709T1 AT02726081T AT02726081T ATE415709T1 AT E415709 T1 ATE415709 T1 AT E415709T1 AT 02726081 T AT02726081 T AT 02726081T AT 02726081 T AT02726081 T AT 02726081T AT E415709 T1 ATE415709 T1 AT E415709T1
Authority
AT
Austria
Prior art keywords
passivation material
component
piezoelectric
layer construction
stack
Prior art date
Application number
AT02726081T
Other languages
German (de)
English (en)
Inventor
Dieter Cramer
Carsten Schuh
Original Assignee
Epcos Ag
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag, Siemens Ag filed Critical Epcos Ag
Application granted granted Critical
Publication of ATE415709T1 publication Critical patent/ATE415709T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices

Landscapes

  • Fuel-Injection Apparatus (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Ceramic Capacitors (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AT02726081T 2001-04-30 2002-04-18 Passivierungsmaterial für ein elektrisches bauteil sowie piezoelektrisches bauteil in vielschichtbauweise ATE415709T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10121270A DE10121270A1 (de) 2001-04-30 2001-04-30 Passivierungsmaterial für ein elektrisches Bauteil sowie piezoelektrisches Bauteil in Vielschichtbauweise

Publications (1)

Publication Number Publication Date
ATE415709T1 true ATE415709T1 (de) 2008-12-15

Family

ID=7683335

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02726081T ATE415709T1 (de) 2001-04-30 2002-04-18 Passivierungsmaterial für ein elektrisches bauteil sowie piezoelektrisches bauteil in vielschichtbauweise

Country Status (8)

Country Link
US (1) US6930438B2 (enExample)
EP (1) EP1393386B1 (enExample)
JP (1) JP4465154B2 (enExample)
CN (1) CN100373650C (enExample)
AT (1) ATE415709T1 (enExample)
DE (2) DE10121270A1 (enExample)
TW (1) TW564565B (enExample)
WO (1) WO2002089225A2 (enExample)

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DE10055241A1 (de) * 2000-11-08 2002-05-29 Epcos Ag Piezoaktor
DE10259949A1 (de) * 2002-12-20 2004-07-01 Robert Bosch Gmbh Piezoaktor
DE10347774B4 (de) * 2003-10-14 2006-04-13 Siemens Ag Aufnahmehülse für einen Aktorkörper
US7564169B2 (en) * 2003-10-14 2009-07-21 Siemens Aktiengesellschaft Piezo actuator and associated production method
DE102004005227A1 (de) * 2004-02-03 2005-08-18 Robert Bosch Gmbh Piezoaktor mit mindestens einem Paar Innenelektroden
US7786652B2 (en) * 2004-03-29 2010-08-31 Kyocera Corporation Multi-layer piezoelectric element
US7077379B1 (en) * 2004-05-07 2006-07-18 Brunswick Corporation Fuel injector using two piezoelectric devices
JP4983010B2 (ja) * 2005-11-30 2012-07-25 富士通株式会社 圧電素子及びその製造方法
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WO2007093921A2 (en) * 2006-02-14 2007-08-23 Delphi Technologies, Inc. Barrier coatings for a piezoelectric device
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DE102006019047A1 (de) * 2006-04-25 2007-10-31 Robert Bosch Gmbh Piezoaktor mit einer Ummantelung
JP5211553B2 (ja) * 2006-06-27 2013-06-12 コニカミノルタアドバンストレイヤー株式会社 アクチュエータ素子、及びアクチュエータ素子の製造方法
US7681290B2 (en) * 2006-10-20 2010-03-23 The Boeing Company Piezoelectric bimorph beam manufacturing method
US8410663B2 (en) * 2006-10-20 2013-04-02 Kyocera Corporation Piezoelectric actuator unit having a stress relieving layer and method for manufacturing the same
US8212451B2 (en) * 2006-10-31 2012-07-03 Kyocera Corporation Multi-layer piezoelectric element having a plurality of junction sections and injection apparatus employing the same
DE102007016871A1 (de) * 2007-04-10 2008-10-16 Robert Bosch Gmbh Piezoelektrischer Aktor
DE102007037500A1 (de) * 2007-05-11 2008-11-13 Epcos Ag Piezoelektrisches Vielschichtbauelement
DE102007037553A1 (de) * 2007-08-09 2009-02-12 Robert Bosch Gmbh Piezoelektrisches Aktormodul
DE102007056553A1 (de) 2007-11-23 2009-05-28 Robert Bosch Gmbh Verfahren zur Herstellung eines Piezoaktormoduls mit einer Umhüllung und ein so hergestelltes Piezoaktormodul
DE102008029185A1 (de) 2008-06-19 2009-12-24 Epcos Ag Piezoelektrisches Bauelement und Verfahren zur Herstellung eines elektrischen Kontaktes
DE102012207276B4 (de) 2011-08-01 2018-04-05 Continental Automotive Gmbh Vollaktiver Piezostack mit Passivierung
DE102011090156A1 (de) * 2011-12-30 2013-07-04 Continental Automotive Gmbh Piezostack mit Passivierung und Verfahren zur Passivierung eines Piezostacks
JP5842635B2 (ja) * 2012-01-27 2016-01-13 Tdk株式会社 積層型圧電素子
JP5720647B2 (ja) * 2012-09-03 2015-05-20 トヨタ自動車株式会社 半導体装置及びその製造方法
CN108002865B (zh) * 2017-11-29 2020-05-29 歌尔股份有限公司 功能陶瓷元件及在功能陶瓷层上形成电极的方法
US10748564B2 (en) * 2018-01-25 2020-08-18 Magnecomp Corporation Multi-layer microactuators for hard disk drive suspensions
JP7431798B2 (ja) 2018-07-18 2024-02-15 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション バリスタパッシベーション層及びその製造方法
GB2579039A (en) * 2018-11-15 2020-06-10 Xaar Technology Ltd Electrical component
DE102023119064A1 (de) * 2023-07-19 2025-01-23 Vega Grieshaber Kg Vibrationssensor mit Schutzschicht und Verfahren zur Herstellung eines Vibrationssensors

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Also Published As

Publication number Publication date
US20040145276A1 (en) 2004-07-29
JP4465154B2 (ja) 2010-05-19
CN1528023A (zh) 2004-09-08
US6930438B2 (en) 2005-08-16
TW564565B (en) 2003-12-01
DE10121270A1 (de) 2003-02-06
CN100373650C (zh) 2008-03-05
EP1393386A2 (de) 2004-03-03
JP2004526328A (ja) 2004-08-26
WO2002089225A2 (de) 2002-11-07
DE50213060D1 (de) 2009-01-08
WO2002089225A3 (de) 2003-06-12
EP1393386B1 (de) 2008-11-26

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