TW554258B - Resist stripper - Google Patents
Resist stripper Download PDFInfo
- Publication number
- TW554258B TW554258B TW090129563A TW90129563A TW554258B TW 554258 B TW554258 B TW 554258B TW 090129563 A TW090129563 A TW 090129563A TW 90129563 A TW90129563 A TW 90129563A TW 554258 B TW554258 B TW 554258B
- Authority
- TW
- Taiwan
- Prior art keywords
- photoresist
- quaternary ammonium
- patent application
- ammonium salt
- item
- Prior art date
Links
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 90
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 44
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims abstract description 37
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 27
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims abstract description 26
- -1 quaternary ammonium carboxylate Chemical class 0.000 claims abstract description 25
- 150000002978 peroxides Chemical class 0.000 claims abstract description 19
- 125000001453 quaternary ammonium group Chemical group 0.000 claims abstract description 11
- 239000001099 ammonium carbonate Substances 0.000 claims abstract description 3
- 235000012501 ammonium carbonate Nutrition 0.000 claims abstract description 3
- 239000000908 ammonium hydroxide Substances 0.000 claims abstract description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 238000011049 filling Methods 0.000 claims description 16
- 150000001412 amines Chemical class 0.000 claims description 15
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 11
- 239000003960 organic solvent Substances 0.000 claims description 11
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 6
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 5
- 150000002432 hydroperoxides Chemical class 0.000 claims description 5
- MWNQXXOSWHCCOZ-UHFFFAOYSA-L sodium;oxido carbonate Chemical compound [Na+].[O-]OC([O-])=O MWNQXXOSWHCCOZ-UHFFFAOYSA-L 0.000 claims description 4
- 239000005711 Benzoic acid Substances 0.000 claims description 3
- 235000010233 benzoic acid Nutrition 0.000 claims description 3
- 150000004967 organic peroxy acids Chemical class 0.000 claims description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 3
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims description 3
- 229960004889 salicylic acid Drugs 0.000 claims description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 150000002334 glycols Chemical class 0.000 claims description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000003368 amide group Chemical group 0.000 claims 1
- 150000008624 imidazolidinones Chemical class 0.000 claims 1
- 150000003951 lactams Chemical class 0.000 claims 1
- 238000004880 explosion Methods 0.000 abstract description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 40
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 21
- 239000000203 mixture Substances 0.000 description 12
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 9
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- ZMANZCXQSJIPKH-UHFFFAOYSA-O triethylammonium ion Chemical compound CC[NH+](CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-O 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- 230000002079 cooperative effect Effects 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 4
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 4
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 2
- 239000005947 Dimethoate Substances 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 101100189356 Mus musculus Papolb gene Proteins 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 210000004556 brain Anatomy 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- MCWXGJITAZMZEV-UHFFFAOYSA-N dimethoate Chemical compound CNC(=O)CSP(=S)(OC)OC MCWXGJITAZMZEV-UHFFFAOYSA-N 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 235000019260 propionic acid Nutrition 0.000 description 2
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- DDFYFBUWEBINLX-UHFFFAOYSA-M tetramethylammonium bromide Chemical compound [Br-].C[N+](C)(C)C DDFYFBUWEBINLX-UHFFFAOYSA-M 0.000 description 2
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- ACVIQVKMDMHZHO-UHFFFAOYSA-N 1,2-diethylpiperazine Chemical compound CCC1CNCCN1CC ACVIQVKMDMHZHO-UHFFFAOYSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 1
- PVOAHINGSUIXLS-UHFFFAOYSA-N 1-Methylpiperazine Chemical compound CN1CCNCC1 PVOAHINGSUIXLS-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- AKUNSTOMHUXJOZ-UHFFFAOYSA-N 1-hydroperoxybutane Chemical compound CCCCOO AKUNSTOMHUXJOZ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- LJDSTRZHPWMDPG-UHFFFAOYSA-N 2-(butylamino)ethanol Chemical compound CCCCNCCO LJDSTRZHPWMDPG-UHFFFAOYSA-N 0.000 description 1
- IWSZDQRGNFLMJS-UHFFFAOYSA-N 2-(dibutylamino)ethanol Chemical compound CCCCN(CCO)CCCC IWSZDQRGNFLMJS-UHFFFAOYSA-N 0.000 description 1
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 description 1
- KKFDCBRMNNSAAW-UHFFFAOYSA-N 2-(morpholin-4-yl)ethanol Chemical compound OCCN1CCOCC1 KKFDCBRMNNSAAW-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical class CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- LVKNZRPSERBSFR-UHFFFAOYSA-M 2-carboxyphenolate;tetramethylazanium Chemical compound C[N+](C)(C)C.OC1=CC=CC=C1C([O-])=O LVKNZRPSERBSFR-UHFFFAOYSA-M 0.000 description 1
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- LTHNHFOGQMKPOV-UHFFFAOYSA-N 2-ethylhexan-1-amine Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 description 1
- KIZQNNOULOCVDM-UHFFFAOYSA-M 2-hydroxyethyl(trimethyl)azanium;hydroxide Chemical compound [OH-].C[N+](C)(C)CCO KIZQNNOULOCVDM-UHFFFAOYSA-M 0.000 description 1
- UUNHRGSUOBTBKW-UHFFFAOYSA-M 2-hydroxypropanoate;tetramethylazanium Chemical compound C[N+](C)(C)C.CC(O)C([O-])=O UUNHRGSUOBTBKW-UHFFFAOYSA-M 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- WFCSWCVEJLETKA-UHFFFAOYSA-N 2-piperazin-1-ylethanol Chemical compound OCCN1CCNCC1 WFCSWCVEJLETKA-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- NHQDETIJWKXCTC-UHFFFAOYSA-N 3-chloroperbenzoic acid Chemical compound OOC(=O)C1=CC=CC(Cl)=C1 NHQDETIJWKXCTC-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- XNSPQPOQXWCGKC-UHFFFAOYSA-N C(C)(=O)O.C(C)(=O)O.C(C)(=O)O.[N] Chemical compound C(C)(=O)O.C(C)(=O)O.C(C)(=O)O.[N] XNSPQPOQXWCGKC-UHFFFAOYSA-N 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- 102000004190 Enzymes Human genes 0.000 description 1
- 108090000790 Enzymes Proteins 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229930091371 Fructose Natural products 0.000 description 1
- 239000005715 Fructose Substances 0.000 description 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical class [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- AKNUHUCEWALCOI-UHFFFAOYSA-N N-ethyldiethanolamine Chemical compound OCCN(CC)CCO AKNUHUCEWALCOI-UHFFFAOYSA-N 0.000 description 1
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 1
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229910008484 TiSi Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- VYTBPJNGNGMRFH-UHFFFAOYSA-N acetic acid;azane Chemical compound N.N.CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O VYTBPJNGNGMRFH-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- YOUGRGFIHBUKRS-UHFFFAOYSA-N benzyl(trimethyl)azanium Chemical compound C[N+](C)(C)CC1=CC=CC=C1 YOUGRGFIHBUKRS-UHFFFAOYSA-N 0.000 description 1
- QVVKZBSIULRZFK-UHFFFAOYSA-M benzyl(trimethyl)azanium;butanoate Chemical compound CCCC([O-])=O.C[N+](C)(C)CC1=CC=CC=C1 QVVKZBSIULRZFK-UHFFFAOYSA-M 0.000 description 1
- WQGNRCPIUHNSBL-UHFFFAOYSA-L benzyl(trimethyl)azanium;hexanedioate Chemical compound [O-]C(=O)CCCCC([O-])=O.C[N+](C)(C)CC1=CC=CC=C1.C[N+](C)(C)CC1=CC=CC=C1 WQGNRCPIUHNSBL-UHFFFAOYSA-L 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- QVYARBLCAHCSFJ-UHFFFAOYSA-N butane-1,1-diamine Chemical compound CCCC(N)N QVYARBLCAHCSFJ-UHFFFAOYSA-N 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 description 1
- 229940043276 diisopropanolamine Drugs 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- VICYBMUVWHJEFT-UHFFFAOYSA-N dodecyltrimethylammonium ion Chemical compound CCCCCCCCCCCC[N+](C)(C)C VICYBMUVWHJEFT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UYMKPFRHYYNDTL-UHFFFAOYSA-N ethenamine Chemical compound NC=C UYMKPFRHYYNDTL-UHFFFAOYSA-N 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 150000002443 hydroxylamines Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical compound O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 description 1
- 150000004966 inorganic peroxy acids Chemical class 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007937 lozenge Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- MBABOKRGFJTBAE-UHFFFAOYSA-N methyl methanesulfonate Chemical compound COS(C)(=O)=O MBABOKRGFJTBAE-UHFFFAOYSA-N 0.000 description 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 1
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical class [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 235000000346 sugar Nutrition 0.000 description 1
- 150000008163 sugars Chemical class 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- MRYQZMHVZZSQRT-UHFFFAOYSA-M tetramethylazanium;acetate Chemical compound CC([O-])=O.C[N+](C)(C)C MRYQZMHVZZSQRT-UHFFFAOYSA-M 0.000 description 1
- IEVVGBFMAHJELO-UHFFFAOYSA-M tetramethylazanium;benzoate Chemical compound C[N+](C)(C)C.[O-]C(=O)C1=CC=CC=C1 IEVVGBFMAHJELO-UHFFFAOYSA-M 0.000 description 1
- 150000003536 tetrazoles Chemical class 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- SEACXNRNJAXIBM-UHFFFAOYSA-N triethyl(methyl)azanium Chemical compound CC[N+](C)(CC)CC SEACXNRNJAXIBM-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- DNYWZCXLKNTFFI-UHFFFAOYSA-N uranium Chemical compound [U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U] DNYWZCXLKNTFFI-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3227—Ethers thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/62—Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/39—Organic or inorganic per-compounds
- C11D3/3947—Liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/263—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
Landscapes
- Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
554258 A7 B7 五、發明説明(i) 技術領域 (請先聞讀背面之注意事項再填寫本頁) 本發明係有關半導體積體電路、印刷電路板、液晶等 之製程中用以剝離光阻劑層及鈦氧化物之剝離劑。 先行技術 半導體積體電路係以於基體上塗佈光阻劑,曝光、顯 像後鈾刻形成電路後,從基體上剝離光阻劑,或形成電路 後蝕刻法除光阻劑後,剝離殘留光阻劑殘渣之方法製造。 爲從基體上剝離光阻劑,或從基體上剝離光阻劑殘渣,以 往有種種光阻劑用剝離劑之提議。 例如,日本專利特開昭6 2 - 4 9 3 5 5號公報揭示 ’使用烷醇胺類之光阻劑用剝離液組成物。而用烷醇胺之 剝離液組成物,無法充分剝離經乾式蝕刻、打磨、離子植 入等處理變質爲無機性質之光阻劑殘渣。又,最近之次微 米製程中有含T i N、T i S i等金屬材料之使用,而使 用這些金屬材料時,處理中產生鈦氧化物等安定副產物。 鈦氧化物無法以慣用之烷醇胺剝離。 經濟部智慧財產局員工消費合作社印製 因而,近來有剝離性更佳之含羥基胺之光阻劑用剝離 液組成物之提議。例如,特開平4 一 2 8 9 8 6 6號公報 提議含羥基胺及烷醇胺之光阻劑用剝離液組成物,特開平 6-2 6 6 1 1 9號公報提議含羥基胺、烷醇胺、醇之光 阻劑用剝離劑液組成物。該含羥基胺之光阻劑用剝離組成 物雖具優良之對鈦氧化物之剝離性,但因係不安定之化合 物,有分解、爆炸之危險。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -4- 554258 A7 B7 五、發明説明(2 ) 如上之鹼性胺系光阻劑剝離劑以外,亦有組合過氧化 氫及酸之光阻劑用剝離劑之提案(例如特開昭6 4 -1 5 7 4 0號公報)。鈦氧化物在酸性下可溶於過氧化氫 ,此雖係已知,但於鹼性,易剝離之鹼顯像型光阻劑之剝 離,過氧化氫及酸之組合尙不可謂最適。 發明所欲解決之課題 如上述,習知光阻劑用剝離劑,其剝離性尤以鈦氧化 物之剝離性不足,並有分解、爆炸之危險。因此,本發明 之目的在提供不含爆炸危險性高之羥基胺,具優良光阻劑 剝離性,鈦氧化物剝離性之光阻劑用剝離劑。 解決課題之手段 本發明人等對光阻劑用剝離劑精心硏究,結果發現過 氧化氫及四級銨鹽所成之光阻劑用剝離劑,係光阻劑剝離 性及氧化鈦剝離性優之光阻劑用剝離劑,終於完成本發明 〇 亦即,本發明係其特徵爲過氧化物及四級鏡鹽所成之 光阻劑用剝離劑。 以下詳細說明本發明。 本發明中,剝離係指將光阻劑塗布於基板上後施以曝 光、顯像、蝕刻等處理形成電路,去除殘留之光阻劑或光 阻劑殘渣。易言之,將光阻劑曝光,可溶於液體之光阻劑 之去除即爲顯像,顯像之殘留部份,或蝕刻、打磨等處理 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁)
1T 經濟部智慧財產局員工消費合作社印製 -5- 554258 A7 B7 五、發明説明(3) 後’去除難溶於液體之部份即爲剝離。 (請先閲讀背面之注意事項再填寫本頁) 本發明之光阻劑用剝離劑係用於光阻劑或其殘渣之剝 離。亦即,將光阻劑塗布於基板上後,施以曝光、顯像、 蝕刻等處理形成電路後,以本發明之剝離劑剝離。或電路 形成後,打磨去除光阻劑後,殘留之光阻劑殘渣以本發明 之剝離劑剝離。 本發明之光阻劑用剝離劑,剝離光阻劑並且亦剝離形 成電路時之副產物鈦氧化物。鈦氧化物係以4價之鈦氧化 物尤爲安定,難溶於水。鈦氧化物有4價、3價、2價等 種種價數者,最難溶者即4價之鈦氧化物(二氧化鈦)。 另一方面,最易溶者爲T i 2 +,已知可於酸性範圍還原固 態之鈦氧化物輕易溶解。但本發明之光阻劑用剝離劑,在 可剝離光阻劑之鹼性範圍即可還原、溶解包含最難溶之二 氧化鈦之種種鈦氧化物,加以剝離。 本發明之光阻劑用剝離劑,其必要成分有過氧化物及 四級鏡鹽。 本發明之光阻劑用剝離劑,其過氧化物係用作還原劑 經濟部智慧財產局員工消費合作社印製 〇 本發明之光阻劑用剝離劑,其過氧化物係選自過氧化 物、過硫酸鹽、過硼酸鹽、過碳酸鹽、有機過酸及有機氫 過氧化物所成群之至少一種。其中過氧化氫最爲廉價,工 業上最佳。 過氧化氫除無水、水流液外,可用尿素、四級銨鹽等 之氫過氧化物(如結晶水之水,於尿素、四級銨鹽以過氧 本紙張尺度適用中國國家標準(CNS ) A4規格(21〇X 297公釐) -6 - 554258 A7 _B7__ 五、發明説明(4 ) 化氫配位者)。 C請先閱讀背面之注意事項再填寫本頁) 過硫酸鹽、過硼酸鹽、過碳酸鹽等無機過酸鹽以用氨 、胺之鹽、或四級鏡鹽爲佳。此外之鹽’如鈉鹽、鉀鹽等 固然亦可使用,但須去除金屬離子,工業上不利。 有機過酸若混合四級銨鹽而安定則化合物無特殊限制 ,有例如過甲酸、過醋酸、過氧化苯甲醯、間氯過苯甲酸 等。 有機氫過氧化物係一般式R -〇〇H (R表院基、方 基等)之化合物,有例如丁基過氧化氫、異丙苯過氧化氫 等。 本發明之光阻劑用剝離劑之四級銨鹽,可用任一具鹼 性者。四級銨鹽之例有氫氧化四級銨,四級銨碳酸鹽,四 級銨羧酸鹽,及四級銨過羧酸鹽。這些均係鹼性,可單獨 使用,或混合使用。這些四級銨鹽中,以氫氧化物、羧酸 鹽爲佳。羧酸可用脂族羧酸、芳族羧酸之任一,而芳族羧 酸安定性高,工業上較佳。芳族羧酸有例如苯甲酸、水楊 酸、酞酸。脂族羧酸有例如醋酸、乳酸、己二酸、丙酸。 經濟部智慧財產局員工消費合作社印製 用於本發明光阻劑用剝離劑之四級銨鹽,其陽離子部 份,即四級銨,有四甲銨、四乙銨、四正丁銨、三乙基甲 銨、十二基三甲銨等四烷基銨,苯甲基三甲銨等苯甲基三 烷基銨,三甲基- 2 -羥基乙銨(膽鹼)等烷基羥基烷基 銨。 本發明之光阻劑用剝離劑,除過氧化物及四級銨鹽以 外,可添加選自胺類、水溶性有機溶劑及水所成群之至少 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -7- 554258 A7 B7 五、發明説明(5) 一種。可添加於光阻劑用剝離劑之胺類,可係一般用作光 阻劑用剝離劑之胺類。具體而言,有單乙醇胺、二乙醇胺 、三乙醇胺、2 — (2 —胺基乙氧基)乙醇、N — (2 — 胺基乙基)乙醇胺、N,N —二甲基乙醇胺、N,N —二 乙基乙醇胺、N,N -二丁基乙醇胺、N —甲基乙醇胺、 N —乙基乙醇胺、N — 丁基乙醇胺、N —甲基二乙醇胺、 N -乙基二乙醇胺、單異丙醇胺、二異丙醇胺、三異丙醇 胺、N -( 2 -羥基乙基)哌嗪、N — ( 2 —羥基乙基) 嗎啉等烷醇胺類,乙二胺、二乙三胺、三乙四胺、四乙五 胺、五乙六胺、哌嗪、N -( 2 -胺基乙基)哌嗪、三乙 二胺等乙烯胺類,N,N,N / ,N / —四甲基乙二胺、 N,N,N — ,N" ’N" —五甲基二乙三胺、N —甲基 哌嗪、N,N,N / -三甲基胺基乙基哌嗪等N —烷基乙 烯胺類,乙烯胺以外之丙二胺、丁二胺、六亞甲基二胺等 二胺類、咪唑、1 一甲基咪唑、2 —甲基咪唑、1 ,2 -二甲基咪唑、1 ,2 ,4 ,5 —四甲基咪唑、2 —乙基一 4 -甲基咪唑等咪唑類,嗎啉、環己胺、2 -乙基己胺、 苯甲胺、苯胺等單胺類,三乙胺、三丙胺、三丁胺等烷胺 類。又,雖因腐蝕、危險性等而不佳,亦可添加羥基胺類 。這些胺類可單獨使用,亦可二種以上混合使用。 用於本發明之水溶性有機溶劑,可係一般用作光阻劑 用剝離劑者。其例有二甲亞碩等亞硕類,二甲硕、二乙硕 等硕類,N,N -二甲基甲醯胺、N,N —二乙基甲醯胺 、N,N —二甲基乙醯胺、N,N —二乙基乙醯胺等醯胺 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁)
1T ^1. 經濟部智慧財產局員工消費合作社印製 -8- 554258 A7 _ B7 五、發明説明(6 ) (請先閲讀背面之注意事項再填寫本頁) 類,N -甲基—2 —吡咯烷酮、N —乙基一 2 -吡咯烷酮 、N—丙基一 2 -吡咯烷酮、N -乙基一 2 -吡略烷酮、 N〜丙基一 2 —吡咯烷酮、N -羥乙基一 2 —吡咯烷酮等 內醯胺類,1 ,3 -二甲基—2 -咪唑烷酮等之咪唑烷酮 類,乙二醇、二乙二醇、三乙二醇、丙二醇、二丙二醇、 三丙二醇等二醇類,乙二醇單甲醚、乙二醇單乙醚、乙二 醇單丁醚、二乙二醇單甲醚、二乙二醇單乙醚、二乙二醇 單丁醚、丙二醇單甲醚、丙二醇單乙醚、丙二醇單丁醚、 二丙二醇單甲醚、二丙二醇單乙醚、二丙二醇單丁醚等二 醇醚類。這些水溶性有機溶劑可單獨使用,亦可二種以上 混合使用。 經濟部智慧財產局員工消費合作社印製 本發明之光阻劑用剝離劑,可添加一般用防蝕劑。防 蝕劑有甲酸、醋酸、丙酸、辛酸、己二酸、庚二酸、癸二 酸、辛二酸、壬二酸、苯甲酸、水楊酸、酞酸等羧酸,氮 三醋酸、乙二胺四醋酸、二乙三胺五醋酸等胺基多羧酸, 酚、甲酚、焦兒茶酚、焦掊酚等之芳族含羥基化合物,吡 咯、咪唑、三唑、四唑等吡咯,葡萄糖、蔗糖、果糖等糖 類。 本發明之光阻劑用剝離劑中,過氧化物、四級銨鹽、 水、胺類、水溶性有機溶劑之比率因隨所用各化合物而變 化難以限定,但過氧化物係在0 · 1至3 0重量% ’四級銨 鹽1至5 0重量%,水1至9 0重量%,胺類1至5 0重量 %,水溶性有機溶劑1至5 0重量%。較佳者爲’過氧化物 0 · 5至2 5重量%,四級銨鹽5至5 0重量% ’水1至 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -9 - 554258 A7 ___B7______ 五、發明説明(7 ) (請先閲讀背面之注意事項再填寫本頁) 9 0重量%,胺類1至4 0重量%,水溶性有機溶劑1至 5 0重量%。更佳者爲,過氧化物1至2 5重量% ’四級銨 鹽5至4 0重量%,水1至9 0重量%,胺類1至3 0重量 %,水溶性有機溶劑1至5 0重量%。偏離該範圍雖無不可 但光阻劑之剝離性、安定性差。 本發明之光阻劑用剝離劑,亦可於剝離光阻劑之際添 加各成分使用,亦可預先混合各成分使用。 用於本發明光阻劑用剝離劑之四級銨鹽及過氧化物’ 可單以混合物形態存在,亦可於有如四級銨鹽之氫過氧化 物,過氧化物配位於四級銨鹽之形態存在。 經濟部智慧財產局員工消費合作社印製 如結晶水之水,過氧化氫於四級銨鹽配位之氫過氧化 物係安定之化合物,晶狀,可於空氣中,室溫分離。製造 四級銨鹽之方法,因可利用一般氫過氧化物之製造方法而 無特殊阳制,有例如,於四級銨鹽之水溶液添加當量以上 之過氧化氫後,將過剩之過氧化氫加熱分解之方法,同樣 於四級銨鹽之水溶液添加當量以上之過氧化氫後,將過剩 之過氧化氫以加入酵素、金屬鹽、金屬等分解之方法,於 四級銨鹽逐步少量添加當量以下之過氧化氫之方法等,製 程中使用水以外溶劑亦無何妨。過氧化氫配位於四級銨鹽 成爲氫過氧化物時,過氧化氫可簡單地氧化與胺類等有機 物混合亦不反應,安定而易於取用。亦即,過氧化物配位 於四級銨鹽時,於本發明之光阻劑剝離液添加其它物質時 ,過氧化物與添加物之反應,四級銨鹽與添加物之反應可 予抑制,可添加物質之容許範圍變大。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -10- 554258 A7 B7 五、發明説明(8 ) 本發明之光阻劑用剝離劑可用於鹼水溶液顯像之光阻 劑。 (請先閲讀背面之注意事項再填寫本頁) 本發明之光阻劑用剝離劑係用於,塗布在無機質基體 上之光阻劑膜,或塗布於無機基體上之光阻膜鈾刻後殘留 之光阻劑層,或乾式蝕刻後經打磨殘留之光阻劑殘渣等之 剝離,或鈦氧化物等副產物之剝離。此際亦可藉加熱、超 音波等促進剝離。 本發明之光阻劑用剝離劑之使用方法一般係浸泡法, 但其它方法亦可使用。 實施例 本發明藉以下實施例更詳細說明,惟本發明不限於此 〇 經濟部智慧財產局員工消費合作社印製 實施例1至實施例2 7,比較例1至比較例8 於矽晶圓上塗布市售正型光阻劑成厚2微米,作預烘 烤。其次經光罩曝光,以氫氧化四甲銨顯像。蝕刻後,作 電漿打磨處理。該矽晶圓於表1之剝離液在8 0 °C浸泡 3 0分鐘後水洗、乾燥。以掃猫式電子顯微鏡觀察表面, 探討光阻劑變質膜之剝離性,及鈦氧化物之剝離性。 至於金屬腐蝕性則係將各金屬(銅、鋁)試片浸泡於 5〇°C之表2光阻劑用剝離劑3 0分鐘,由重量變化、表 面觀察作評估。 而實施例之剝離液係於3 0 °C之四級銨水溶液添加過 氧化物,去除過剩之水後,添加胺類、水溶性有機溶劑而 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -11 - 554258 A7 _____ B7 五、發明説明(9 ) 調製。過氧化氫則用3 5 %水溶液,添加於8 0 °C之四級 銨鹽水溶液。表1、表2各組成中其餘係水。 (請先閲讀背面之注意事項再填寫本頁) <光阻劑剝離性及鈦氧化物剝離性> 光阻劑變質膜之剝離性及鈦氧化物之剝離性係如下評估。 〇:剝離性良好 △:有部份殘留物 X :大部份殘留 <金屬腐蝕性> 對銅、鋁之腐蝕性係如下評估(但,羥基胺因與銅接觸即 分解,無法試驗)。 〇:無腐蝕 A :有部份腐蝕 X :強烈腐蝕 而表1、表2爲簡潔記載,使用以下代號。 經濟部智慧財產局員工消費合作社印製 TMAH :氫氧化四甲銨 TEAH:氫氧化四乙銨 TPAH:氫氧化四正丙銨 TMHEAH :氫氧化三甲基—2 —羥基乙銨 T M A C :碳酸四甲銨 T P A C :碳酸四正丙銨 TMHEAC :碳酸三甲基一 2 —羥基乙銨 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) -12- 554258 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(10) BTMAC :碳酸苯甲基三甲銨 丁 M A A :醋酸四甲銨 T M A A P :過醋酸四甲銨 T M A S :水楊酸四甲銨 TMAB:苯甲酸四甲銨 T M A L :乳酸四甲銨 TPAP :丙酸四正丙銨 BTMAA :己二酸苯甲基三甲銨 Μ E A :單乙醇胺 Η A :羥基胺 TETA :三乙四胺 Η P〇:過氧化氫 A P S :過硫酸銨 A P B :過硼酸銨 A P C :過碳酸銨 BPO:過氧化苯甲醯 丁 Β Η P〇:三級丁基過氧化氫 Ν Μ P : Ν -甲基一 2 -吡咯烷酮 DMS〇:二甲亞砸 (請先閱讀背面之注意事項再填寫本頁) ----訂 ^1. 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -13- 554258
A 五、發明説明(u)表1 經濟部智慧財產局員工消費合作社印製 組成(括弧內係重量%0 剝離性 四級銨鹽 過氧化物 其他 光阻劑 鈦氧化物 實施例1 TMAH(16) HP ◦⑹ 〇 〇 實施例2 TMAH(14) HPO(5) TETA(ll) 〇 〇 實施例3 TNAH(14) HPO(5) DMSO(ll) 〇 〇 實施例4 TEAH(30) HPO(15) 〇 〇 實施例5 TEAH(16) HPO(IO) TETA ⑷ DMSO(IO) 〇 〇 實施例6 TPAH(7) HPO(3) Δ 〇 實施例7 TMHEAH(20) HPO(5) 〇 〇 實施例8 TMAH(10) APS(5) 〇 Δ 實施例9 TMAH ⑻ APB⑵ 〇 Δ 實施例10 TEAH(12) APC(3) DMS〇(5) 〇 Δ 實施例11 TEAH(7) BPO(5) TETA(5) 〇 Δ 實施例12 TPAH(15) TBHPO(5) TETA(5) 〇 Δ 比較例1 TMAH(16) Δ X 比較例2 HPCX6) X Δ 比較例3 APS(5) X X 比較例4 MEA(16)* TETA ⑷ DMSO(IO) Δ X 比較例5 HA(16)* TETA ⑷ DMSO(IO) 〇 〇 *MEA及HA非四級銨鹽,係胺。 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) 訂 -14- 554258 A7 B7 五、發明説明(12) 經濟部智慧財產局員工消費合作社印製 表2 組成(括弧內係重量%) .剝; 離性 腐蝕性 四級銨鹽 過氧化物 其他 光阻劑 鈦氧化物 Α1 Cu 實施例13 TMAC(16) 腦⑹ 〇 〇 〇 〇 實施例14 TPACC16) HPCX6) 〇 〇 〇 〇 實施例15 BTMAC(16) HPCX6) 〇 〇 〇 〇 實施例16 TMAC(40) HPO(15) 〇 〇 〇 〇 實施例17 TMAC(3) HPO(l) 〇 〇 〇 〇 實施例18 TMAC ⑸ HPO(3) DMSO(IO) 〇 〇 〇 〇 實施例19 TMHEAC(20) HPO(5) NMP(50) 〇 〇 〇 〇 實施例20 TMAA(16) 腦⑹ 〇 〇 〇 〇 實施例21 TMAS(10) HPO(5) 〇 〇 〇 〇 實施例22 TMAB(5) HP(X2) 〇 〇 〇 〇 實施例23 TMAL(16) HPO(15) 〇 〇 〇 〇 實施例24 TPAP(16) HPO(IO) 〇 〇 〇 〇 實施例25 BTMAA(5) HPO(3) DMSOd 〇) 〇 〇 〇 〇 實施例26 TMAAP(20) HPO(5) NMP(50) 〇 〇 〇 〇 實施例27 TMAS(5), TMAH(5) HPO(5) 〇 〇 〇 〇 比較例6 TMAH(16) HPCX6) 〇 〇 X Δ 比較例7 MEA(16)* Δ X 〇 X 比較例8 HA(16)* 〇 〇 Δ *MEA及HA非四級銨鹽,係胺。 (請先閱讀背面之注意事項再填寫本頁) ----訂 -^1. 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) -15- 554258 Α7 Β7 五、發明説明(13) 實施例2 8至3 4 (請先閲讀背面之注意事項再填寫本頁) 以如同實施例1至2 7之方法,試驗使用四級銨鹽之 S過氧化物之光阻劑用剝離液,其組成及結果示於表3。 而下示氫氧化四甲銨之氫過氧化物之製造例,至於其 它四級銨鹽之氫過氧化物亦以同一方法製造。 製造例··將5 9 0克之1 5 %氫氧化四甲銨( 0 · 97莫耳)加熱至80 Qc,滴入3 5%雙氧化150 克(1 · 5 4莫耳)。加熱分解過剩之過氧化氫至不再冒 泡’之後於減壓下將水餾除,得氫氧化四甲銨之氫過氧化 物。 氫氧化四甲銨之氫過氧化物之I r (KB r錠劑) 1489, 1404, 947 cm-1 將該氫氧化四甲銨之氫過氧化物溶於水,加入胺、水 溶性有機溶劑,成光阻劑用剝離液。 爲表列之簡潔,使用以下代號。 經濟部智慧財產局員工消費合作社印製 T M A Η - Η :氫氧化四甲銨之氫過氧化物 ΤΕΑΗ-Η :氫氧化四乙銨之氫過氧化物 ΤΡΑΗ - Η :氫氧化四正丙銨之氫過氧化物 ΤΜΗΕΑΗ-Η:氫氧化三甲基一2-羥基乙銨之氫過 氧化物 本紙張尺度適用中國國家標準(CNS ) Α4規格(2丨〇><297公釐) -16- 554258
7 B 五、發明説明(14) 表3 實 施 例 組成(括弧內係重量%) 光 阻 劑 鈦氧化 物剝離 性 28 TMAH-H(22) 水(78) 〇 〇 29 TMAH-H(19) 水(70) TETA(ll) 〇 〇 30 TMAH-H(19) 水(70) DMSO(ll) 〇 〇 31 TEAH-H(45) 水(55) 〇 〇 32 TEAH-H(26) 水(60) TETA(4) DMSO(IO) 〇 〇 33 TPAH-H(IO) 水(90) Δ 〇 34 TMHEAH-H(25) 水(75) 〇 〇 J—丨:--------- (請先閲讀背面之注意事項再填寫本頁) -訂· 發明之效果 本發明之光阻劑用剝離劑不含不安定而危險性高之羥 基胺,可用作光阻劑剝離性、鈦氧化物剝離性優之光阻劑 用剝離劑。 -^1. 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -17-
Claims (1)
- 554258告本A8 B8 C8 D8 第90129563號專利申請案 中文申請專利範圍修/正本 (請先閲讀背面之注意事項再填寫本頁) 民國 1 . 一種光阻劑用剝離劑,其特'徵•爲:由也^化物及 四級銨鹽所成其中過氧化物係選自過氧化氫、過硫酸鹽、 過硼酸鹽、過碳酸鹽、有機過酸及有機氫過氧化物所成群 之至少1種,而四級銨鹽係選自氫氧化四級銨、四級銨碳 酸鹽、四級銨羧酸鹽、及四級銨過羧酸鹽所成群之至少1 種。 2 .如申請專利範圍第1項之光阻劑用剝離劑,其中 四級銨羧酸鹽之羧酸係芳族羧酸。 3 ·如申請專利範圍第2項之光阻劑用剝離劑,其中 芳族羧酸係選自苯甲酸、水楊酸、及酞酸所成群之至少1 種。 4 ·如申請專利範圍第1項之光阻劑用剝離劑,其中 四級銨鹽之四級銨係選自四甲銨、苯甲基三烷基銨、及烷 基羥基烷基銨所成群之至少1種。 經濟部智慧財產局員工消費合作社印製 5 ·如申請專利範圍第1項之光阻劑用剝離劑,其中 過氧化物及四級銨鹽係四級銨鹽之過氧化氫化物。 6 ·如申請專利範圍第1項之光阻劑用剝離劑,其中 於過氧化物及四級銨鹽添加選自胺類、水溶性有機溶劑、 及水所成群之至少一種。 7 ·如申請專利範圍第6項之光阻劑用剝離劑,其中 水溶性有機溶劑係選自亞硕類、硕類、醯胺類、內醯胺類 本紙張尺度適用中國國家榇準(CNS ) A4規格(210X297公嫠) 554258 A8 B8 C8 D8 六、申請專利範圍 、咪唑烷酮類、二醇類及二醇醚類所成群之至少1種。 8 .如申請專利範圍第1項之光阻劑用剝離劑,其係 剝離鈦氧化物。 9 .如申請專利範圍第1項之光阻劑用剝離劑,其係 於光阻劑顯像、形成電路後剝離殘留光阻劑或光阻劑殘渣 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -2-
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- 2001-11-29 TW TW090129563A patent/TW554258B/zh not_active IP Right Cessation
- 2001-11-29 KR KR1020010074906A patent/KR100822236B1/ko not_active IP Right Cessation
- 2001-11-29 EP EP01128335A patent/EP1211563B1/en not_active Expired - Lifetime
- 2001-11-30 US US09/996,773 patent/US6797682B2/en not_active Expired - Fee Related
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TWI385159B (zh) * | 2004-05-07 | 2013-02-11 | Dongjin Semichem Co Ltd | 光阻移除組合物 |
TWI764858B (zh) * | 2015-01-22 | 2022-05-21 | 美商慧盛材料美國有限責任公司 | 用於自基板移除物質之溶液及方法 |
Also Published As
Publication number | Publication date |
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EP1211563B1 (en) | 2011-12-21 |
EP1211563A1 (en) | 2002-06-05 |
US6797682B2 (en) | 2004-09-28 |
US20020128164A1 (en) | 2002-09-12 |
KR100822236B1 (ko) | 2008-04-16 |
KR20020042490A (ko) | 2002-06-05 |
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