TW529072B - Lift-type substrate treatment device, and substrate treatment system with the substrate treatment device - Google Patents

Lift-type substrate treatment device, and substrate treatment system with the substrate treatment device Download PDF

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Publication number
TW529072B
TW529072B TW091102877A TW91102877A TW529072B TW 529072 B TW529072 B TW 529072B TW 091102877 A TW091102877 A TW 091102877A TW 91102877 A TW91102877 A TW 91102877A TW 529072 B TW529072 B TW 529072B
Authority
TW
Taiwan
Prior art keywords
substrate
lifting
substrate processing
processing
winding
Prior art date
Application number
TW091102877A
Other languages
English (en)
Chinese (zh)
Inventor
Shigeru Mizukawa
Katsutoshi Nakata
Shunji Matsumoto
Original Assignee
Sumitomo Precision Prod Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Prod Co filed Critical Sumitomo Precision Prod Co
Application granted granted Critical
Publication of TW529072B publication Critical patent/TW529072B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning In General (AREA)
TW091102877A 2001-02-27 2002-02-20 Lift-type substrate treatment device, and substrate treatment system with the substrate treatment device TW529072B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001052572A JP3587788B2 (ja) 2001-02-27 2001-02-27 昇降式基板処理装置及びこれを備えた基板処理システム

Publications (1)

Publication Number Publication Date
TW529072B true TW529072B (en) 2003-04-21

Family

ID=18913183

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091102877A TW529072B (en) 2001-02-27 2002-02-20 Lift-type substrate treatment device, and substrate treatment system with the substrate treatment device

Country Status (5)

Country Link
JP (1) JP3587788B2 (ja)
KR (1) KR20020093837A (ja)
CN (1) CN1246895C (ja)
TW (1) TW529072B (ja)
WO (1) WO2002069392A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100454084C (zh) * 2003-12-20 2009-01-21 鸿富锦精密工业（深圳）有限公司 面板翻转机构
JP4515165B2 (ja) * 2004-06-21 2010-07-28 大日本スクリーン製造株式会社 基板搬送装置および基板処理装置
KR101177561B1 (ko) * 2004-12-06 2012-08-28 주식회사 케이씨텍 기판 이송 장치용 샤프트
JP4745040B2 (ja) * 2005-12-05 2011-08-10 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
KR101410706B1 (ko) * 2006-08-22 2014-06-25 노드슨 코포레이션 처리 시스템에서 피가공물을 취급하기 위한 장치 및 방법
CN102064126B (zh) * 2010-11-04 2013-04-17 友达光电股份有限公司 基板运输处理方法
WO2013101851A1 (en) 2011-12-27 2013-07-04 Intevac, Inc. System architecture for combined static and pass-by processing
KR101298220B1 (ko) * 2012-01-20 2013-08-22 주식회사 엠엠테크 콤팩트한 기판 표면처리 시스템 및 기판 표면처리 방법
CN107851594B (zh) * 2015-08-28 2021-06-22 株式会社国际电气 基板处理装置以及半导体装置的制造方法
JP6297660B1 (ja) * 2016-11-22 2018-03-20 株式会社荏原製作所 処理装置、これを備えためっき装置、搬送装置、及び処理方法
CN117457549B (zh) * 2023-12-25 2024-04-12 富芯微电子有限公司 一种用于晶闸管管芯生产的表面腐蚀设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01137453U (ja) * 1988-03-16 1989-09-20
JP2000031239A (ja) * 1998-07-13 2000-01-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000183019A (ja) * 1998-12-21 2000-06-30 Dainippon Screen Mfg Co Ltd 多段基板処理装置

Also Published As

Publication number Publication date
JP3587788B2 (ja) 2004-11-10
KR20020093837A (ko) 2002-12-16
JP2002261143A (ja) 2002-09-13
WO2002069392A1 (fr) 2002-09-06
CN1246895C (zh) 2006-03-22
CN1455951A (zh) 2003-11-12

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees