KR20020093837A - 승강식 기판 처리 장치 및 이것을 구비한 기판 처리시스템 - Google Patents

승강식 기판 처리 장치 및 이것을 구비한 기판 처리시스템 Download PDF

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Publication number
KR20020093837A
KR20020093837A KR1020027011885A KR20027011885A KR20020093837A KR 20020093837 A KR20020093837 A KR 20020093837A KR 1020027011885 A KR1020027011885 A KR 1020027011885A KR 20027011885 A KR20027011885 A KR 20027011885A KR 20020093837 A KR20020093837 A KR 20020093837A
Authority
KR
South Korea
Prior art keywords
substrate
processing apparatus
board
winding
substrate processing
Prior art date
Application number
KR1020027011885A
Other languages
English (en)
Korean (ko)
Inventor
미즈카와시게루
나카타가츠토시
마츠모토순지
Original Assignee
스미토모 세이미츠 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모 세이미츠 고교 가부시키가이샤 filed Critical 스미토모 세이미츠 고교 가부시키가이샤
Publication of KR20020093837A publication Critical patent/KR20020093837A/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
KR1020027011885A 2001-02-27 2002-02-21 승강식 기판 처리 장치 및 이것을 구비한 기판 처리시스템 KR20020093837A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00052572 2001-02-27
JP2001052572A JP3587788B2 (ja) 2001-02-27 2001-02-27 昇降式基板処理装置及びこれを備えた基板処理システム
PCT/JP2002/001583 WO2002069392A1 (fr) 2001-02-27 2002-02-21 Appareil de traitement de substrat de type leve et systeme de traitement du substrat avec l'appareil de traitement du substrat

Publications (1)

Publication Number Publication Date
KR20020093837A true KR20020093837A (ko) 2002-12-16

Family

ID=18913183

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027011885A KR20020093837A (ko) 2001-02-27 2002-02-21 승강식 기판 처리 장치 및 이것을 구비한 기판 처리시스템

Country Status (5)

Country Link
JP (1) JP3587788B2 (ja)
KR (1) KR20020093837A (ja)
CN (1) CN1246895C (ja)
TW (1) TW529072B (ja)
WO (1) WO2002069392A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100454084C (zh) * 2003-12-20 2009-01-21 鸿富锦精密工业（深圳）有限公司 面板翻转机构
JP4515165B2 (ja) * 2004-06-21 2010-07-28 大日本スクリーン製造株式会社 基板搬送装置および基板処理装置
KR101177561B1 (ko) * 2004-12-06 2012-08-28 주식회사 케이씨텍 기판 이송 장치용 샤프트
JP4745040B2 (ja) * 2005-12-05 2011-08-10 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
US8245663B2 (en) * 2006-08-22 2012-08-21 Nordson Corporation Apparatus and methods for handling workpieces in a processing system
CN102064126B (zh) * 2010-11-04 2013-04-17 友达光电股份有限公司 基板运输处理方法
WO2013101851A1 (en) * 2011-12-27 2013-07-04 Intevac, Inc. System architecture for combined static and pass-by processing
KR101298220B1 (ko) * 2012-01-20 2013-08-22 주식회사 엠엠테크 콤팩트한 기판 표면처리 시스템 및 기판 표면처리 방법
WO2017037785A1 (ja) * 2015-08-28 2017-03-09 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP6297660B1 (ja) * 2016-11-22 2018-03-20 株式会社荏原製作所 処理装置、これを備えためっき装置、搬送装置、及び処理方法
CN117457549B (zh) * 2023-12-25 2024-04-12 富芯微电子有限公司 一种用于晶闸管管芯生产的表面腐蚀设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01137453U (ja) * 1988-03-16 1989-09-20
JP2000031239A (ja) * 1998-07-13 2000-01-28 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2000183019A (ja) * 1998-12-21 2000-06-30 Dainippon Screen Mfg Co Ltd 多段基板処理装置

Also Published As

Publication number Publication date
CN1455951A (zh) 2003-11-12
CN1246895C (zh) 2006-03-22
TW529072B (en) 2003-04-21
WO2002069392A1 (fr) 2002-09-06
JP2002261143A (ja) 2002-09-13
JP3587788B2 (ja) 2004-11-10

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E601 Decision to refuse application