TW527510B - Substrate sticking device - Google Patents

Substrate sticking device Download PDF

Info

Publication number
TW527510B
TW527510B TW090109200A TW90109200A TW527510B TW 527510 B TW527510 B TW 527510B TW 090109200 A TW090109200 A TW 090109200A TW 90109200 A TW90109200 A TW 90109200A TW 527510 B TW527510 B TW 527510B
Authority
TW
Taiwan
Prior art keywords
substrates
vacuum chamber
substrate
face
upper face
Prior art date
Application number
TW090109200A
Other languages
English (en)
Chinese (zh)
Inventor
Akira Hirai
Satoshi Hachiman
Kiyoshi Imaizumi
Masayuki Saito
Masatomo Endo
Original Assignee
Hitachi Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ind Co Ltd filed Critical Hitachi Ind Co Ltd
Application granted granted Critical
Publication of TW527510B publication Critical patent/TW527510B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
    • H01L2224/75101—Chamber
    • H01L2224/75102—Vacuum chamber

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Combinations Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Laminated Bodies (AREA)
TW090109200A 2000-04-19 2001-04-17 Substrate sticking device TW527510B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000123714A JP3492284B2 (ja) 2000-04-19 2000-04-19 基板貼合装置

Publications (1)

Publication Number Publication Date
TW527510B true TW527510B (en) 2003-04-11

Family

ID=18633956

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090109200A TW527510B (en) 2000-04-19 2001-04-17 Substrate sticking device

Country Status (4)

Country Link
JP (1) JP3492284B2 (ko)
KR (1) KR100362721B1 (ko)
SG (1) SG100676A1 (ko)
TW (1) TW527510B (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102490447A (zh) * 2011-11-16 2012-06-13 申日恒 Ccd定位的自动贴合机及其定位贴合方法
TWI384271B (zh) * 2006-07-24 2013-02-01 Hitachi Plant Technologies Ltd Substrate bonding device
TWI584389B (zh) * 2014-10-23 2017-05-21 松下知識產權經營股份有限公司 Semiconductor device manufacturing method and manufacturing device
TWI585966B (zh) * 2012-10-18 2017-06-01 三星顯示器有限公司 薄膜層化裝置及使用該薄膜層化裝置製造有機發光顯示裝置之方法

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JP4880838B2 (ja) * 2001-09-05 2012-02-22 株式会社東芝 液晶表示装置の組立て方法及び組立て装置
US7253866B2 (en) 2001-10-27 2007-08-07 Lg.Philips Lcd Co., Ltd. Method of fabricating liquid crystal display device
US6819391B2 (en) 2001-11-30 2004-11-16 Lg. Philips Lcd Co., Ltd. Liquid crystal display panel having dummy column spacer with opened portion
KR100652045B1 (ko) 2001-12-21 2006-11-30 엘지.필립스 엘시디 주식회사 액정표시소자 및 그 제조방법
KR100469353B1 (ko) 2002-02-06 2005-02-02 엘지.필립스 엘시디 주식회사 액정표시소자용 합착 장치
KR100817129B1 (ko) 2002-02-07 2008-03-27 엘지.필립스 엘시디 주식회사 액정 패널의 절단 장치 및 그 방법
KR100789454B1 (ko) 2002-02-09 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 장치 및 그 방법
KR100832292B1 (ko) 2002-02-19 2008-05-26 엘지디스플레이 주식회사 액정 패널의 절단 장치
KR100469359B1 (ko) 2002-02-20 2005-02-02 엘지.필립스 엘시디 주식회사 액정표시소자용 합착 장치
US6824023B2 (en) 2002-02-20 2004-11-30 Lg. Philips Lcd Co., Ltd. Liquid crystal dispensing apparatus
KR100789455B1 (ko) 2002-02-20 2007-12-31 엘지.필립스 엘시디 주식회사 액정 패널의 절단 방법
KR100672641B1 (ko) 2002-02-20 2007-01-23 엘지.필립스 엘시디 주식회사 액정표시소자 및 그 제조방법
KR100469360B1 (ko) 2002-02-22 2005-02-02 엘지.필립스 엘시디 주식회사 액정표시소자의 제조 장비용 진공 합착 장치 및 구동 방법
KR100469508B1 (ko) 2002-02-22 2005-02-02 엘지.필립스 엘시디 주식회사 스프링의 장력조정에 의해 액정적하량을 제어가 가능한액정적하장치
US6803984B2 (en) 2002-02-25 2004-10-12 Lg.Philips Lcd Co., Ltd. Method and apparatus for manufacturing liquid crystal display device using serial production processes
US6712883B2 (en) 2002-02-25 2004-03-30 Lg.Philips Lcd Co., Ltd. Apparatus and method for deaerating liquid crystal
US6784970B2 (en) 2002-02-27 2004-08-31 Lg.Philips Lcd Co., Ltd. Method of fabricating LCD
KR100511352B1 (ko) * 2002-02-27 2005-08-31 엘지.필립스 엘시디 주식회사 액정적하장치 및 액정적하량 제어방법
US6833901B2 (en) 2002-02-27 2004-12-21 Lg. Philips Lcd Co., Ltd. Method for fabricating LCD having upper substrate coated with sealant
KR100685951B1 (ko) 2002-03-06 2007-02-23 엘지.필립스 엘시디 주식회사 액정표시소자 및 그 제조방법
KR100606966B1 (ko) 2002-03-06 2006-08-01 엘지.필립스 엘시디 주식회사 액정표시소자의 제조라인
KR100662495B1 (ko) 2002-03-07 2007-01-02 엘지.필립스 엘시디 주식회사 액정표시소자의 제조방법
KR100817130B1 (ko) 2002-03-13 2008-03-27 엘지.필립스 엘시디 주식회사 액정 패널의 연마량 검출 패턴 및 이를 이용한 연마불량판단 방법
US6782928B2 (en) 2002-03-15 2004-08-31 Lg.Philips Lcd Co., Ltd. Liquid crystal dispensing apparatus having confirming function for remaining amount of liquid crystal and method for measuring the same
KR100817132B1 (ko) 2002-03-15 2008-03-27 엘지.필립스 엘시디 주식회사 액정적하장치
JP3693972B2 (ja) * 2002-03-19 2005-09-14 富士通株式会社 貼合せ基板製造装置及び基板貼合せ方法
KR100841623B1 (ko) 2002-03-21 2008-06-27 엘지디스플레이 주식회사 액정 패널의 연마장치
US6827240B2 (en) 2002-03-21 2004-12-07 Lg.Philips Lcd Co., Ltd. Liquid crystal dispensing apparatus
US6793756B2 (en) 2002-03-22 2004-09-21 Lg. Phillips Lcd Co., Ltd. Substrate bonding apparatus for liquid crystal display device and method for driving the same
KR100662496B1 (ko) 2002-03-23 2007-01-02 엘지.필립스 엘시디 주식회사 액정표시소자 및 그 제조방법
JP4210139B2 (ja) 2002-03-23 2009-01-14 エルジー ディスプレイ カンパニー リミテッド スペーサの高さによって液晶の滴下量調整が可能である液晶滴下装置及びその滴下方法
KR100685923B1 (ko) * 2002-03-25 2007-02-23 엘지.필립스 엘시디 주식회사 합착 장치 및 이를 이용한 액정표시장치의 제조 방법
KR100815910B1 (ko) * 2002-03-25 2008-03-21 엘지.필립스 엘시디 주식회사 액정표시소자용 진공 합착 장치의 진공 챔버
KR100518269B1 (ko) 2002-03-25 2005-10-04 엘지.필립스 엘시디 주식회사 복수의 액정적하기를 이용한 액정적하방법
KR100698040B1 (ko) 2002-06-14 2007-03-23 엘지.필립스 엘시디 주식회사 이동용 지그
CN100365673C (zh) * 2002-11-19 2008-01-30 株式会社石川制作所 像素控制元件选择转印后的布线形成方法
KR100700176B1 (ko) 2002-12-18 2007-03-27 엘지.필립스 엘시디 주식회사 액정 표시패널의 디스펜서 및 이를 이용한 노즐과 기판의갭 제어방법
KR100618578B1 (ko) 2002-12-20 2006-08-31 엘지.필립스 엘시디 주식회사 액정 표시패널의 디스펜서 및 이를 이용한 디스펜싱 방법
JP4190918B2 (ja) 2003-03-11 2008-12-03 シャープ株式会社 真空処理装置
KR100996576B1 (ko) 2003-05-09 2010-11-24 주식회사 탑 엔지니어링 액정적하장치 및 액정적하방법
KR101026935B1 (ko) 2003-12-10 2011-04-04 엘지디스플레이 주식회사 디스펜서 정렬장치 및 그 방법
JP4078487B2 (ja) 2005-05-25 2008-04-23 株式会社日立プラントテクノロジー 基板組立装置及び方法
JP4107316B2 (ja) * 2005-09-02 2008-06-25 株式会社日立プラントテクノロジー 基板貼合装置
JP2007187926A (ja) * 2006-01-13 2007-07-26 Sharp Corp 表示素子の製造装置および表示素子の製造方法
JP2007212572A (ja) * 2006-02-07 2007-08-23 Ulvac Japan Ltd 貼合せ基板の製造方法、及び貼合せ基板製造装置
CN102649337B (zh) * 2011-06-20 2015-04-08 京东方科技集团股份有限公司 一种膜片贴附方法和膜片贴附装置
CN103386802A (zh) * 2012-05-07 2013-11-13 帆宣系统科技股份有限公司 触控显示面板贴合方法及其装置
CN103192581B (zh) * 2013-01-23 2015-06-17 福建宝发光电科技集团有限公司 一种高精度贴合机

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JPH11326857A (ja) * 1998-05-13 1999-11-26 Toshiba Corp 基板の組立て装置及び組立て方法
JP2000002862A (ja) * 1998-06-12 2000-01-07 Matsushita Electric Ind Co Ltd 液晶表示素子の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384271B (zh) * 2006-07-24 2013-02-01 Hitachi Plant Technologies Ltd Substrate bonding device
CN102490447A (zh) * 2011-11-16 2012-06-13 申日恒 Ccd定位的自动贴合机及其定位贴合方法
CN102490447B (zh) * 2011-11-16 2015-04-08 申日恒 Ccd定位的自动贴合机及其定位贴合方法
TWI585966B (zh) * 2012-10-18 2017-06-01 三星顯示器有限公司 薄膜層化裝置及使用該薄膜層化裝置製造有機發光顯示裝置之方法
TWI584389B (zh) * 2014-10-23 2017-05-21 松下知識產權經營股份有限公司 Semiconductor device manufacturing method and manufacturing device

Also Published As

Publication number Publication date
JP2001305563A (ja) 2001-10-31
KR100362721B1 (ko) 2002-11-29
KR20010098697A (ko) 2001-11-08
JP3492284B2 (ja) 2004-02-03
SG100676A1 (en) 2003-12-26

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees