TW511301B - Method of heat-treating nitride compound semiconductor layer and method of producing semiconductor device - Google Patents
Method of heat-treating nitride compound semiconductor layer and method of producing semiconductor device Download PDFInfo
- Publication number
- TW511301B TW511301B TW090119146A TW90119146A TW511301B TW 511301 B TW511301 B TW 511301B TW 090119146 A TW090119146 A TW 090119146A TW 90119146 A TW90119146 A TW 90119146A TW 511301 B TW511301 B TW 511301B
- Authority
- TW
- Taiwan
- Prior art keywords
- air
- compound semiconductor
- semiconductor layer
- nitride compound
- heat
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10P95/90—Thermal treatments, e.g. annealing or sintering
- H10P95/904—Thermal treatments, e.g. annealing or sintering of Group III-V semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/04—MOCVD or MOVPE
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3054—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure p-doping
- H01S5/3063—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure p-doping using Mg
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
- H10H20/8252—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN characterised by the dopants
Landscapes
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Biophysics (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
- Chemical Vapour Deposition (AREA)
- Bipolar Transistors (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000241967A JP4581198B2 (ja) | 2000-08-10 | 2000-08-10 | 窒化物化合物半導体層の熱処理方法及び半導体素子の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW511301B true TW511301B (en) | 2002-11-21 |
Family
ID=18733064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW090119146A TW511301B (en) | 2000-08-10 | 2001-08-06 | Method of heat-treating nitride compound semiconductor layer and method of producing semiconductor device |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US6524976B2 (https=) |
| EP (1) | EP1179859A3 (https=) |
| JP (1) | JP4581198B2 (https=) |
| KR (1) | KR100814049B1 (https=) |
| TW (1) | TW511301B (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4148664B2 (ja) * | 2001-02-02 | 2008-09-10 | 三洋電機株式会社 | 窒化物系半導体レーザ素子およびその形成方法 |
| JP3622200B2 (ja) * | 2001-07-02 | 2005-02-23 | ソニー株式会社 | 窒化物半導体の製造方法および半導体素子の製造方法 |
| JP4023121B2 (ja) * | 2001-09-06 | 2007-12-19 | 豊田合成株式会社 | n型電極、III族窒化物系化合物半導体素子、n型電極の製造方法、及びIII族窒化物系化合物半導体素子の製造方法 |
| TWI295483B (en) * | 2002-01-31 | 2008-04-01 | Sumitomo Chemical Co | 3-5 group compound semiconductor, process for producing the same, and compound semiconductor element using the same |
| GB2407701A (en) * | 2003-10-28 | 2005-05-04 | Sharp Kk | Manufacture of a semiconductor light-emitting device |
| WO2005109478A1 (en) * | 2004-05-12 | 2005-11-17 | Showa Denko K.K. | P-type group iii nitride semiconductor and production method thereof |
| KR101081158B1 (ko) | 2004-07-08 | 2011-11-07 | 엘지이노텍 주식회사 | 발광 다이오드 제조방법 |
| WO2006022498A1 (en) * | 2004-08-26 | 2006-03-02 | Lg Innotek Co., Ltd | Nitride semicondctor light emitting device and fabrication method thereof |
| JP2007151807A (ja) * | 2005-12-05 | 2007-06-21 | Univ Meijo | 半導体発光素子による光線治療方法、及び半導体発光素子による光線治療システム |
| US7501295B2 (en) * | 2006-05-25 | 2009-03-10 | Philips Lumileds Lighting Company, Llc | Method of fabricating a reflective electrode for a semiconductor light emitting device |
| GB2446611B (en) * | 2007-02-14 | 2011-08-17 | Bookham Technology Plc | Low creep metallization for optoelectronic applications |
| JP2008306176A (ja) * | 2007-05-08 | 2008-12-18 | Tokyo Electron Ltd | 化合物半導体の熱処理方法及びその装置 |
| US7897418B2 (en) * | 2007-12-28 | 2011-03-01 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor light emitting device |
| KR101034059B1 (ko) * | 2010-01-15 | 2011-05-12 | 엘지이노텍 주식회사 | 발광 소자 활성화 장치 및 이를 이용한 발광 소자 활성화 방법 |
| JP5554739B2 (ja) * | 2011-03-23 | 2014-07-23 | シャープ株式会社 | 窒化物半導体発光素子の製造方法 |
| JP6330705B2 (ja) * | 2015-03-24 | 2018-05-30 | 豊田合成株式会社 | 半導体装置およびその製造方法ならびに電力変換装置 |
| WO2020121794A1 (ja) * | 2018-12-11 | 2020-06-18 | パナソニックセミコンダクターソリューションズ株式会社 | 窒化物系半導体発光素子及びその製造方法、並びに、窒化物系半導体結晶の製造方法 |
| JP7166188B2 (ja) * | 2019-02-13 | 2022-11-07 | 日機装株式会社 | 窒化物半導体の水素脱離方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH069258B2 (ja) | 1989-03-30 | 1994-02-02 | 名古屋大学長 | 窒化ガリウム系化合物半導体発光素子の作製方法 |
| GB2255443B (en) * | 1991-04-30 | 1995-09-13 | Samsung Electronics Co Ltd | Fabricating a metal electrode of a semiconductor device |
| JP2540791B2 (ja) * | 1991-11-08 | 1996-10-09 | 日亜化学工業株式会社 | p型窒化ガリウム系化合物半導体の製造方法。 |
| US5306662A (en) | 1991-11-08 | 1994-04-26 | Nichia Chemical Industries, Ltd. | Method of manufacturing P-type compound semiconductor |
| JP2790235B2 (ja) * | 1993-04-28 | 1998-08-27 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体のp型化方法 |
| US5767533A (en) * | 1996-05-08 | 1998-06-16 | Vydyanath; Honnavalli R. | High-conductivity semiconductor material having a dopant comprising coulombic pairs of elements |
| JP3393425B2 (ja) * | 1996-06-21 | 2003-04-07 | ソニー株式会社 | 窒化物系化合物半導体の熱処理方法 |
| JPH10144960A (ja) * | 1996-11-08 | 1998-05-29 | Nichia Chem Ind Ltd | p型窒化物半導体の製造方法及び窒化物半導体素子 |
| JP3658892B2 (ja) * | 1996-11-25 | 2005-06-08 | 日亜化学工業株式会社 | p型窒化物半導体の成長方法及び窒化物半導体素子 |
| JPH09298311A (ja) * | 1996-12-18 | 1997-11-18 | Nichia Chem Ind Ltd | 窒化ガリウム系化合物半導体発光素子 |
| TW329058B (en) * | 1997-03-20 | 1998-04-01 | Ind Tech Res Inst | Manufacturing method for P type gallium nitride |
| JPH10294490A (ja) * | 1997-04-17 | 1998-11-04 | Toshiba Electron Eng Corp | p型窒化ガリウム系化合物半導体、その製造方法および青色発光素子 |
| US6268618B1 (en) * | 1997-05-08 | 2001-07-31 | Showa Denko K.K. | Electrode for light-emitting semiconductor devices and method of producing the electrode |
| JPH11177134A (ja) * | 1997-12-15 | 1999-07-02 | Sharp Corp | 半導体素子の製造方法及び半導体素子、並びに発光素子の製造方法及び発光素子 |
| KR19990052640A (ko) | 1997-12-23 | 1999-07-15 | 김효근 | 오믹접촉 형성을 이용한 다이오드용 금속박막및 그의 제조방법 |
| JP3447940B2 (ja) * | 1997-12-24 | 2003-09-16 | 東芝電子エンジニアリング株式会社 | 半導体装置の製造方法 |
| JPH11238692A (ja) * | 1998-02-23 | 1999-08-31 | Nichia Chem Ind Ltd | 窒化物半導体の低抵抗化方法 |
| JP3425357B2 (ja) * | 1998-03-19 | 2003-07-14 | 株式会社東芝 | p型窒化ガリウム系化合物半導体層の製造方法 |
| JP4137223B2 (ja) * | 1998-03-27 | 2008-08-20 | 星和電機株式会社 | 化合物半導体の製造方法 |
| TW501160B (en) * | 1998-05-08 | 2002-09-01 | Samsung Electronics Co Ltd | Method of activating compound semiconductor layer to p-type compound semiconductor layer |
| JPH11354458A (ja) * | 1998-06-11 | 1999-12-24 | Matsushita Electron Corp | p型III−V族窒化物半導体およびその製造方法 |
| TW386286B (en) * | 1998-10-26 | 2000-04-01 | Ind Tech Res Inst | An ohmic contact of semiconductor and the manufacturing method |
| US6287947B1 (en) * | 1999-06-08 | 2001-09-11 | Lumileds Lighting, U.S. Llc | Method of forming transparent contacts to a p-type GaN layer |
| JP3675234B2 (ja) * | 1999-06-28 | 2005-07-27 | 豊田合成株式会社 | 半導体発光素子の製造方法 |
| JP2001298213A (ja) * | 2000-04-12 | 2001-10-26 | Showa Denko Kk | p型III族窒化物半導体、その製造方法およびそれを用いた半導体発光素子の製造方法 |
| US6326294B1 (en) * | 2000-04-27 | 2001-12-04 | Kwangju Institute Of Science And Technology | Method of fabricating an ohmic metal electrode for use in nitride compound semiconductor devices |
| JP4652530B2 (ja) * | 2000-07-10 | 2011-03-16 | 昭和電工株式会社 | 窒化ガリウム系化合物半導体発光素子の作製方法 |
| US20020004254A1 (en) | 2000-07-10 | 2002-01-10 | Showa Denko Kabushiki Kaisha | Method for producing p-type gallium nitride-based compound semiconductor, method for producing gallium nitride-based compound semiconductor light-emitting device, and gallium nitride-based compound semiconductor light-emitting device |
-
2000
- 2000-08-10 JP JP2000241967A patent/JP4581198B2/ja not_active Expired - Fee Related
-
2001
- 2001-08-06 TW TW090119146A patent/TW511301B/zh active
- 2001-08-08 KR KR1020010047740A patent/KR100814049B1/ko not_active Expired - Fee Related
- 2001-08-09 US US09/924,615 patent/US6524976B2/en not_active Expired - Fee Related
- 2001-08-10 EP EP01402161A patent/EP1179859A3/en not_active Withdrawn
-
2002
- 2002-12-23 US US10/326,072 patent/US6861340B2/en not_active Expired - Fee Related
-
2003
- 2003-01-24 US US10/350,190 patent/US6797595B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1179859A3 (en) | 2009-09-30 |
| EP1179859A2 (en) | 2002-02-13 |
| JP4581198B2 (ja) | 2010-11-17 |
| KR100814049B1 (ko) | 2008-03-18 |
| US20020055274A1 (en) | 2002-05-09 |
| KR20020013728A (ko) | 2002-02-21 |
| JP2002057161A (ja) | 2002-02-22 |
| US20030124877A1 (en) | 2003-07-03 |
| US6524976B2 (en) | 2003-02-25 |
| US6861340B2 (en) | 2005-03-01 |
| US20030143770A1 (en) | 2003-07-31 |
| US6797595B2 (en) | 2004-09-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW511301B (en) | Method of heat-treating nitride compound semiconductor layer and method of producing semiconductor device | |
| WO2003107442A2 (en) | Electrode for p-type gallium nitride-based semiconductors | |
| US20100059760A1 (en) | Gallium nitride-based compound semiconductor light emitting device and process for its production | |
| JP2002057161A5 (https=) | ||
| US6734091B2 (en) | Electrode for p-type gallium nitride-based semiconductors | |
| US7537944B2 (en) | Method for manufacturing p-type group III nitride semiconductor, and group III nitride semiconductor light-emitting device | |
| CN104246987B (zh) | Iii族氮化物基板的处理方法及外延基板的制造方法 | |
| TW201009898A (en) | Film deposition method | |
| TWI295483B (en) | 3-5 group compound semiconductor, process for producing the same, and compound semiconductor element using the same | |
| CN110777433B (zh) | 氮化物晶体 | |
| Kamp et al. | On surface cracking of ammonia for mbe growth of GaN | |
| CN113330586B (zh) | 深紫外发光元件用反射电极的制造方法、深紫外发光元件的制造方法及深紫外发光元件 | |
| JP3757544B2 (ja) | Iii族窒化物半導体発光素子 | |
| EP2080221B1 (en) | A susceptor and method of forming a led device using such susceptor | |
| JP3785059B2 (ja) | 窒化物半導体の製造方法 | |
| JP2000049378A (ja) | 発光素子用窒化物半導体及びその製造方法 | |
| Kozodoy | Magnesium-doped gallium nitride for electronic and optoelectronic device applications | |
| KR100594626B1 (ko) | 원자층 증착법을 이용한 질화막의 형성 방법 | |
| CN110777431A (zh) | 氮化物晶体 | |
| JP2002203798A (ja) | p型窒化物半導体及びその製造方法 | |
| JP2007173854A (ja) | 窒化物化合物半導体層の熱処理方法及び半導体素子の製造方法 | |
| JP2007180564A (ja) | 窒化物化合物半導体層の熱処理方法及び半導体素子の製造方法 | |
| JP2025024110A (ja) | 窒化物結晶および半導体積層物 | |
| JP2006128536A (ja) | 半導体エピタキシャルウェハ及びそれから切り出した半導体素子 | |
| Davis et al. | Growth via Mocvd and Characterization Of GaN and AlxGa1− xN (0001) Alloys for Optoelectronic and Microelectronic Device Applications |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |