TW480592B - Vacuum processing apparatus for semiconductor process - Google Patents

Vacuum processing apparatus for semiconductor process Download PDF

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Publication number
TW480592B
TW480592B TW089127545A TW89127545A TW480592B TW 480592 B TW480592 B TW 480592B TW 089127545 A TW089127545 A TW 089127545A TW 89127545 A TW89127545 A TW 89127545A TW 480592 B TW480592 B TW 480592B
Authority
TW
Taiwan
Prior art keywords
processing
processing chamber
scope
container body
patent application
Prior art date
Application number
TW089127545A
Other languages
English (en)
Chinese (zh)
Inventor
Kenji Amano
Yoshitsugu Tanaka
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW480592B publication Critical patent/TW480592B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW089127545A 1999-12-22 2000-12-21 Vacuum processing apparatus for semiconductor process TW480592B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36501199A JP3527450B2 (ja) 1999-12-22 1999-12-22 処理装置

Publications (1)

Publication Number Publication Date
TW480592B true TW480592B (en) 2002-03-21

Family

ID=18483216

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089127545A TW480592B (en) 1999-12-22 2000-12-21 Vacuum processing apparatus for semiconductor process

Country Status (4)

Country Link
US (1) US6565662B2 (ja)
JP (1) JP3527450B2 (ja)
KR (1) KR100497880B1 (ja)
TW (1) TW480592B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
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CN102270565A (zh) * 2010-06-07 2011-12-07 东京毅力科创株式会社 基板处理装置
TWI400753B (zh) * 2005-08-31 2013-07-01 Tokyo Electron Ltd A substrate processing apparatus and a substrate processing system

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JP3527450B2 (ja) * 1999-12-22 2004-05-17 東京エレクトロン株式会社 処理装置
US6776848B2 (en) * 2002-01-17 2004-08-17 Applied Materials, Inc. Motorized chamber lid
JP4219702B2 (ja) 2003-02-06 2009-02-04 東京エレクトロン株式会社 減圧処理装置
KR100490049B1 (ko) * 2003-04-14 2005-05-17 삼성전자주식회사 일체형 디퓨저 프레임을 가지는 ｃｖｄ 장치
US20050063798A1 (en) * 2003-06-06 2005-03-24 Davis Jeffry Alan Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces
US20050050767A1 (en) * 2003-06-06 2005-03-10 Hanson Kyle M. Wet chemical processing chambers for processing microfeature workpieces
US7393439B2 (en) * 2003-06-06 2008-07-01 Semitool, Inc. Integrated microfeature workpiece processing tools with registration systems for paddle reactors
US20050034977A1 (en) * 2003-06-06 2005-02-17 Hanson Kyle M. Electrochemical deposition chambers for depositing materials onto microfeature workpieces
US20070214620A1 (en) * 2003-06-11 2007-09-20 Mitsuru Miyazaki Substrate processing apparatus and substrate processing method
US20070144912A1 (en) * 2003-07-01 2007-06-28 Woodruff Daniel J Linearly translating agitators for processing microfeature workpieces, and associated methods
US7335277B2 (en) * 2003-09-08 2008-02-26 Hitachi High-Technologies Corporation Vacuum processing apparatus
CN1898997A (zh) * 2003-11-03 2007-01-17 美国芯源系统股份有限公司 具有用于驱动器控制的集成光敏元件的光源驱动器
KR100856679B1 (ko) * 2004-12-08 2008-09-04 주식회사 에이디피엔지니어링 평판표시소자 제조장치
US20060071384A1 (en) * 2004-10-06 2006-04-06 Advanced Display Process Engineering Co. Ltd. Apparatus for manufacturing flat-panel display
KR100648403B1 (ko) * 2004-10-20 2006-11-24 주식회사 에이디피엔지니어링 플라즈마 처리장치
JP4432728B2 (ja) * 2004-10-29 2010-03-17 株式会社島津製作所 真空処理装置
KR100661752B1 (ko) * 2005-02-04 2006-12-27 주식회사 에이디피엔지니어링 운반용 호이스트 지그
TWI304241B (en) 2005-02-04 2008-12-11 Advanced Display Proc Eng Co Vacuum processing apparatus
KR100667598B1 (ko) * 2005-02-25 2007-01-12 주식회사 아이피에스 반도체 처리 장치
US20060218680A1 (en) * 2005-03-28 2006-09-28 Bailey Andrew D Iii Apparatus for servicing a plasma processing system with a robot
JP4837953B2 (ja) * 2005-07-26 2011-12-14 コスミック工業株式会社 蓋体開閉装置
US20070125303A1 (en) * 2005-12-02 2007-06-07 Ward Ruby High-throughput deposition system for oxide thin film growth by reactive coevaportation
US7883579B2 (en) * 2005-12-14 2011-02-08 Tokyo Electron Limited Substrate processing apparatus and lid supporting apparatus for the substrate processing apparatus
WO2007083393A1 (ja) * 2006-01-23 2007-07-26 Youtec Co., Ltd. 成膜装置及び蒸着装置
TWI279381B (en) * 2006-01-26 2007-04-21 Au Optronics Corp Method for maintaining low pressure process apparatus and transmitting device thereof
EP1994548A1 (en) * 2006-03-08 2008-11-26 Sez Ag Device for fluid treating plate-like articles
KR100790797B1 (ko) * 2006-06-08 2008-01-02 주식회사 아이피에스 진공처리장치
JP4914139B2 (ja) * 2006-07-24 2012-04-11 株式会社日立ハイテクノロジーズ 半導体処理装置
US20080178460A1 (en) * 2007-01-29 2008-07-31 Woodruff Daniel J Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods
TWI405295B (zh) * 2007-08-13 2013-08-11 Advanced Display Proc Eng Co 基板處理裝置及方法
US20090258162A1 (en) * 2008-04-12 2009-10-15 Applied Materials, Inc. Plasma processing apparatus and method
US20090255798A1 (en) * 2008-04-12 2009-10-15 Gaku Furuta Method to prevent parasitic plasma generation in gas feedthru of large size pecvd chamber
JP5659146B2 (ja) * 2008-04-12 2015-01-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ プラズマ処理装置及び方法
KR101000330B1 (ko) 2008-04-22 2010-12-13 엘아이지에이디피 주식회사 기판처리장
KR101066033B1 (ko) * 2009-07-28 2011-09-20 엘아이지에이디피 주식회사 화학기상 증착장치 및 기판 처리장치
JP2011040182A (ja) * 2009-08-07 2011-02-24 Mitsubishi Heavy Ind Ltd 有機発光パネルの製造装置及び有機発光パネルの製造方法
JP5560909B2 (ja) * 2010-05-31 2014-07-30 東京エレクトロン株式会社 蓋体保持治具
JP5585238B2 (ja) 2010-06-24 2014-09-10 東京エレクトロン株式会社 基板処理装置
JP5595202B2 (ja) * 2010-09-28 2014-09-24 東京エレクトロン株式会社 処理装置およびそのメンテナンス方法
KR101136728B1 (ko) * 2010-10-18 2012-04-20 주성엔지니어링(주) 기판처리장치와 그의 분해 및 조립방법
JP5965680B2 (ja) * 2012-03-08 2016-08-10 東京エレクトロン株式会社 処理室内部品の冷却方法、処理室内部品冷却プログラム、及び記憶媒体
CN103911598A (zh) * 2012-12-31 2014-07-09 光达光电设备科技（嘉兴）有限公司 一种金属有机化学气相沉积设备
KR20140090445A (ko) * 2013-01-09 2014-07-17 삼성디스플레이 주식회사 기판 처리 장치
KR20150015714A (ko) * 2013-08-01 2015-02-11 삼성전자주식회사 서셉터 및 이를 포함하는 막 증착장치
JP6293499B2 (ja) * 2014-01-27 2018-03-14 株式会社日立ハイテクノロジーズ 真空処理装置
JP5941943B2 (ja) * 2014-05-08 2016-06-29 ワイエイシイ株式会社 蓋体開閉装置およびマルチチャンバー処理システム
JP5960758B2 (ja) * 2014-07-24 2016-08-02 東京エレクトロン株式会社 基板処理システムおよび基板処理装置
JP6567886B2 (ja) * 2015-06-15 2019-08-28 株式会社日立ハイテクノロジーズ プラズマ処理装置
CN106898535B (zh) * 2015-12-21 2018-11-20 中微半导体设备(上海)有限公司 半导体处理设备、系统与半导体处理设备的顶盖开启方法
US20210178473A1 (en) * 2019-12-12 2021-06-17 Arcam Ab Additive manufacturing apparatuses with separable process chamber housing portions and methods of use
US20220093426A1 (en) * 2020-09-21 2022-03-24 Applied Materials, Inc. Movable semiconductor processing chamber for improved serviceability
DE102022129723A1 (de) * 2022-11-10 2024-05-16 Aixtron Se CVD-Reaktor mit herausnehmbarem Prozesskammergehäuse

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400753B (zh) * 2005-08-31 2013-07-01 Tokyo Electron Ltd A substrate processing apparatus and a substrate processing system
CN102270565A (zh) * 2010-06-07 2011-12-07 东京毅力科创株式会社 基板处理装置
CN102270565B (zh) * 2010-06-07 2014-03-12 东京毅力科创株式会社 基板处理装置

Also Published As

Publication number Publication date
JP3527450B2 (ja) 2004-05-17
KR100497880B1 (ko) 2005-06-29
KR20010067439A (ko) 2001-07-12
JP2001185534A (ja) 2001-07-06
US6565662B2 (en) 2003-05-20
US20010006094A1 (en) 2001-07-05

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