TW457583B - Metallization etching techniques for reducing post-etch corrosion of metal lines - Google Patents

Metallization etching techniques for reducing post-etch corrosion of metal lines Download PDF

Info

Publication number
TW457583B
TW457583B TW088115813A TW88115813A TW457583B TW 457583 B TW457583 B TW 457583B TW 088115813 A TW088115813 A TW 088115813A TW 88115813 A TW88115813 A TW 88115813A TW 457583 B TW457583 B TW 457583B
Authority
TW
Taiwan
Prior art keywords
metal
layer
etching
mask
hard mask
Prior art date
Application number
TW088115813A
Other languages
English (en)
Chinese (zh)
Inventor
Martin Gutsche
Peter Strobl
Stephan Wege
Eike Lueken
Georg Stojakovic
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of TW457583B publication Critical patent/TW457583B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW088115813A 1998-09-15 2000-01-10 Metallization etching techniques for reducing post-etch corrosion of metal lines TW457583B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/153,390 US6177353B1 (en) 1998-09-15 1998-09-15 Metallization etching techniques for reducing post-etch corrosion of metal lines

Publications (1)

Publication Number Publication Date
TW457583B true TW457583B (en) 2001-10-01

Family

ID=22547020

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088115813A TW457583B (en) 1998-09-15 2000-01-10 Metallization etching techniques for reducing post-etch corrosion of metal lines

Country Status (7)

Country Link
US (1) US6177353B1 (enExample)
EP (1) EP0987745B1 (enExample)
JP (1) JP4690512B2 (enExample)
KR (1) KR100676995B1 (enExample)
CN (1) CN1146967C (enExample)
DE (1) DE69935100T2 (enExample)
TW (1) TW457583B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8748323B2 (en) 2008-07-07 2014-06-10 Macronix International Co., Ltd. Patterning method
TWI812762B (zh) * 2018-07-30 2023-08-21 日商東京威力科創股份有限公司 處理被處理體之方法、處理裝置及處理系統

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100528685B1 (ko) * 1998-03-12 2005-11-15 가부시끼가이샤 히다치 세이사꾸쇼 시료의 표면 가공방법
KR100283425B1 (ko) * 1998-09-24 2001-04-02 윤종용 반도체소자의금속배선형성공정및그시스템
US6399508B1 (en) * 1999-01-12 2002-06-04 Applied Materials, Inc. Method for metal etch using a dielectric hard mask
JP3257533B2 (ja) * 1999-01-25 2002-02-18 日本電気株式会社 無機反射防止膜を使った配線形成方法
US6291361B1 (en) * 1999-03-24 2001-09-18 Conexant Systems, Inc. Method and apparatus for high-resolution in-situ plasma etching of inorganic and metal films
US6576562B2 (en) * 2000-12-15 2003-06-10 Kabushiki Kaisha Toshiba Manufacturing method of semiconductor device using mask pattern having high etching resistance
DE10062639A1 (de) * 2000-12-15 2002-07-04 Infineon Technologies Ag Verfahren zur Erzeugung von Leiterbahnen
TWI243404B (en) * 2001-05-24 2005-11-11 Lam Res Corp Applications of oxide hardmasking in metal dry etch processors
KR100402239B1 (ko) * 2001-06-30 2003-10-17 주식회사 하이닉스반도체 반도체소자의 금속 게이트 형성방법
SG96644A1 (en) * 2001-09-11 2003-06-16 Chartered Semiconductor Mfg Etch/clean process for integrated circuit pad metal
KR100464430B1 (ko) * 2002-08-20 2005-01-03 삼성전자주식회사 하드 마스크를 이용한 알루미늄막 식각 방법 및 반도체소자의 배선 형성 방법
KR100478498B1 (ko) * 2003-01-30 2005-03-28 동부아남반도체 주식회사 반도체 소자의 금속 배선 형성 방법
US20040171272A1 (en) * 2003-02-28 2004-09-02 Applied Materials, Inc. Method of etching metallic materials to form a tapered profile
EP1475848B1 (en) * 2003-05-07 2006-12-20 STMicroelectronics S.r.l. Process for defining a chalcogenide material layer, in particular in a process for manufacturing phase change memory cells
KR100523141B1 (ko) * 2003-07-18 2005-10-19 매그나칩 반도체 유한회사 반도체 소자의 금속 배선층 형성방법
US20060169968A1 (en) * 2005-02-01 2006-08-03 Thomas Happ Pillar phase change memory cell
JP5110831B2 (ja) * 2006-08-31 2012-12-26 キヤノン株式会社 光電変換装置及び撮像システム
US20080094885A1 (en) * 2006-10-24 2008-04-24 Macronix International Co., Ltd. Bistable Resistance Random Access Memory Structures with Multiple Memory Layers and Multilevel Memory States
US20100003828A1 (en) * 2007-11-28 2010-01-07 Guowen Ding Methods for adjusting critical dimension uniformity in an etch process with a highly concentrated unsaturated hydrocarbon gas
US12444651B2 (en) 2009-08-04 2025-10-14 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US9683305B2 (en) * 2011-12-20 2017-06-20 Apple Inc. Metal surface and process for treating a metal surface
US8859418B2 (en) 2012-01-11 2014-10-14 Globalfoundries Inc. Methods of forming conductive structures using a dual metal hard mask technique
CN102723273B (zh) * 2012-05-28 2015-03-11 上海华力微电子有限公司 一种扩大铝线干法刻蚀腐蚀缺陷工艺窗口的方法
CN102820261A (zh) * 2012-08-22 2012-12-12 上海宏力半导体制造有限公司 铝刻蚀的方法
JP2015056578A (ja) * 2013-09-13 2015-03-23 株式会社東芝 半導体装置の製造方法
US9633867B2 (en) * 2015-01-05 2017-04-25 Lam Research Corporation Method and apparatus for anisotropic tungsten etching
US9576811B2 (en) 2015-01-12 2017-02-21 Lam Research Corporation Integrating atomic scale processes: ALD (atomic layer deposition) and ALE (atomic layer etch)
CN104658905B (zh) * 2015-02-27 2018-01-05 深圳市华星光电技术有限公司 一种刻蚀方法及基板
US9806252B2 (en) 2015-04-20 2017-10-31 Lam Research Corporation Dry plasma etch method to pattern MRAM stack
US9870899B2 (en) 2015-04-24 2018-01-16 Lam Research Corporation Cobalt etch back
US9972504B2 (en) 2015-08-07 2018-05-15 Lam Research Corporation Atomic layer etching of tungsten for enhanced tungsten deposition fill
US10096487B2 (en) 2015-08-19 2018-10-09 Lam Research Corporation Atomic layer etching of tungsten and other metals
US9984858B2 (en) 2015-09-04 2018-05-29 Lam Research Corporation ALE smoothness: in and outside semiconductor industry
US10229837B2 (en) 2016-02-04 2019-03-12 Lam Research Corporation Control of directionality in atomic layer etching
US10727073B2 (en) 2016-02-04 2020-07-28 Lam Research Corporation Atomic layer etching 3D structures: Si and SiGe and Ge smoothness on horizontal and vertical surfaces
US9991128B2 (en) 2016-02-05 2018-06-05 Lam Research Corporation Atomic layer etching in continuous plasma
US10269566B2 (en) 2016-04-29 2019-04-23 Lam Research Corporation Etching substrates using ale and selective deposition
US9837312B1 (en) 2016-07-22 2017-12-05 Lam Research Corporation Atomic layer etching for enhanced bottom-up feature fill
JP6785101B2 (ja) * 2016-09-09 2020-11-18 東京エレクトロン株式会社 プラズマエッチング方法
US10566212B2 (en) 2016-12-19 2020-02-18 Lam Research Corporation Designer atomic layer etching
US10559461B2 (en) 2017-04-19 2020-02-11 Lam Research Corporation Selective deposition with atomic layer etch reset
US10832909B2 (en) 2017-04-24 2020-11-10 Lam Research Corporation Atomic layer etch, reactive precursors and energetic sources for patterning applications
US9997371B1 (en) 2017-04-24 2018-06-12 Lam Research Corporation Atomic layer etch methods and hardware for patterning applications
EP3776636B1 (en) 2018-03-30 2025-05-07 Lam Research Corporation Atomic layer etching and smoothing of refractory metals and other high surface binding energy materials
CN114156178A (zh) * 2020-09-04 2022-03-08 中芯集成电路（宁波）有限公司 半导体结构的形成方法
CN115938937B (zh) * 2023-03-09 2023-06-09 合肥晶合集成电路股份有限公司 半导体结构及其制备方法
US20240429064A1 (en) * 2023-06-26 2024-12-26 Taiwan Semiconductor Manufacturing Company, Ltd. Metal etching with reduced tilt angle
US20250308897A1 (en) * 2024-03-28 2025-10-02 Tokyo Electron Limited Hard mask protection of metal interconnects

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6033367A (ja) * 1983-08-04 1985-02-20 Nec Corp アルミニウムのドライエッチング方法
US5211804A (en) 1990-10-16 1993-05-18 Oki Electric Industry, Co., Ltd. Method for dry etching
DE4107006A1 (de) * 1991-03-05 1992-09-10 Siemens Ag Verfahren zum anisotropen trockenaetzen von aluminium bzw. aluminiumlegierungen enthaltenden leiterbahnebenen in integrierten halbleiterschaltungen
US5270254A (en) * 1991-03-27 1993-12-14 Sgs-Thomson Microelectronics, Inc. Integrated circuit metallization with zero contact enclosure requirements and method of making the same
JPH05166756A (ja) * 1991-12-12 1993-07-02 Hitachi Ltd エッチング装置
US5387556A (en) * 1993-02-24 1995-02-07 Applied Materials, Inc. Etching aluminum and its alloys using HC1, C1-containing etchant and N.sub.2
US5573973A (en) * 1993-03-19 1996-11-12 National Semiconductor Corporation Integrated circuit having a diamond thin film trench arrangement as a component thereof and method
JP3161888B2 (ja) * 1993-09-17 2001-04-25 株式会社日立製作所 ドライエッチング方法
US5545289A (en) 1994-02-03 1996-08-13 Applied Materials, Inc. Passivating, stripping and corrosion inhibition of semiconductor substrates
JP2861785B2 (ja) 1994-02-15 1999-02-24 日本電気株式会社 半導体装置の配線の形成方法
JPH07249607A (ja) * 1994-03-14 1995-09-26 Fujitsu Ltd 半導体装置の製造方法
US5779926A (en) * 1994-09-16 1998-07-14 Applied Materials, Inc. Plasma process for etching multicomponent alloys
US5633424A (en) * 1994-12-29 1997-05-27 Graves; Clinton G. Device and methods for plasma sterilization
JP3353524B2 (ja) * 1995-03-22 2002-12-03 ソニー株式会社 接続孔を形成する工程を有する半導体装置の製造方法
US5585285A (en) * 1995-12-06 1996-12-17 Micron Technology, Inc. Method of forming dynamic random access memory circuitry using SOI and isolation trenches
US5654233A (en) * 1996-04-08 1997-08-05 Taiwan Semiconductor Manufacturing Company Ltd Step coverage enhancement process for sub half micron contact/via
US5827437A (en) * 1996-05-17 1998-10-27 Lam Research Corporation Multi-step metallization etch
US5741741A (en) * 1996-05-23 1998-04-21 Vanguard International Semiconductor Corporation Method for making planar metal interconnections and metal plugs on semiconductor substrates
JP3112832B2 (ja) * 1996-05-30 2000-11-27 日本電気株式会社 半導体装置の製造方法
US5792687A (en) * 1996-08-01 1998-08-11 Vanguard International Semiconductor Corporation Method for fabricating high density integrated circuits using oxide and polysilicon spacers
US5976986A (en) * 1996-08-06 1999-11-02 International Business Machines Corp. Low pressure and low power C12 /HC1 process for sub-micron metal etching
JP3258240B2 (ja) * 1996-09-10 2002-02-18 株式会社日立製作所 エッチング方法
JP3006508B2 (ja) * 1996-10-15 2000-02-07 日本電気株式会社 アルミニウム膜又はアルミニウム合金膜のエッチング方法
US5801082A (en) * 1997-08-18 1998-09-01 Vanguard International Semiconductor Corporation Method for making improved shallow trench isolation with dielectric studs for semiconductor integrated circuits
KR100255663B1 (ko) * 1997-12-11 2000-05-01 윤종용 알루미늄막의 식각방법 및 반도체장치의 배선층 형성방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8748323B2 (en) 2008-07-07 2014-06-10 Macronix International Co., Ltd. Patterning method
TWI812762B (zh) * 2018-07-30 2023-08-21 日商東京威力科創股份有限公司 處理被處理體之方法、處理裝置及處理系統

Also Published As

Publication number Publication date
CN1146967C (zh) 2004-04-21
US6177353B1 (en) 2001-01-23
DE69935100D1 (de) 2007-03-29
EP0987745A1 (en) 2000-03-22
EP0987745B1 (en) 2007-02-14
KR20000023166A (ko) 2000-04-25
JP4690512B2 (ja) 2011-06-01
DE69935100T2 (de) 2007-12-13
JP2000323483A (ja) 2000-11-24
KR100676995B1 (ko) 2007-01-31
CN1270415A (zh) 2000-10-18

Similar Documents

Publication Publication Date Title
TW457583B (en) Metallization etching techniques for reducing post-etch corrosion of metal lines
TW457584B (en) Mechanism for etching a silicon layer in a plasma processing chamber to form deep openings
EP0078224B1 (en) Inhibiting corrosion of aluminium metallization
TW201246360A (en) Wiggling control for pseudo-hardmask
TW388937B (en) Method for etching platinum
JPH07147271A (ja) 半導体装置の製造方法
US6214725B1 (en) Etching method
TWI393997B (zh) 用於蝕刻基板上之低k介電層的方法、半導體裝置以及用於在低k介電層中形成特徵的設備
TW434454B (en) Etching process for organic anti-reflective coating
TW460617B (en) Method for removing carbon contamination on surface of semiconductor substrate
JP3258240B2 (ja) エッチング方法
JPH03286578A (ja) ニオブ膜エッチング用アルミニウムマスクの加工方法
JP2008016839A (ja) 半導体素子の微細パターン形成方法
CN113186531A (zh) 一种无氟蚀刻剂及其蚀刻方法
KR100484896B1 (ko) 금속 식각 공정 시 금속 부식 방지 방법
US7435681B2 (en) Methods of etching stacks having metal layers and hard mask layers
TW469526B (en) Method of cleaning in dual damascene production process
JP2004178839A (ja) 補助電極の形成方法
JP4620964B2 (ja) 金属膜のパターン形成方法
KR100568098B1 (ko) 금속 패턴 형성 방법
TW307035B (en) Manufacturing method of metal line
JPS6314190A (ja) Ｉｔｏ膜上に薄膜を形成する方法
KR950014943B1 (ko) 금속층 식각시 생성된 실리콘 잔류물 제거방법
KR100248345B1 (ko) 반도체 소자의 금속 배선 형성 방법
CN115274687A (zh) 阵列基板的制备方法和阵列基板

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees