TW452835B - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device Download PDF

Info

Publication number
TW452835B
TW452835B TW089104982A TW89104982A TW452835B TW 452835 B TW452835 B TW 452835B TW 089104982 A TW089104982 A TW 089104982A TW 89104982 A TW89104982 A TW 89104982A TW 452835 B TW452835 B TW 452835B
Authority
TW
Taiwan
Prior art keywords
metal element
layer
wiring
conductive layer
forming
Prior art date
Application number
TW089104982A
Other languages
English (en)
Chinese (zh)
Inventor
Takashi Kawanoue
Tetsuro Matsuda
Tadashi Iijima
Hisafumi Kaneko
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW452835B publication Critical patent/TW452835B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/035—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/033—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics
    • H10W20/034—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers in openings in dielectrics bottomless barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/047—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by introducing additional elements therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/032—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers
    • H10W20/047—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by introducing additional elements therein
    • H10W20/048—Manufacture or treatment of conductive parts of the interconnections of conductive barrier, adhesion or liner layers by introducing additional elements therein by using plasmas or gaseous environments, e.g. by nitriding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/064—Manufacture or treatment of conductive parts of the interconnections by modifying the conductivity of conductive parts, e.g. by alloying
    • H10W20/065—Manufacture or treatment of conductive parts of the interconnections by modifying the conductivity of conductive parts, e.g. by alloying by making at least a portion of the conductive part non-conductive, e.g. by oxidation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/074—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H10W20/076—Manufacture or treatment of dielectric parts thereof of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers in via holes or trenches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/084—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts for dual-damascene structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/425—Barrier, adhesion or liner layers

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW089104982A 1999-03-18 2000-03-17 Manufacture of semiconductor device TW452835B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07348699A JP3974284B2 (ja) 1999-03-18 1999-03-18 半導体装置の製造方法

Publications (1)

Publication Number Publication Date
TW452835B true TW452835B (en) 2001-09-01

Family

ID=13519667

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089104982A TW452835B (en) 1999-03-18 2000-03-17 Manufacture of semiconductor device

Country Status (4)

Country Link
US (1) US6348402B1 (enExample)
JP (1) JP3974284B2 (enExample)
KR (1) KR100359968B1 (enExample)
TW (1) TW452835B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9129970B2 (en) 2006-07-21 2015-09-08 Kabushiki Kaisha Toshiba Semiconductor device having oxidized Ti- and N-containing layer, and manufacturing of the same

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100768363B1 (ko) * 1999-06-24 2007-10-17 가부시키가이샤 히타치세이사쿠쇼 반도체 집적회로장치의 제조방법 및 반도체 집적회로장치
JP4554011B2 (ja) * 1999-08-10 2010-09-29 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
US6433429B1 (en) * 1999-09-01 2002-08-13 International Business Machines Corporation Copper conductive line with redundant liner and method of making
JP3439402B2 (ja) * 1999-11-05 2003-08-25 Ｎｅｃエレクトロニクス株式会社 半導体装置の製造方法
US6846711B2 (en) * 2000-03-02 2005-01-25 Tokyo Electron Limited Method of making a metal oxide capacitor, including a barrier film
JP2001291720A (ja) * 2000-04-05 2001-10-19 Hitachi Ltd 半導体集積回路装置および半導体集積回路装置の製造方法
JP2002110679A (ja) * 2000-09-29 2002-04-12 Hitachi Ltd 半導体集積回路装置の製造方法
KR100365643B1 (ko) * 2000-10-09 2002-12-26 삼성전자 주식회사 반도체 장치의 다마신 배선 형성 방법 및 그에 의해형성된 다마신 배선 구조체
US6508919B1 (en) * 2000-11-28 2003-01-21 Tokyo Electron Limited Optimized liners for dual damascene metal wiring
JP2002164428A (ja) 2000-11-29 2002-06-07 Hitachi Ltd 半導体装置およびその製造方法
KR100386034B1 (ko) 2000-12-06 2003-06-02 에이에스엠 마이크로케미스트리 리미티드 확산 방지막의 결정립계를 금속산화물로 충진한 구리 배선구조의 반도체 소자 제조 방법
JP2002217292A (ja) 2001-01-23 2002-08-02 Hitachi Ltd 半導体集積回路装置および半導体集積回路装置の製造方法
JP2003051481A (ja) * 2001-08-07 2003-02-21 Hitachi Ltd 半導体集積回路装置の製造方法
US6815818B2 (en) * 2001-11-19 2004-11-09 Micron Technology, Inc. Electrode structure for use in an integrated circuit
JP3648480B2 (ja) * 2001-12-26 2005-05-18 株式会社東芝 半導体装置およびその製造方法
KR100564605B1 (ko) * 2004-01-14 2006-03-28 삼성전자주식회사 반도체 소자의 금속 배선 형성 방법
US20080070405A1 (en) * 2002-05-30 2008-03-20 Park Jae-Hwa Methods of forming metal wiring layers for semiconductor devices
KR100446300B1 (ko) * 2002-05-30 2004-08-30 삼성전자주식회사 반도체 소자의 금속 배선 형성 방법
KR100475931B1 (ko) * 2002-07-02 2005-03-10 매그나칩 반도체 유한회사 반도체 소자의 다층 배선 형성방법
JP2004140198A (ja) * 2002-10-18 2004-05-13 Oki Electric Ind Co Ltd 半導体装置およびその製造方法
WO2004040642A1 (en) * 2002-10-29 2004-05-13 Asm America, Inc. Oxygen bridge structures and methods
JP2005244178A (ja) * 2004-01-26 2005-09-08 Toshiba Corp 半導体装置の製造方法
US20090304914A1 (en) * 2006-08-30 2009-12-10 Lam Research Corporation Self assembled monolayer for improving adhesion between copper and barrier layer
US7351656B2 (en) * 2005-01-21 2008-04-01 Kabushiki Kaihsa Toshiba Semiconductor device having oxidized metal film and manufacture method of the same
JP4199206B2 (ja) * 2005-03-18 2008-12-17 シャープ株式会社 半導体装置の製造方法
JP2007012996A (ja) * 2005-07-01 2007-01-18 Toshiba Corp 半導体装置
JP4282646B2 (ja) * 2005-09-09 2009-06-24 株式会社東芝 半導体装置の製造方法
JP2007173511A (ja) * 2005-12-22 2007-07-05 Sony Corp 半導体装置の製造方法
JP2007266073A (ja) * 2006-03-27 2007-10-11 Toshiba Corp 半導体装置及びその製造方法
JP2008258311A (ja) * 2007-04-03 2008-10-23 Denso Corp 半導体装置及び半導体装置の配線または電極形成方法
JP2010171398A (ja) * 2008-12-26 2010-08-05 Toshiba Corp 半導体装置の製造方法
US20110291147A1 (en) 2010-05-25 2011-12-01 Yongjun Jeff Hu Ohmic contacts for semiconductor structures
US9343357B2 (en) 2014-02-28 2016-05-17 Qualcomm Incorporated Selective conductive barrier layer formation
JP6259023B2 (ja) * 2015-07-20 2018-01-10 ウルトラテック インク 電極系デバイス用のａｌｄ処理のためのマスキング方法
JP6595432B2 (ja) * 2016-09-23 2019-10-23 東芝メモリ株式会社 半導体装置およびその製造方法
US9953927B1 (en) * 2017-04-26 2018-04-24 Globalfoundries Inc. Liner replacements for interconnect openings
KR102370620B1 (ko) 2017-07-10 2022-03-04 삼성전자주식회사 반도체 메모리 장치 및 도전체 구조물

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04259242A (ja) * 1991-02-14 1992-09-14 Fujitsu Ltd 半導体装置の製造方法
US5130274A (en) 1991-04-05 1992-07-14 International Business Machines Corporation Copper alloy metallurgies for VLSI interconnection structures
US5783483A (en) * 1993-02-24 1998-07-21 Intel Corporation Method of fabricating a barrier against metal diffusion
US5989999A (en) * 1994-11-14 1999-11-23 Applied Materials, Inc. Construction of a tantalum nitride film on a semiconductor wafer
US5918150A (en) 1996-10-11 1999-06-29 Sharp Microelectronics Technology, Inc. Method for a chemical vapor deposition of copper on an ion prepared conductive surface
JPH10189730A (ja) * 1996-11-11 1998-07-21 Toshiba Corp 半導体装置及びその製造方法
US6139697A (en) * 1997-01-31 2000-10-31 Applied Materials, Inc. Low temperature integrated via and trench fill process and apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9129970B2 (en) 2006-07-21 2015-09-08 Kabushiki Kaisha Toshiba Semiconductor device having oxidized Ti- and N-containing layer, and manufacturing of the same
US9343402B2 (en) 2006-07-21 2016-05-17 Kabushiki Kaisha Toshiba Semiconductor device having Ti- and N-containing layer, and manufacturing method of same

Also Published As

Publication number Publication date
JP3974284B2 (ja) 2007-09-12
KR100359968B1 (ko) 2002-11-07
KR20000076888A (ko) 2000-12-26
JP2000269213A (ja) 2000-09-29
US6348402B1 (en) 2002-02-19

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