TW431948B - Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing - Google Patents

Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing Download PDF

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Publication number
TW431948B
TW431948B TW088116245A TW88116245A TW431948B TW 431948 B TW431948 B TW 431948B TW 088116245 A TW088116245 A TW 088116245A TW 88116245 A TW88116245 A TW 88116245A TW 431948 B TW431948 B TW 431948B
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TW
Taiwan
Prior art keywords
pedal
button
chair
buckle
unit
Prior art date
Application number
TW088116245A
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English (en)
Chinese (zh)
Inventor
Andreas Norbert Wiswesser
Walter Schoenleber
Boguslaw Swedek
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Applied Materials Inc
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Publication date
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Publication of TW431948B publication Critical patent/TW431948B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/12—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with apertures for inspecting the surface to be abraded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02017—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations
    • G01B9/02021—Interferometers characterised by the beam path configuration with multiple interactions between the target object and light beams, e.g. beam reflections occurring from different locations contacting different faces of object, e.g. opposite faces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G01B9/02027—Two or more interferometric channels or interferometers
TW088116245A 1998-11-02 1999-09-22 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing TW431948B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/184,775 US6159073A (en) 1998-11-02 1998-11-02 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing

Publications (1)

Publication Number Publication Date
TW431948B true TW431948B (en) 2001-05-01

Family

ID=22678288

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088116245A TW431948B (en) 1998-11-02 1999-09-22 Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing

Country Status (4)

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US (5) US6159073A (US20030104761A1-20030605-M00002.png)
JP (2) JP4335459B2 (US20030104761A1-20030605-M00002.png)
TW (1) TW431948B (US20030104761A1-20030605-M00002.png)
WO (1) WO2000026609A2 (US20030104761A1-20030605-M00002.png)

Cited By (3)

* Cited by examiner, † Cited by third party
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CN109702560A (zh) * 2017-10-24 2019-05-03 株式会社荏原制作所 研磨方法及研磨装置
CN110732965A (zh) * 2018-07-19 2020-01-31 凯斯科技股份有限公司 具有光透过性研磨层的基板的研磨系统
TWI743447B (zh) * 2012-11-16 2021-10-21 美商應用材料股份有限公司 用於研磨設備的承載頭的壓力控制組件及方法

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US6764380B2 (en) 2004-07-20
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