TW431938B - A carrier head with a substrate detection mechanism for a chemical mechanical polishing system - Google Patents

A carrier head with a substrate detection mechanism for a chemical mechanical polishing system Download PDF

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Publication number
TW431938B
TW431938B TW087103969A TW87103969A TW431938B TW 431938 B TW431938 B TW 431938B TW 087103969 A TW087103969 A TW 087103969A TW 87103969 A TW87103969 A TW 87103969A TW 431938 B TW431938 B TW 431938B
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Taiwan
Prior art keywords
positioning member
shower room
shower
positioning
adjustment structure
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TW087103969A
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English (en)
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Boris Gouzman
Steven M Zuniga
Hung Chen
Sasson Somekh
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Applied Materials Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Bathtubs, Showers, And Their Attachments (AREA)

Description

M431938 五、新型說明： 【新型所屬之技術領域】 一種淋浴間之調整結構’尤指一種於組裝時，可供調整淋 浴間垂直線上、下之偏移度，使淋浴間之組裝更為方便，以利 於供使用者自行施工之淋浴間之調整結構。 【先前技術】 按；一般之淋浴間於施工時，由於牆面的垂直線上、下方 可能不在同一直線上，因此，傳統之施工方式，係先以工具測 出垂直偏移度後，將淋浴間之架體保持垂直並予以固定後，再 於架體與牆面之間的縫隙灌注矽利康填補。此種施工方式由於 需一定之專業技術方可達成，故而一般之使用者無法自行組裝 (DIY)，對於日漸高漲的人力成本，實也為使用者的經濟負 擔，相對的造成業者銷售產品的障礙。申請人有鑑於此，乃秉 持從事該項業務多年之經驗，經不斷研究、實驗，遂萌生改良 一種淋浴間之調整結構，祈使淋浴間之組裝更為方便，以利於 供使用者自行施工。 【新型内容】 本創作之主要目的，即在提供一種淋浴間之調整結構，使 淋浴間於組裝時’可供調整淋浴間垂直線上、下之偏移度，從 而使淋浴間之組裝更為方便，以利於供使用者自行施工 人工成本。 前述之淋浴間之調整結構，係包含供^於牆面之定位 件以及嵌置於該定位件，且可沿該定位件移動之調整件。其 中，該定位件係設有片狀之固定部，由固定部延伸概呈 合置部。亥調整件係設有滑動部，於滑動部一端設有夹持段， 乂供央置玻璃Η，俾於组裝時將定位件藉由固定部固定於牆 M431938 面，使調整件之滑動料置於定位狀容置部沿定位件 動，以個整淋浴間垂直線上、下之偏移度，從 = 組裝更為方便。 1之 前述之淋浴間之調整結構，其中該調整件之滑動部 可設有-轉軸，由轉軸連接單片玻璃門，使該單片玻璃門呈可 轉動狀，從而構成另一型態之淋浴間。 【實施方式】 請同時參閱第-圖及第二圖’並配合第三圖’係為 • 卩之調整結構立體圖、淋浴間組裝完成立體圖及調整結構俯視 圖。如圖所示，本創作係包含供固定於牆面之定位件丄，以及 嵌置於該定位件1，且可沿該定位件1移動之調整件2。其中， 該定位件1係設有片狀之固定部i丄，由固定部χ丄水平延 概呈u狀之容置部1 2 ; 該調整件2係設有略小於定位件i容置部工2之滑動部2 1，於滑動部2 1—端設有夾持段2 2，以供夾置玻璃門2 3 ; 藉由前述構件的組合，於組裝時係將定位件丄藉由固定部 i1固定於牆面，使調整件2之滑動部2丄嵌置於定位件 φ 容置部1 2，沿定位件1水平移動，以供調整淋浴間垂直線上、 下之偏移度。如本實施例，係於兩牆面分別設有調整結構，並 於兩玻璃門2 3之連接處設有轉接件3，並於調整及組裝完成 後，於調整結構及轉接件3的上緣，分別蓋合遮蓋4、5，以 構成完整之淋浴間，從而使淋浴間之組裝更為方便，且使淋浴 間得以於不需專業技術人員之情況下，由使用者自行施工，以 郎省人工成本。 請參閱第四圖及第五圖，係為本創作之調整實施例圖。如 圖所示本創作於組裝時，係將定位件1藉由固定部1 1固定 於牆面，使調整件2之滑動部2 1嵌置於定位件i之容置部工 4 M431938 2 ’如本實施例，當定位件1固定後，由於牆面可能上、下不 在同一垂直線’若將玻璃門2 3裝上，會造成整個淋浴間的偏 斜而無法使用，因此，於施工時即可將置於定位件1内之調整 件2沿定位件1水平移動，以供調整淋浴間垂直線上、下之偏 移度。如：整個調整件2的上緣可能稍為偏右而下緣可能偏左， 藉由調整件2的移動調整，可準確的校正垂直線上、下之偏移 度，俾於調整後再以矽利康等材料固定，使淋浴間的施工更為 方便，且可由使用者自行組裝施工。
請同時參閱第六圖及第七圖，係為本創作之另一實施例結 構立體圖及淋浴間組裝完成立體圖。如圖所示，本創作之另一 實施例’係包含供固定於牆面之定位件i，以及嵌置於該定位 件1，且可沿該定位件丨移動之調整件2。其中，該定位件1 係设有水平延伸概呈U狀之容置部1 2 ; 該調整件2係設有略小於定位件工容置部工2之滑動部2 1，於滑動部2 1-端設有-轉軸2 4，由轉轴2 4連接單 玻璃門25，並以一蓋體26蓋合；
藉由前述構件的組合，於組裝時係將定位件丄固定於另 面使調整件2之滑動部21嵌置於定位件1之容置部12 沿定位件1水平移動，以供調整單片玻制2 5垂直線上、_ 之偏移度。如本實施例’於調整及組裝完錢，該單片玻璃尸 2 5可呈轉動狀，使其遮蔽於浴缸6或轉向牆面以供入洛， 而構成另-Μ之淋關，且使淋浴間之組裝更為方便。 前述實施例’僅為說明本創作之㈣實施方式，而非限 本創作之範園，凡經由些微修飾、變更，仍不失本創作之要 所在，亦不脫本創作之精神範疇。 文奉 综上所述’本創作以供固定於牆面之固料，配合 ’且可沿固定件移動之調整件，構成淋浴間之調= 構尤才曰#於組裝時，可供調整淋浴間垂直線上、下之 度’使淋浴狀組裝更為方便，以利於供❹者自行施工之淋 5 M431938 浴間之調整結構。 【圖式簡單說明】 第一圖係本創作之調整結構立體圖。 第二圖係本創作之淋浴間組裝完成立體圖。 第三圖係本創作之調整結構俯視圖。。 第四圖及第五圖係本創作之調整實施例圖。 第六圖係本創作另一實施例結構立體圖。 第七圖係本創作另一實施例淋浴間組裝完成立體圖。 【主要元件符號說明】 11·固定部 2 ·調整件 2 2 ·夾持段 2 4 ·轉軸 2 6 ·蓋體 4 ·遮蓋 6 ·浴缸 1 ·定位件 12·容置部 21·滑動部 2 3 ·玻璃門 2 5 ·單片玻璃門 3 ·轉接件 5 ·遮蓋

Claims (1)

  1. M431938 、申請專利範圍： 1 ·一種淋浴間之調整結構，包含： 定位件，係供固定於牆面，其係水平延伸概呈u狀之容置 部； 調整件，係設有略小於定位件容置部之滑動部，以供嵌置 於定位件之容置部，沿定位件水平移動，藉以調整垂直線上、 下之偏移度，滑動部的一端係設有夾持段，以供夾置玻璃門， 從而使淋浴間之組裝更為方便。 2 ·如申請專利範圍第1項所述之淋浴間之調整結構，其 中，該定位件係設有片狀之固定部，以供固定於牆面。 3 ·如申請專利範圍第1項所述之淋浴間之調整結構，其 中，該調整件之滑動部一端係可設有一轉軸，由轉軸連接單片 玻璃門，使該單片玻璃門呈可轉動狀，從而構成另一型態之淋 浴間。
TW087103969A 1997-05-23 1998-03-17 A carrier head with a substrate detection mechanism for a chemical mechanical polishing system TW431938B (en)

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US08/862,350 US5957751A (en) 1997-05-23 1997-05-23 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system

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US (6) US5957751A (zh)
EP (1) EP0879678B1 (zh)
JP (1) JP3326109B2 (zh)
KR (1) KR100366919B1 (zh)
DE (1) DE69807780T2 (zh)
SG (1) SG71109A1 (zh)
TW (1) TW431938B (zh)

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WO2012000426A1 (zh) * 2010-06-28 2012-01-05 清华大学 抛光垫修整头
TWI724010B (zh) * 2015-08-18 2021-04-11 日商荏原製作所股份有限公司 基板吸著方法、基板保持裝置、基板研磨裝置、彈性膜、基板保持裝置之基板吸著判定方法及壓力控制方法
TWI754732B (zh) * 2017-04-21 2022-02-11 日商荏原製作所股份有限公司 滲漏檢查方法、以及記錄有用以實施該滲漏檢查方法之程式的電腦可讀取記錄媒介

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US20030139123A1 (en) 2003-07-24
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US6517415B2 (en) 2003-02-11
US6343973B1 (en) 2002-02-05
US20020031981A1 (en) 2002-03-14
EP0879678B1 (en) 2002-09-11
US6705924B2 (en) 2004-03-16
DE69807780D1 (de) 2002-10-17
SG71109A1 (en) 2000-03-21
KR100366919B1 (ko) 2003-03-17
US6093082A (en) 2000-07-25
EP0879678A1 (en) 1998-11-25
US6244932B1 (en) 2001-06-12

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