DE69807780D1 - Trägerplatte mit einer Substrateserkennungseinrichtung für eine chemisch-mechanische Poliervorrichtung - Google Patents

Trägerplatte mit einer Substrateserkennungseinrichtung für eine chemisch-mechanische Poliervorrichtung

Info

Publication number
DE69807780D1
DE69807780D1 DE69807780T DE69807780T DE69807780D1 DE 69807780 D1 DE69807780 D1 DE 69807780D1 DE 69807780 T DE69807780 T DE 69807780T DE 69807780 T DE69807780 T DE 69807780T DE 69807780 D1 DE69807780 D1 DE 69807780D1
Authority
DE
Germany
Prior art keywords
mechanical polishing
carrier plate
chemical mechanical
substrate detection
detection device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69807780T
Other languages
English (en)
Other versions
DE69807780T2 (de
Inventor
Gouzman Boris
Sasson Somekh
Steven Zuniga
Hung Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69807780D1 publication Critical patent/DE69807780D1/de
Publication of DE69807780T2 publication Critical patent/DE69807780T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Bathtubs, Showers, And Their Attachments (AREA)
DE69807780T 1997-05-23 1998-05-22 Trägerplatte mit einer Substrateserkennungseinrichtung für eine chemisch-mechanische Poliervorrichtung Expired - Lifetime DE69807780T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/862,350 US5957751A (en) 1997-05-23 1997-05-23 Carrier head with a substrate detection mechanism for a chemical mechanical polishing system

Publications (2)

Publication Number Publication Date
DE69807780D1 true DE69807780D1 (de) 2002-10-17
DE69807780T2 DE69807780T2 (de) 2003-05-08

Family

ID=25338293

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69807780T Expired - Lifetime DE69807780T2 (de) 1997-05-23 1998-05-22 Trägerplatte mit einer Substrateserkennungseinrichtung für eine chemisch-mechanische Poliervorrichtung

Country Status (7)

Country Link
US (6) US5957751A (de)
EP (1) EP0879678B1 (de)
JP (1) JP3326109B2 (de)
KR (1) KR100366919B1 (de)
DE (1) DE69807780T2 (de)
SG (1) SG71109A1 (de)
TW (1) TW431938B (de)

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EP0879678B1 (de) 2002-09-11
SG71109A1 (en) 2000-03-21
US6517415B2 (en) 2003-02-11
US6244932B1 (en) 2001-06-12
US6705924B2 (en) 2004-03-16
EP0879678A1 (de) 1998-11-25
US20030139123A1 (en) 2003-07-24
DE69807780T2 (de) 2003-05-08
KR100366919B1 (ko) 2003-03-17
US6093082A (en) 2000-07-25
US6343973B1 (en) 2002-02-05
JP3326109B2 (ja) 2002-09-17
KR19980087271A (ko) 1998-12-05
US20020031981A1 (en) 2002-03-14
TW431938B (en) 2001-05-01
JPH10337658A (ja) 1998-12-22
US5957751A (en) 1999-09-28

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