DE69418395D1 - Chipträger mit einer Schutzschicht für die Schaltungsoberfläche - Google Patents
Chipträger mit einer Schutzschicht für die SchaltungsoberflächeInfo
- Publication number
- DE69418395D1 DE69418395D1 DE69418395T DE69418395T DE69418395D1 DE 69418395 D1 DE69418395 D1 DE 69418395D1 DE 69418395 T DE69418395 T DE 69418395T DE 69418395 T DE69418395 T DE 69418395T DE 69418395 D1 DE69418395 D1 DE 69418395D1
- Authority
- DE
- Germany
- Prior art keywords
- protective layer
- chip carrier
- circuit surface
- circuit
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011241 protective layer Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3135—Double encapsulation or coating and encapsulation
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
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- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/101,168 US5390082A (en) | 1992-07-06 | 1993-08-03 | Chip carrier with protective coating for circuitized surface |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69418395D1 true DE69418395D1 (de) | 1999-06-17 |
DE69418395T2 DE69418395T2 (de) | 1999-12-16 |
Family
ID=22283349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69418395T Expired - Fee Related DE69418395T2 (de) | 1993-08-03 | 1994-07-07 | Chipträger mit einer Schutzschicht für die Schaltungsoberfläche |
Country Status (10)
Country | Link |
---|---|
US (1) | US5390082A (de) |
EP (1) | EP0637839B1 (de) |
JP (1) | JP2723123B2 (de) |
KR (1) | KR0177138B1 (de) |
CN (2) | CN1051402C (de) |
BR (1) | BR9402986A (de) |
CA (1) | CA2126121C (de) |
DE (1) | DE69418395T2 (de) |
MY (1) | MY112247A (de) |
TW (1) | TW265464B (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2643074B2 (ja) * | 1993-03-17 | 1997-08-20 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 電気的接続構造 |
US5554821A (en) * | 1994-07-15 | 1996-09-10 | National Semiconductor Corporation | Removable computer peripheral cards having a solid one-piece housing |
US6150716A (en) * | 1995-01-25 | 2000-11-21 | International Business Machines Corporation | Metal substrate having an IC chip and carrier mounting |
US5677511A (en) * | 1995-03-20 | 1997-10-14 | National Semiconductor Corporation | Overmolded PC board with ESD protection and EMI suppression |
KR19990067623A (ko) * | 1995-11-28 | 1999-08-25 | 가나이 쓰도무 | 반도체장치와 그 제조방법 및 실장기판 |
US5851311A (en) * | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
AU6541996A (en) * | 1996-06-24 | 1998-01-14 | International Business Machines Corporation | Stacked semiconductor device package |
US5811883A (en) * | 1996-09-30 | 1998-09-22 | Intel Corporation | Design for flip chip joint pad/LGA pad |
US5912282A (en) * | 1996-12-16 | 1999-06-15 | Shell Oil Company | Die attach adhesive compositions |
US5840215A (en) * | 1996-12-16 | 1998-11-24 | Shell Oil Company | Anisotropic conductive adhesive compositions |
US5760337A (en) * | 1996-12-16 | 1998-06-02 | Shell Oil Company | Thermally reworkable binders for flip-chip devices |
HUP9701377A3 (en) * | 1997-01-15 | 2000-01-28 | Ibm | Case and method for mouting an ic chip onto a carrier board or similar |
US6403882B1 (en) * | 1997-06-30 | 2002-06-11 | International Business Machines Corporation | Protective cover plate for flip chip assembly backside |
GB9814317D0 (en) * | 1997-07-23 | 1998-09-02 | Murata Manufacturing Co | Ceramic electronic part and method for producing the same |
US6326696B1 (en) | 1998-02-04 | 2001-12-04 | International Business Machines Corporation | Electronic package with interconnected chips |
US6177726B1 (en) * | 1999-02-11 | 2001-01-23 | Philips Electronics North America Corporation | SiO2 wire bond insulation in semiconductor assemblies |
US20020014688A1 (en) * | 1999-03-03 | 2002-02-07 | Suresh Ramalingam | Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials |
US6506448B1 (en) | 1999-06-01 | 2003-01-14 | Fry's Metals, Inc. | Method of protective coating BGA solder alloy spheres |
US6660943B1 (en) * | 1999-07-08 | 2003-12-09 | Sunstar Giken Kabushiki Kaisha | Underfilling material for semiconductor package |
US6439698B1 (en) | 2000-01-14 | 2002-08-27 | Lexmark International, Inc | Dual curable encapsulating material |
JP2001222751A (ja) * | 2000-02-14 | 2001-08-17 | Toshiba Electric Appliance Co Ltd | 自動販売機温度制御装置 |
JP3604988B2 (ja) | 2000-02-14 | 2004-12-22 | シャープ株式会社 | 半導体装置およびその製造方法 |
WO2002047114A2 (en) * | 2000-10-11 | 2002-06-13 | E.L. Specialists, Inc. | Membranous el system in uv-cured urethane envelope |
US6425655B1 (en) | 2001-06-05 | 2002-07-30 | Lexmark International, Inc. | Dual curable encapsulating material |
EP1424728A1 (de) * | 2002-11-27 | 2004-06-02 | Abb Research Ltd. | Leistungshalbleitermodul |
JP2005002335A (ja) * | 2003-05-21 | 2005-01-06 | Japan Gore Tex Inc | 接着フィルムおよびこれを使った半導体装置 |
JP4378239B2 (ja) * | 2004-07-29 | 2009-12-02 | 株式会社日立製作所 | 半導体装置及びそれを使用した電力変換装置並びにこの電力変換装置を用いたハイブリッド自動車。 |
US8710618B2 (en) | 2007-03-12 | 2014-04-29 | Honeywell International Inc. | Fibrous laminate interface for security coatings |
US8957509B2 (en) * | 2011-06-23 | 2015-02-17 | Stats Chippac Ltd. | Integrated circuit packaging system with thermal emission and method of manufacture thereof |
WO2013165323A2 (en) * | 2012-04-05 | 2013-11-07 | Mektec Manufacturing Corporation (Thailand) Ltd | Method and encapsulant for flip-chip assembly |
JP6386746B2 (ja) * | 2014-02-26 | 2018-09-05 | 株式会社ジェイデバイス | 半導体装置 |
CN116536155B (zh) * | 2023-05-17 | 2024-04-09 | 扬州大学 | 一种芯片培养装置及其使用方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4300184A (en) * | 1979-07-11 | 1981-11-10 | Johnson Controls, Inc. | Conformal coating for electrical circuit assemblies |
JPS6018145B2 (ja) * | 1980-09-22 | 1985-05-09 | 株式会社日立製作所 | 樹脂封止型半導体装置 |
US4546283A (en) * | 1984-05-04 | 1985-10-08 | The United States Of America As Represented By The Secretary Of The Air Force | Conductor structure for thick film electrical device |
JPS6167246A (ja) * | 1984-09-10 | 1986-04-07 | Nec Corp | 混成集積回路装置 |
DE3442131A1 (de) * | 1984-11-17 | 1986-05-22 | Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn | Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen |
US4623559A (en) * | 1985-07-12 | 1986-11-18 | Westinghouse Electric Corp. | U.V. cured flexible polyester-monoacrylate protective thermistor coatings having good edge coverage and method of coating |
EP0340492A3 (de) * | 1988-05-02 | 1990-07-04 | International Business Machines Corporation | Konforme Versieglung und interplanare Verkapselung elektronischer Anordnungsstrukturen |
US5121190A (en) * | 1990-03-14 | 1992-06-09 | International Business Machines Corp. | Solder interconnection structure on organic substrates |
US4999699A (en) * | 1990-03-14 | 1991-03-12 | International Business Machines Corporation | Solder interconnection structure and process for making |
US5117279A (en) * | 1990-03-23 | 1992-05-26 | Motorola, Inc. | Semiconductor device having a low temperature uv-cured epoxy seal |
US5173766A (en) * | 1990-06-25 | 1992-12-22 | Lsi Logic Corporation | Semiconductor device package and method of making such a package |
US5185498A (en) * | 1991-06-11 | 1993-02-09 | Delco Electronics Corporation | Circuit assembly encapsulated with polybutadiene urethane |
US5194027A (en) * | 1991-09-09 | 1993-03-16 | Planar Systems, Inc. | Solid seal for thin film electroluminescent display panels |
US5243133A (en) * | 1992-02-18 | 1993-09-07 | International Business Machines, Inc. | Ceramic chip carrier with lead frame or edge clip |
US5249101A (en) * | 1992-07-06 | 1993-09-28 | International Business Machines Corporation | Chip carrier with protective coating for circuitized surface |
-
1993
- 1993-08-03 US US08/101,168 patent/US5390082A/en not_active Expired - Fee Related
-
1994
- 1994-06-17 CA CA002126121A patent/CA2126121C/en not_active Expired - Fee Related
- 1994-07-07 DE DE69418395T patent/DE69418395T2/de not_active Expired - Fee Related
- 1994-07-07 EP EP94480061A patent/EP0637839B1/de not_active Expired - Lifetime
- 1994-07-20 JP JP6168058A patent/JP2723123B2/ja not_active Expired - Lifetime
- 1994-07-27 MY MYPI94001948A patent/MY112247A/en unknown
- 1994-07-28 CN CN94114984A patent/CN1051402C/zh not_active Expired - Fee Related
- 1994-07-28 CN CNB991018915A patent/CN1142589C/zh not_active Expired - Fee Related
- 1994-07-28 BR BR9402986A patent/BR9402986A/pt not_active Application Discontinuation
- 1994-07-28 KR KR1019940018371A patent/KR0177138B1/ko not_active IP Right Cessation
- 1994-07-30 TW TW083106990A patent/TW265464B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP0637839B1 (de) | 1999-05-12 |
MY112247A (en) | 2001-05-31 |
KR0177138B1 (ko) | 1999-03-20 |
US5390082A (en) | 1995-02-14 |
JPH0778914A (ja) | 1995-03-20 |
JP2723123B2 (ja) | 1998-03-09 |
BR9402986A (pt) | 1995-07-18 |
TW265464B (de) | 1995-12-11 |
CN1228613A (zh) | 1999-09-15 |
CA2126121C (en) | 1997-09-16 |
CA2126121A1 (en) | 1995-02-04 |
CN1103734A (zh) | 1995-06-14 |
EP0637839A3 (de) | 1995-06-28 |
CN1142589C (zh) | 2004-03-17 |
EP0637839A2 (de) | 1995-02-08 |
CN1051402C (zh) | 2000-04-12 |
DE69418395T2 (de) | 1999-12-16 |
KR950007621A (ko) | 1995-03-21 |
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