DE69406049D1 - Lichtmittierende Halbleitervorrichtung mit einer dritten Begrenzungsschicht - Google Patents

Lichtmittierende Halbleitervorrichtung mit einer dritten Begrenzungsschicht

Info

Publication number
DE69406049D1
DE69406049D1 DE69406049T DE69406049T DE69406049D1 DE 69406049 D1 DE69406049 D1 DE 69406049D1 DE 69406049 T DE69406049 T DE 69406049T DE 69406049 T DE69406049 T DE 69406049T DE 69406049 D1 DE69406049 D1 DE 69406049D1
Authority
DE
Germany
Prior art keywords
light
semiconductor device
emitting semiconductor
confinement layer
confinement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69406049T
Other languages
English (en)
Other versions
DE69406049T2 (de
Inventor
Kazuaki Sasaki
Osamu Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13444993A external-priority patent/JP2911087B2/ja
Priority claimed from JP1850094A external-priority patent/JP3067937B2/ja
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of DE69406049D1 publication Critical patent/DE69406049D1/de
Application granted granted Critical
Publication of DE69406049T2 publication Critical patent/DE69406049T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/223Buried stripe structure
    • H01S5/2232Buried stripe structure with inner confining structure between the active layer and the lower electrode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/14Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
    • H01L33/145Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure with a current-blocking structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S2304/00Special growth methods for semiconductor lasers
    • H01S2304/12Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/18Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
    • H01S5/183Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
    • H01S5/18344Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] characterized by the mesa, e.g. dimensions or shape of the mesa
    • H01S5/18352Mesa with inclined sidewall
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H01S5/2206Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/3202Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/30Structure or shape of the active region; Materials used for the active region
    • H01S5/32Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
    • H01S5/323Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
    • H01S5/32308Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031Edge-emitting structures
DE69406049T 1993-06-04 1994-06-03 Lichtmittierende Halbleitervorrichtung mit einer dritten Begrenzungsschicht Expired - Fee Related DE69406049T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13444993A JP2911087B2 (ja) 1993-06-04 1993-06-04 半導体発光素子およびその製造方法
JP1850094A JP3067937B2 (ja) 1994-02-15 1994-02-15 半導体発光素子の製造方法

Publications (2)

Publication Number Publication Date
DE69406049D1 true DE69406049D1 (de) 1997-11-13
DE69406049T2 DE69406049T2 (de) 1998-04-16

Family

ID=26355179

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69406049T Expired - Fee Related DE69406049T2 (de) 1993-06-04 1994-06-03 Lichtmittierende Halbleitervorrichtung mit einer dritten Begrenzungsschicht

Country Status (3)

Country Link
US (2) US5516723A (de)
EP (1) EP0627799B1 (de)
DE (1) DE69406049T2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3472714B2 (ja) * 1999-01-25 2003-12-02 シャープ株式会社 半導体発光素子の製造方法
US6327288B1 (en) 1999-03-05 2001-12-04 Lumileds Lighting, U.S., Llc Buried heterostructure for lasers and light emitting diodes
JP4306014B2 (ja) * 1999-05-17 2009-07-29 三菱電機株式会社 調速装置
JP2005236024A (ja) * 2004-02-19 2005-09-02 Fuji Photo Film Co Ltd 半導体レーザ素子
US9153645B2 (en) 2005-05-17 2015-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US8324660B2 (en) 2005-05-17 2012-12-04 Taiwan Semiconductor Manufacturing Company, Ltd. Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
US20070267722A1 (en) * 2006-05-17 2007-11-22 Amberwave Systems Corporation Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication
WO2007014294A2 (en) * 2005-07-26 2007-02-01 Amberwave Systems Corporation Solutions integrated circuit integration of alternative active area materials
US7638842B2 (en) * 2005-09-07 2009-12-29 Amberwave Systems Corporation Lattice-mismatched semiconductor structures on insulators
US20070054467A1 (en) * 2005-09-07 2007-03-08 Amberwave Systems Corporation Methods for integrating lattice-mismatched semiconductor structure on insulators
WO2007112066A2 (en) * 2006-03-24 2007-10-04 Amberwave Systems Corporation Lattice-mismatched semiconductor structures and related methods for device fabrication
US8173551B2 (en) 2006-09-07 2012-05-08 Taiwan Semiconductor Manufacturing Co., Ltd. Defect reduction using aspect ratio trapping
US7875958B2 (en) * 2006-09-27 2011-01-25 Taiwan Semiconductor Manufacturing Company, Ltd. Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures
US7799592B2 (en) * 2006-09-27 2010-09-21 Taiwan Semiconductor Manufacturing Company, Ltd. Tri-gate field-effect transistors formed by aspect ratio trapping
WO2008051503A2 (en) 2006-10-19 2008-05-02 Amberwave Systems Corporation Light-emitter-based devices with lattice-mismatched semiconductor structures
US8304805B2 (en) * 2009-01-09 2012-11-06 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor diodes fabricated by aspect ratio trapping with coalesced films
US8237151B2 (en) * 2009-01-09 2012-08-07 Taiwan Semiconductor Manufacturing Company, Ltd. Diode-based devices and methods for making the same
US9508890B2 (en) * 2007-04-09 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Photovoltaics on silicon
US7825328B2 (en) * 2007-04-09 2010-11-02 Taiwan Semiconductor Manufacturing Company, Ltd. Nitride-based multi-junction solar cell modules and methods for making the same
US8329541B2 (en) 2007-06-15 2012-12-11 Taiwan Semiconductor Manufacturing Company, Ltd. InP-based transistor fabrication
DE112008002387B4 (de) 2007-09-07 2022-04-07 Taiwan Semiconductor Manufacturing Co., Ltd. Struktur einer Mehrfachübergangs-Solarzelle, Verfahren zur Bildung einer photonischenVorrichtung, Photovoltaische Mehrfachübergangs-Zelle und Photovoltaische Mehrfachübergangs-Zellenvorrichtung,
US8183667B2 (en) 2008-06-03 2012-05-22 Taiwan Semiconductor Manufacturing Co., Ltd. Epitaxial growth of crystalline material
US8274097B2 (en) 2008-07-01 2012-09-25 Taiwan Semiconductor Manufacturing Company, Ltd. Reduction of edge effects from aspect ratio trapping
US8981427B2 (en) 2008-07-15 2015-03-17 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing of small composite semiconductor materials
WO2010033813A2 (en) 2008-09-19 2010-03-25 Amberwave System Corporation Formation of devices by epitaxial layer overgrowth
US20100072515A1 (en) * 2008-09-19 2010-03-25 Amberwave Systems Corporation Fabrication and structures of crystalline material
US8253211B2 (en) 2008-09-24 2012-08-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor sensor structures with reduced dislocation defect densities
CN102379046B (zh) * 2009-04-02 2015-06-17 台湾积体电路制造股份有限公司 从晶体材料的非极性平面形成的器件及其制作方法
WO2017199501A1 (ja) * 2016-05-16 2017-11-23 ソニー株式会社 受光素子、光通信装置、および受光素子の製造方法
CN111229336B (zh) * 2020-01-17 2021-11-23 上海新微技术研发中心有限公司 光波导多微流道芯片的制造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3920491A (en) * 1973-11-08 1975-11-18 Nippon Electric Co Method of fabricating a double heterostructure injection laser utilizing a stripe-shaped region
US4326176A (en) * 1976-04-16 1982-04-20 Hitachi, Ltd. Semiconductor laser device
GB2046983B (en) * 1979-01-18 1983-03-16 Nippon Electric Co Semiconductor lasers
JPS5940592A (ja) * 1982-08-30 1984-03-06 Sharp Corp 半導体レ−ザ素子
US4432841A (en) * 1983-06-30 1984-02-21 Xerox Corporation Preparation of chalcogenide alloys by electrochemical coreduction of esters
JPS60130882A (ja) * 1983-12-19 1985-07-12 Mitsubishi Electric Corp 半導体レ−ザ装置
JPS61113293A (ja) * 1984-11-07 1986-05-31 Sharp Corp 半導体レ−ザアレイ装置
JPS61163689A (ja) * 1985-01-14 1986-07-24 Sharp Corp 半導体装置の製造方法
JPS61281562A (ja) * 1985-06-06 1986-12-11 Oki Electric Ind Co Ltd 半導体発光素子
JP2553580B2 (ja) * 1987-08-19 1996-11-13 三菱電機株式会社 半導体レ−ザ装置
JPH01291481A (ja) * 1988-05-18 1989-11-24 Sharp Corp 半導体レーザ装置
JPH0232582A (ja) * 1988-07-22 1990-02-02 Oki Electric Ind Co Ltd 集積型半導体レーザとその製造方法
JPH0278280A (ja) * 1988-09-14 1990-03-19 Ricoh Co Ltd 半導体発光装置
JPH0719931B2 (ja) * 1989-04-06 1995-03-06 三菱電機株式会社 半導体レーザ装置およびその製造方法
US5042044A (en) * 1989-04-28 1991-08-20 Sharp Kabushiki Kaisha Semiconductor laser device, a semiconductor wafer
JPH03131083A (ja) * 1989-10-17 1991-06-04 Mitsubishi Electric Corp 半導体レーザ装置の製造方法
US5023198A (en) * 1990-02-28 1991-06-11 At&T Bell Laboratories Method for fabricating self-stabilized semiconductor gratings
JPH0474488A (ja) * 1990-07-16 1992-03-09 Mitsubishi Electric Corp 半導体レーザ装置およびその製造方法
JPH04369882A (ja) * 1991-06-18 1992-12-22 Sanyo Electric Co Ltd 半導体レーザの製造方法

Also Published As

Publication number Publication date
US5717709A (en) 1998-02-10
EP0627799B1 (de) 1997-10-08
EP0627799A1 (de) 1994-12-07
US5516723A (en) 1996-05-14
DE69406049T2 (de) 1998-04-16

Similar Documents

Publication Publication Date Title
DE69406049D1 (de) Lichtmittierende Halbleitervorrichtung mit einer dritten Begrenzungsschicht
DE69322180T2 (de) Halbleiteranordnung mit einer Leiterschicht
DE69418028T2 (de) Laterale halbleiter-auf-isolator-halbleiteranordnung mit einer vergrabenen diode
DE69318239D1 (de) Halbleiterbauelement mit planarer Grenzfläche
DE59309755D1 (de) Lichtquelle mit einer lumineszierenden Schicht
DE69515387T2 (de) Verriegelungseinrichtung mit einer Riegelfunktion
DE19982011D2 (de) Lichelement mit einer Lichtdurchlässigen Fläche
DE29618116U1 (de) Aufblasbarer Artikel mit einer Beleuchtungsvorrichtung
DE69507050T2 (de) Retroreflektierender gegenstand mit einer polyether-polyurethan-bindeschicht
DE68916083D1 (de) Halbleiteranordnung mit einer Metallisierungsschicht.
DE69610459D1 (de) Vorrichtung mit einer Halbleiterwellenleiterstruktur
DE69227334D1 (de) Halbleiteranordnung in einer Packung mit spannungsabsorbierender Schicht
DE69232826T2 (de) Heteroübergangsbauelement mit einer mehrschichtigen Basis
DE69428378T2 (de) Halbleiteranordnung mit einer Durchgangsleitung
DE59103182D1 (de) Halbleiterelement mit einer silizium-schicht.
DE69203889T2 (de) Halbleiteranordnung mit einer Füllung.
DE69620507D1 (de) Halbleiteranordnung mit einer Schutzvorrichtung
DE69830867D1 (de) Halbleiteranordnung mit einer leitenden Schutzschicht
DE69211724T2 (de) Photovoltaische Vorrichtung mit einer Germanium enthaltenden Schichtzone
DE59104797D1 (de) Heckbagger mit einer Verriegelungsvorrichtung.
DE69522510T2 (de) Halbleiterbauelement mit einer Dreieckigen Sperrschichtdiodenstruktur
DE69203050D1 (de) Tapete mit einer Oberflächenschicht aus Polyolefin.
DE69327012D1 (de) Bauelement mit einer räumlichen Transfer verwendenden Halbleiteranordnung
DE69202259T2 (de) Gerät zur Zusammenarbeit mit einer Kassette.
DE59500773D1 (de) Drehstellbares Bauelement mit einer Rasteinrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee