DE69406049D1 - Lichtmittierende Halbleitervorrichtung mit einer dritten Begrenzungsschicht - Google Patents
Lichtmittierende Halbleitervorrichtung mit einer dritten BegrenzungsschichtInfo
- Publication number
- DE69406049D1 DE69406049D1 DE69406049T DE69406049T DE69406049D1 DE 69406049 D1 DE69406049 D1 DE 69406049D1 DE 69406049 T DE69406049 T DE 69406049T DE 69406049 T DE69406049 T DE 69406049T DE 69406049 D1 DE69406049 D1 DE 69406049D1
- Authority
- DE
- Germany
- Prior art keywords
- light
- semiconductor device
- emitting semiconductor
- confinement layer
- confinement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2232—Buried stripe structure with inner confining structure between the active layer and the lower electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
- H01L33/145—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure with a current-blocking structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/12—Pendeo epitaxial lateral overgrowth [ELOG], e.g. for growing GaN based blue laser diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18344—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] characterized by the mesa, e.g. dimensions or shape of the mesa
- H01S5/18352—Mesa with inclined sidewall
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2206—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on III-V materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3202—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures grown on specifically orientated substrates, or using orientation dependent growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
- H01S5/4031—Edge-emitting structures
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13444993A JP2911087B2 (ja) | 1993-06-04 | 1993-06-04 | 半導体発光素子およびその製造方法 |
JP1850094A JP3067937B2 (ja) | 1994-02-15 | 1994-02-15 | 半導体発光素子の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69406049D1 true DE69406049D1 (de) | 1997-11-13 |
DE69406049T2 DE69406049T2 (de) | 1998-04-16 |
Family
ID=26355179
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69406049T Expired - Fee Related DE69406049T2 (de) | 1993-06-04 | 1994-06-03 | Lichtmittierende Halbleitervorrichtung mit einer dritten Begrenzungsschicht |
Country Status (3)
Country | Link |
---|---|
US (2) | US5516723A (de) |
EP (1) | EP0627799B1 (de) |
DE (1) | DE69406049T2 (de) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3472714B2 (ja) * | 1999-01-25 | 2003-12-02 | シャープ株式会社 | 半導体発光素子の製造方法 |
US6327288B1 (en) | 1999-03-05 | 2001-12-04 | Lumileds Lighting, U.S., Llc | Buried heterostructure for lasers and light emitting diodes |
JP4306014B2 (ja) * | 1999-05-17 | 2009-07-29 | 三菱電機株式会社 | 調速装置 |
JP2005236024A (ja) * | 2004-02-19 | 2005-09-02 | Fuji Photo Film Co Ltd | 半導体レーザ素子 |
US9153645B2 (en) | 2005-05-17 | 2015-10-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication |
US8324660B2 (en) | 2005-05-17 | 2012-12-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication |
US20070267722A1 (en) * | 2006-05-17 | 2007-11-22 | Amberwave Systems Corporation | Lattice-mismatched semiconductor structures with reduced dislocation defect densities and related methods for device fabrication |
WO2007014294A2 (en) * | 2005-07-26 | 2007-02-01 | Amberwave Systems Corporation | Solutions integrated circuit integration of alternative active area materials |
US7638842B2 (en) * | 2005-09-07 | 2009-12-29 | Amberwave Systems Corporation | Lattice-mismatched semiconductor structures on insulators |
US20070054467A1 (en) * | 2005-09-07 | 2007-03-08 | Amberwave Systems Corporation | Methods for integrating lattice-mismatched semiconductor structure on insulators |
WO2007112066A2 (en) * | 2006-03-24 | 2007-10-04 | Amberwave Systems Corporation | Lattice-mismatched semiconductor structures and related methods for device fabrication |
US8173551B2 (en) | 2006-09-07 | 2012-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Defect reduction using aspect ratio trapping |
US7875958B2 (en) * | 2006-09-27 | 2011-01-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures |
US7799592B2 (en) * | 2006-09-27 | 2010-09-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Tri-gate field-effect transistors formed by aspect ratio trapping |
WO2008051503A2 (en) | 2006-10-19 | 2008-05-02 | Amberwave Systems Corporation | Light-emitter-based devices with lattice-mismatched semiconductor structures |
US8304805B2 (en) * | 2009-01-09 | 2012-11-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor diodes fabricated by aspect ratio trapping with coalesced films |
US8237151B2 (en) * | 2009-01-09 | 2012-08-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Diode-based devices and methods for making the same |
US9508890B2 (en) * | 2007-04-09 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photovoltaics on silicon |
US7825328B2 (en) * | 2007-04-09 | 2010-11-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Nitride-based multi-junction solar cell modules and methods for making the same |
US8329541B2 (en) | 2007-06-15 | 2012-12-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | InP-based transistor fabrication |
DE112008002387B4 (de) | 2007-09-07 | 2022-04-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Struktur einer Mehrfachübergangs-Solarzelle, Verfahren zur Bildung einer photonischenVorrichtung, Photovoltaische Mehrfachübergangs-Zelle und Photovoltaische Mehrfachübergangs-Zellenvorrichtung, |
US8183667B2 (en) | 2008-06-03 | 2012-05-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Epitaxial growth of crystalline material |
US8274097B2 (en) | 2008-07-01 | 2012-09-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Reduction of edge effects from aspect ratio trapping |
US8981427B2 (en) | 2008-07-15 | 2015-03-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing of small composite semiconductor materials |
WO2010033813A2 (en) | 2008-09-19 | 2010-03-25 | Amberwave System Corporation | Formation of devices by epitaxial layer overgrowth |
US20100072515A1 (en) * | 2008-09-19 | 2010-03-25 | Amberwave Systems Corporation | Fabrication and structures of crystalline material |
US8253211B2 (en) | 2008-09-24 | 2012-08-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor sensor structures with reduced dislocation defect densities |
CN102379046B (zh) * | 2009-04-02 | 2015-06-17 | 台湾积体电路制造股份有限公司 | 从晶体材料的非极性平面形成的器件及其制作方法 |
WO2017199501A1 (ja) * | 2016-05-16 | 2017-11-23 | ソニー株式会社 | 受光素子、光通信装置、および受光素子の製造方法 |
CN111229336B (zh) * | 2020-01-17 | 2021-11-23 | 上海新微技术研发中心有限公司 | 光波导多微流道芯片的制造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3920491A (en) * | 1973-11-08 | 1975-11-18 | Nippon Electric Co | Method of fabricating a double heterostructure injection laser utilizing a stripe-shaped region |
US4326176A (en) * | 1976-04-16 | 1982-04-20 | Hitachi, Ltd. | Semiconductor laser device |
GB2046983B (en) * | 1979-01-18 | 1983-03-16 | Nippon Electric Co | Semiconductor lasers |
JPS5940592A (ja) * | 1982-08-30 | 1984-03-06 | Sharp Corp | 半導体レ−ザ素子 |
US4432841A (en) * | 1983-06-30 | 1984-02-21 | Xerox Corporation | Preparation of chalcogenide alloys by electrochemical coreduction of esters |
JPS60130882A (ja) * | 1983-12-19 | 1985-07-12 | Mitsubishi Electric Corp | 半導体レ−ザ装置 |
JPS61113293A (ja) * | 1984-11-07 | 1986-05-31 | Sharp Corp | 半導体レ−ザアレイ装置 |
JPS61163689A (ja) * | 1985-01-14 | 1986-07-24 | Sharp Corp | 半導体装置の製造方法 |
JPS61281562A (ja) * | 1985-06-06 | 1986-12-11 | Oki Electric Ind Co Ltd | 半導体発光素子 |
JP2553580B2 (ja) * | 1987-08-19 | 1996-11-13 | 三菱電機株式会社 | 半導体レ−ザ装置 |
JPH01291481A (ja) * | 1988-05-18 | 1989-11-24 | Sharp Corp | 半導体レーザ装置 |
JPH0232582A (ja) * | 1988-07-22 | 1990-02-02 | Oki Electric Ind Co Ltd | 集積型半導体レーザとその製造方法 |
JPH0278280A (ja) * | 1988-09-14 | 1990-03-19 | Ricoh Co Ltd | 半導体発光装置 |
JPH0719931B2 (ja) * | 1989-04-06 | 1995-03-06 | 三菱電機株式会社 | 半導体レーザ装置およびその製造方法 |
US5042044A (en) * | 1989-04-28 | 1991-08-20 | Sharp Kabushiki Kaisha | Semiconductor laser device, a semiconductor wafer |
JPH03131083A (ja) * | 1989-10-17 | 1991-06-04 | Mitsubishi Electric Corp | 半導体レーザ装置の製造方法 |
US5023198A (en) * | 1990-02-28 | 1991-06-11 | At&T Bell Laboratories | Method for fabricating self-stabilized semiconductor gratings |
JPH0474488A (ja) * | 1990-07-16 | 1992-03-09 | Mitsubishi Electric Corp | 半導体レーザ装置およびその製造方法 |
JPH04369882A (ja) * | 1991-06-18 | 1992-12-22 | Sanyo Electric Co Ltd | 半導体レーザの製造方法 |
-
1994
- 1994-06-03 EP EP94303990A patent/EP0627799B1/de not_active Expired - Lifetime
- 1994-06-03 DE DE69406049T patent/DE69406049T2/de not_active Expired - Fee Related
-
1995
- 1995-05-05 US US08/435,391 patent/US5516723A/en not_active Expired - Lifetime
-
1996
- 1996-06-19 US US08/668,086 patent/US5717709A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5717709A (en) | 1998-02-10 |
EP0627799B1 (de) | 1997-10-08 |
EP0627799A1 (de) | 1994-12-07 |
US5516723A (en) | 1996-05-14 |
DE69406049T2 (de) | 1998-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |