DE19681656T1 - Ausrichtvorrichtung für einen Substratträger - Google Patents

Ausrichtvorrichtung für einen Substratträger

Info

Publication number
DE19681656T1
DE19681656T1 DE19681656T DE19681656T DE19681656T1 DE 19681656 T1 DE19681656 T1 DE 19681656T1 DE 19681656 T DE19681656 T DE 19681656T DE 19681656 T DE19681656 T DE 19681656T DE 19681656 T1 DE19681656 T1 DE 19681656T1
Authority
DE
Germany
Prior art keywords
alignment device
substrate carrier
carrier
substrate
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19681656T
Other languages
English (en)
Other versions
DE19681656C2 (de
Inventor
Daniel Babbs
Richard E Schultz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
PROGRESSIVE SYS TECH Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PROGRESSIVE SYS TECH Inc filed Critical PROGRESSIVE SYS TECH Inc
Publication of DE19681656T1 publication Critical patent/DE19681656T1/de
Application granted granted Critical
Publication of DE19681656C2 publication Critical patent/DE19681656C2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19681656T 1995-11-27 1996-11-26 Substratausrichtvorrichtung für einen Substratträger und Substratträger Expired - Fee Related DE19681656C2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/563,134 US5853214A (en) 1995-11-27 1995-11-27 Aligner for a substrate carrier
PCT/US1996/018879 WO1997019868A1 (en) 1995-11-27 1996-11-26 Aligner for a substrate carrier

Publications (2)

Publication Number Publication Date
DE19681656T1 true DE19681656T1 (de) 1998-10-29
DE19681656C2 DE19681656C2 (de) 2002-08-01

Family

ID=24249239

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681656T Expired - Fee Related DE19681656C2 (de) 1995-11-27 1996-11-26 Substratausrichtvorrichtung für einen Substratträger und Substratträger

Country Status (7)

Country Link
US (1) US5853214A (de)
JP (1) JP2000501243A (de)
KR (1) KR100457762B1 (de)
CN (1) CN1079775C (de)
AU (1) AU1274297A (de)
DE (1) DE19681656C2 (de)
WO (1) WO1997019868A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10045202A1 (de) * 2000-09-13 2002-04-11 Infineon Technologies Ag Kassette für flache Werkstücke
DE10046942A1 (de) * 2000-09-21 2002-04-25 Infineon Technologies Ag Verfahren zum Transport von Wafern

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3838786B2 (ja) * 1997-09-30 2006-10-25 信越ポリマー株式会社 精密基板収納容器及びその位置決め構造並びに精密基板収納容器の位置決め方法
KR100247138B1 (ko) * 1997-11-20 2000-03-15 구본준, 론 위라하디락사 유리기판 적재용 카세트
US6341703B1 (en) * 1998-04-06 2002-01-29 Taiwan Semiconductor Manufacturing Company, Ltd Wafer cassette having dividers of different length or color
US6871741B2 (en) * 1998-05-28 2005-03-29 Entegris, Inc. Composite substrate carrier
US6808668B2 (en) * 1998-05-28 2004-10-26 Entegris, Inc. Process for fabricating composite substrate carrier
KR100330480B1 (ko) * 2000-02-17 2002-04-01 황인길 웨이퍼 돌출 방지 장치
US6634882B2 (en) * 2000-12-22 2003-10-21 Asm America, Inc. Susceptor pocket profile to improve process performance
KR100683121B1 (ko) * 2001-05-07 2007-02-15 삼성전자주식회사 웨이퍼 카세트와 웨이퍼 카세트의 도어 개폐 장치
US6923325B2 (en) * 2001-07-12 2005-08-02 Entegris, Inc. Horizontal cassette
US6824343B2 (en) 2002-02-22 2004-11-30 Applied Materials, Inc. Substrate support
US20030168175A1 (en) * 2002-03-08 2003-09-11 Kim Kyung-Tae Substrate alignment apparatus
KR100480821B1 (ko) * 2002-05-17 2005-04-07 엘지.필립스 엘시디 주식회사 정전기 방지용 패널 수납장치
DE10232469B4 (de) * 2002-07-17 2004-08-05 Asys Automatic Systems Gmbh & Co. Kg Transportsystem mit einer kassettenartigen Stapelvorrichtung
US7108899B2 (en) * 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface
TW568095U (en) * 2002-10-09 2003-12-21 Foxsemicon Integrated Tech Inc Substrate cassette and it's stopper
TW542218U (en) * 2002-10-09 2003-07-11 Foxsemicon Intergated Technolo Substrate supporting rod and substrate cassette using the same
KR100675627B1 (ko) * 2002-10-10 2007-02-01 엘지.필립스 엘시디 주식회사 기판 수납용 카세트
US6916147B2 (en) * 2002-10-25 2005-07-12 Applied Materials, Inc. Substrate storage cassette with substrate alignment feature
TW549569U (en) * 2002-11-13 2003-08-21 Foxsemicon Integrated Tech Inc Substrate cassette
KR100488519B1 (ko) * 2002-11-21 2005-05-11 삼성전자주식회사 Ｌｃｄ용 글라스 적재 카세트
TWM243458U (en) * 2003-02-27 2004-09-11 Innolux Display Corp Substrate cassette
KR20050003759A (ko) * 2003-07-04 2005-01-12 비오이 하이디스 테크놀로지 주식회사 유리기판 수납용 카세트
TWI310850B (en) * 2003-08-01 2009-06-11 Foxsemicon Integrated Tech Inc Substrate supporting rod and substrate cassette using the same
US7100772B2 (en) * 2003-11-16 2006-09-05 Entegris, Inc. Wafer container with door actuated wafer restraint
KR101010481B1 (ko) * 2003-12-13 2011-01-21 엘지디스플레이 주식회사 기판 거치대
TWI268265B (en) * 2004-08-13 2006-12-11 Au Optronics Corp Glass substrate cassette
KR100573896B1 (ko) * 2004-08-16 2006-04-26 동부일렉트로닉스 주식회사 웨이퍼 이탈방지 장치 및 방법
CN2762903Y (zh) * 2004-12-30 2006-03-08 鸿富锦精密工业（深圳）有限公司 光学元件清洗机构
US8211230B2 (en) 2005-01-18 2012-07-03 Asm America, Inc. Reaction system for growing a thin film
TWI262753B (en) * 2005-03-18 2006-09-21 Allied Material Technology Cor Substrate cassette
TWI315002B (en) * 2005-04-15 2009-09-21 Innolux Display Corp Substrate cassette
US7926663B2 (en) * 2005-05-06 2011-04-19 Shin-Etsu Polymer Co., Ltd. Substrate storage container and method of producing the same
US20060283770A1 (en) * 2005-06-03 2006-12-21 Applied Materials, Inc. Transportation fixture and package for substrate rack
EP1902465A2 (de) 2005-07-08 2008-03-26 Asyst Technologies, Inc. Arbeitsstück-haltestrukturen und vorrichtungen für den zugriff darauf
TWM309202U (en) * 2006-08-15 2007-04-01 Gudeng Prec Industral Co Ltd Wafer pod and wafer holding device thereof
CN101503128B (zh) * 2008-02-04 2010-12-22 北京京东方光电科技有限公司 装载箱和装卸系统
SG157975A1 (en) * 2008-06-18 2010-01-29 Mfg Integration Technology Ltd Adaptive clamp width adjusting device
US8453841B1 (en) 2009-04-23 2013-06-04 Western Digital Technologies, Inc. Disk placement and storage assembly with disk cassette and disk slotter
JP5501688B2 (ja) * 2009-07-30 2014-05-28 東京エレクトロン株式会社 基板位置合わせ機構、それを用いた真空予備室および基板処理システム
KR20110019511A (ko) * 2009-08-20 2011-02-28 삼성전자주식회사 매거진의 로킹 장치
TWM419217U (en) * 2011-06-08 2011-12-21 Chipbond Technology Corp Electronic component carrier Cleaning rack
US9764987B2 (en) 2012-03-02 2017-09-19 Dynamic Material Systems, LLC Composite ceramics and ceramic particles and method for producing ceramic particles and bulk ceramic particles
US10399907B2 (en) 2012-03-02 2019-09-03 Dynamic Material Systems, LLC Ceramic composite structures and processing technologies
KR101898134B1 (ko) * 2012-03-30 2018-10-05 삼성전자주식회사 리드 프레임 이송용 매거진
US20140069844A1 (en) * 2012-09-07 2014-03-13 Medtronic, Inc. Circuit board magazine having retention bar with a locking mechanism
CN103448048B (zh) * 2013-09-09 2015-11-25 深圳市华星光电技术有限公司 基板存放架
CN104743341A (zh) * 2015-01-20 2015-07-01 京东方科技集团股份有限公司 挡块、基板卡匣组件
CN106829197B (zh) * 2017-02-03 2018-10-09 成都思力普科技有限责任公司 一种便携式标本运输箱
CN106586264B (zh) * 2017-02-03 2018-12-21 扬州市生态科技新城润业中小企业服务中心有限公司 一种标本运输箱
JP6378403B2 (ja) * 2017-06-21 2018-08-22 光洋サーモシステム株式会社 基板支持構造
US10872803B2 (en) 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
US10872804B2 (en) 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination
CN111029236A (zh) * 2018-10-09 2020-04-17 北京北方华创微电子装备有限公司 支撑装置及反应腔室
CN110181473B (zh) * 2019-05-11 2023-12-22 中建八局第一建设有限公司 一种钢管堆放装置
JP7344681B2 (ja) * 2019-06-18 2023-09-14 株式会社ディスコ ウエーハユニットの飛び出し防止治具
CN213503368U (zh) * 2020-06-01 2021-06-22 三赢科技（深圳）有限公司 物料架
US11594438B2 (en) * 2021-06-04 2023-02-28 STATS ChipPAC Pte. Ltd. Semiconductor manufacturing device to securely hold semiconductor panels for transport and manufacturing processes
TWI793703B (zh) * 2021-06-04 2023-02-21 家登精密工業股份有限公司 閉鎖裝置及具有閉鎖裝置之容器
CN114889982B (zh) * 2022-06-23 2024-04-12 江苏奥蓝工程玻璃有限公司 一种预装有校准机构便于运输的镀膜玻璃

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US2953253A (en) * 1958-02-17 1960-09-20 William P Henderson Windshield container
US3486631A (en) * 1967-09-29 1969-12-30 John T Shaler Co Basket for polished wafers
US3682083A (en) * 1971-07-19 1972-08-08 Jose R Puente Processing rack for photographic glass plates
US4153164A (en) * 1978-06-13 1979-05-08 Kasper Instruments, Inc. Carrier for semiconductive wafers
US4418820A (en) * 1981-10-23 1983-12-06 Nagle Joseph J Circuit board case
US4858764A (en) * 1988-06-20 1989-08-22 Hughes Aircraft Company Adjustable carrier device for ceramic substrates and the like
US5064236A (en) * 1990-11-09 1991-11-12 John Stanfield Dish carrier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10045202A1 (de) * 2000-09-13 2002-04-11 Infineon Technologies Ag Kassette für flache Werkstücke
DE10046942A1 (de) * 2000-09-21 2002-04-25 Infineon Technologies Ag Verfahren zum Transport von Wafern

Also Published As

Publication number Publication date
AU1274297A (en) 1997-06-19
CN1079775C (zh) 2002-02-27
DE19681656C2 (de) 2002-08-01
US5853214A (en) 1998-12-29
KR19990071648A (ko) 1999-09-27
KR100457762B1 (ko) 2005-06-13
CN1202866A (zh) 1998-12-23
WO1997019868A1 (en) 1997-06-05
JP2000501243A (ja) 2000-02-02

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8607 Notification of search results after publication
8127 New person/name/address of the applicant

Owner name: ASYST TECHNOLOGIES, INC., FREMONT, CALIF., US

D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: ENTEGRIS CAYMAN LTD., CHASKA, MINN., US

8327 Change in the person/name/address of the patent owner

Owner name: ENTEGRIS, INC., CHASKA, MINN., US

8339 Ceased/non-payment of the annual fee