CN104743341A - 挡块、基板卡匣组件 - Google Patents

挡块、基板卡匣组件 Download PDF

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Publication number
CN104743341A
CN104743341A CN201510028661.XA CN201510028661A CN104743341A CN 104743341 A CN104743341 A CN 104743341A CN 201510028661 A CN201510028661 A CN 201510028661A CN 104743341 A CN104743341 A CN 104743341A
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block
substrate
munnion
substrate cartridge
cartridge
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陈玉龙
高雪松
许乐乐
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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Priority to CN201510028661.XA priority Critical patent/CN104743341A/zh
Publication of CN104743341A publication Critical patent/CN104743341A/zh
Priority to US14/803,922 priority patent/US10096503B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H01L21/67343—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Telephone Set Structure (AREA)

Abstract

本发明提供一种挡块、基板卡匣组件，属于显示装置制造技术领域，其可解决现有的基板卡匣容易将基板碰坏的问题。本发明的挡块为条形，用于沿长度方向设在基板卡匣的竖框的内侧；所述挡块具有用于与基板卡匣的竖框接触的接触面，以及与所述接触面相对的外露面，所述外露面至少在用于朝向基板卡匣外部的一侧为凸弧面。

Description

挡块、基板卡匣组件
技术领域
本发明属于显示装置制造技术领域，具体涉及一种挡块、基板卡匣组件。
背景技术
在液晶显示装置、有机发光二极管(OLED)显示装置等的制造过程中，经常要在不同工艺设备间传送基板。由于基板很薄，容易损坏，故不能直接搬运，而要将其放在专用的“基板卡匣(Cassette)”中运输。
如图1所示，基板卡匣1是多层的框架，其中每层用于放置一个基板9，框架两侧是纵向设置的竖框11。正常情况下，基板9两侧边与竖框11间应有数毫米的间隙，但由于设备位移等原因，基板9和基板卡匣1的相对位置不一定正确，基板可能碰到竖框11内侧(即朝向用于盛装基板9的空间的一侧)，由于基板卡匣1由金属制造，硬度大，故基板9碰在竖框11上容易损坏。
发明内容
本发明针对现有的基板卡匣容易将基板碰坏的问题，提供一种可避免基板损坏的挡块和基板卡匣组件。
解决本发明技术问题所采用的技术方案是一种挡块，其中，
所述挡块为条形，用于沿长度方向设在基板卡匣的竖框的内侧；
所述挡块具有用于与基板卡匣的竖框接触的接触面，以及与所述接触面相对的外露面，所述外露面至少在用于朝向基板卡匣外部的一侧为凸弧面。
优选的是，所述外露面的两侧均为凸弧面。
优选的是，所述挡块还包括：用于与基板卡匣的竖框连接的连接结构。
进一步优选的是，所述连接结构包括多个用于穿设螺栓的通孔。
进一步优选的是，所述连接结构包括用于与所述基板卡匣的竖框卡扣连接的卡接结构。
优选的是，所述挡块由塑料构成。
进一步优选的是，所述挡块由聚丙烯构成。
解决本发明技术问题所采用的技术方案是一种基板卡匣组件，其包括：
基板卡匣，其为用于承载基板的多层框架，所述框架包括竖框；
设在所述基板卡匣的竖框内侧的上述挡块。
本发明的挡块设在基板卡匣的竖框内侧，故若基板位置不对，其会碰在挡块上而不会碰到金属的竖框，从而可避免基板损坏；同时，该挡块在朝向基板卡匣外部的一侧为凸弧面，故若基板装入基板卡匣时位置对的不正，则基板会碰到该凸弧面并沿凸弧面滑入基板卡匣，而不会被碰坏。
附图说明
图1为现有的基板卡匣的结构示意图；
图2为本发明的实施例的挡块的结构示意图；
图3为本发明的实施例的挡块的作用原理示意框图；
图4为本发明的实施例的基板卡匣组件的结构示意图；
其中，附图标记为：1、基板卡匣；11、竖框；2、挡块；21、接触面；22、外露面；29、通孔；9、基板。
具体实施方式
为使本领域技术人员更好地理解本发明的技术方案，下面结合附图和具体实施方式对本发明作进一步详细描述。
实施例1：
如图2至图4所示，本实施例提供一种挡块2，其为条形，用于沿长度方向设在基板卡匣1的竖框11的内侧。
本实施例的挡块2可设在基板卡匣1的竖框11内侧(朝向用于盛装基板9的空间的一侧)，即挡块2可“附”在基板卡匣1的竖框11的内侧面上。故若基板9位置不对，其也只会碰到挡块2而不会直接碰到竖框11，从而可避免基板9损坏。
其中，挡块2具有用于与基板卡匣1的竖框11接触的接触面21，以及与接触面21相对的外露面22，外露面22至少在用于朝向基板卡匣1外部的一侧为凸弧面。
也就是说，如图2所示，挡块2有一面(接触面21)用于接触竖框11，而与接触面21相对的面(外露面22)自然就暴露在外。该外露面22的两侧中，至少一侧为光滑的凸弧面，且安装时将该侧朝向基板卡匣1的外部。这样，如图3所示，在把基板9送入基板卡匣1时，若其位置不正，则会碰到该凸弧面上并沿凸弧面滑动，最终顺利进入基板卡匣1，因此基板9不会与挡块2发生硬碰撞，避免了基板9损坏。其中，之所以要求外露面22朝向基板卡匣1外部的一侧为凸弧面，是因为若基板9在进入时碰到凸弧面，则进入后基板9的位置、角度等应当已经被调整正确，其在被取出时一般不会再碰到挡块2的另一侧。
优选的，外露面22的两侧均为凸弧面。
也就是说，外露面22优选朝向基板卡匣1内部的一侧也为凸弧面，或者说外露面22优选整体上是中部凸出的凸弧面。这样，在安装挡块2时不用区正反，比较方便；同时，若由于某些原因导致基板9在取出时碰到挡块2，则挡块2的该侧也为凸弧面，可保证基板9顺利滑出。
优选的，挡块2还包括用于与基板卡匣1的竖框11连接的连接结构。
也就是说，挡块2可包括一定的结构，用于将其与基板卡匣1连接。当然，若挡块2通过粘结、焊接等其他方式连接在竖框11上，也是可行的。
优选的，作为本实施例的另一种方式，以上连接结构包括多个用于穿设螺栓的通孔29。
也就是说，可在挡块2上设置多个通孔29，并在基板卡匣1竖框11的相应位置也设置通孔，这样只要将螺栓穿过这些通孔，即可将挡块2固定在竖框11上。这种形式的连接结构拆装方便、连接稳固、结构简单。其中，如图2所示，每个挡块2上优选可设有三个通孔9，且这些通孔9优选沿挡块2的长度方向均匀分布。
优选的，作为本实施例的另一种方式，连接结构也可包括用于与基板卡匣1的竖框11卡扣连接的卡接结构。
也就是说，以上连接结构也可为卡接形式，例如挡块2上可具有突出的卡头，而基板卡匣1的竖框11上设有与卡头匹配的卡口，通过将卡头插入卡口即可使实现挡块2与竖框11的连接。
优选的，以上挡块2由塑料构成，更优选聚丙烯(PP)构成。
由于塑料的硬度明显比金属的硬度低，故采用塑料制造挡块2可更好的防止基板9被碰坏。而聚丙烯材料除硬度较软外，还具有明显的自润滑效果，因此当基板9与其接触时可更容易的发生滑动，避免损伤。
如图4所示，本实施例还提供一种基板卡匣组件，其包括：
基板卡匣1，其为用于承载基板9的多层框架，框架包括竖框11；
设在基板卡匣1的竖框11内侧的上述挡块2。
在本实施例的基板卡匣组件中，包括常规的基板卡匣1，该基板卡匣1为多层框架，每层用于承载一个基板9，且框架包括纵向设置的竖框11，而竖框11内侧(朝向用于盛装基板9的空间的一侧)即设有上述的挡块2。
显然，该基板卡匣组件中，优选在基板卡匣1左右两侧的竖框11内侧均设有上述挡块2。而且，若单个挡块2的长度小于竖框11的长度，则优选在每侧竖框11上设置多个挡块2，以将竖框11上可能与基板9接触的位置均覆盖住。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (8)

1.一种挡块，其特征在于，
所述挡块为条形，用于沿长度方向设在基板卡匣的竖框的内侧；
所述挡块具有用于与基板卡匣的竖框接触的接触面，以及与所述接触面相对的外露面，所述外露面至少在用于朝向基板卡匣外部的一侧为凸弧面。
2.根据权利要求1所述的挡块，其特征在于，
所述外露面的两侧均为凸弧面。
3.根据权利要求1所述的挡块，其特征在于，还包括：
用于与基板卡匣的竖框连接的连接结构。
4.根据权利要求4所述的挡块，其特征在于，
所述连接结构包括多个用于穿设螺栓的通孔。
5.根据权利要求4所述的挡块，其特征在于，
所述连接结构包括用于与所述基板卡匣的竖框卡扣连接的卡接结构。
6.根据权利要求1至5中任意一项所述的挡块，其特征在于，
所述挡块由塑料构成。
7.根据权利要求6所述的挡块，其特征在于，
所述挡块由聚丙烯构成。
8.一种基板卡匣组件，其特征在于，包括：
基板卡匣，其为用于承载基板的多层框架，所述框架包括竖框；
设在所述基板卡匣的竖框内侧的挡块，所述挡块为权利要求1至7中任意一项所述的挡块。
CN201510028661.XA 2015-01-20 2015-01-20 挡块、基板卡匣组件 Pending CN104743341A (zh)

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US14/803,922 US10096503B2 (en) 2015-01-20 2015-07-20 Stopper for substrate cassette and substrate cassette assembly

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