US20070062889A1 - Universal cassette - Google Patents
Universal cassette Download PDFInfo
- Publication number
- US20070062889A1 US20070062889A1 US11/229,875 US22987505A US2007062889A1 US 20070062889 A1 US20070062889 A1 US 20070062889A1 US 22987505 A US22987505 A US 22987505A US 2007062889 A1 US2007062889 A1 US 2007062889A1
- Authority
- US
- United States
- Prior art keywords
- grooves
- cassette assembly
- stops
- cassette
- circular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 125000006850 spacer group Chemical group 0.000 claims description 18
- 239000004033 plastic Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 229920004943 Delrin® Polymers 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000008672 reprogramming Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B17/00—Guiding record carriers not specifically of filamentary or web form, or of supports therefor
- G11B17/22—Guiding record carriers not specifically of filamentary or web form, or of supports therefor from random access magazine of disc records
- G11B17/225—Guiding record carriers not specifically of filamentary or web form, or of supports therefor from random access magazine of disc records wherein the disks are transferred from a fixed magazine to a fixed playing unit using a moving carriage
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
- G11B23/02—Containers; Storing means both adapted to cooperate with the recording or reproducing means
- G11B23/03—Containers for flat record carriers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/02—Cabinets; Cases; Stands; Disposition of apparatus therein or thereon
- G11B33/027—Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
Definitions
- This invention relates to cassettes for holding disks, wafers and/or plates during thin film manufacturing processes. Specifically, this invention relates to a universal cassette.
- cassettes for holding and transporting semi-conductor type devices during processing in reusable cassettes.
- the silicon disks used with these cassettes are circular.
- nontraditional materials such as alumina, aluminum nitride, and fused silica are becoming more widespread. These nontraditional materials however, are generally square shaped during processing.
- it is desirable to have a universal cassette design which allows existing, robotic processing equipment to handle both the round and square devices without modification to the robotic or processing equipment.
- the primary feature or advantage of the present invention is to provide an improved universal cassette.
- a further feature or advantage of the present invention is a cassette which can easily be converted from a configuration for holding round semi-conductor type disks to a configuration for holding square plates.
- Another feature or advantage of the present invention is a cassette which is capable of holding both round disks and square plates for processing so that the geometric center of each is in the same location within the cassette.
- a still further feature or advantage of the present invention is a provision of a universal cassette design which is economical to manufacturer, durable in use, and efficient in operation.
- cassette assembly for holding circular and non-circular disks having a cassette body with a top wall, a bottom wall, opposite side walls, and an open front, creating an inside and an outside of the cassette body.
- the side walls having horizontal grooves adapted to receive and hold the disks.
- One or more first stops are inside the cassette body adjacent the grooves for stopping non-circular disks at a location in the grooves, as the non-circular disks are placed in the grooves from the front, and one or more removable second stops inside the cassette body spaced inwardly from the first stops for stopping the circular disks at the location in the grooves as the circular disks are placed in the grooves from the front, so that the geometric center of the circular disk approximately aligns with the geometric center of the non-circular disks.
- Another aspect of the current invention is a cassette assembly wherein grooves open toward the inside of the cassette body and extend from the front towards the rear of the cassette body.
- Another aspect of the current invention is a cassette assembly having linear grooves.
- Another aspect of the current invention is a cassette assembly having one or more removable stops extending from the top wall to the bottom wall.
- these stops may be constructed of stainless steel.
- a still further aspect of the current invention is a cassette assembly using stops which may be constructed from a plastic material.
- FIG. 1 shows one embodiment of a robotic transfer station assembly in association with a process chamber and one embodiment of the current invention.
- FIG. 2 shows a perspective view of one embodiment of the current invention.
- FIGS. 3 A-C respectively show a front, top and side view of one embodiment of the current invention.
- FIGS. 4 A-C respectively show a top, front and side view of one embodiment of the bottom plate.
- FIGS. 5 A-C respectively show a front, side, and top view of one embodiment of the side plates.
- FIGS. 6 A-C respectively show a top, front and side view of one embodiment of the top plate.
- FIGS. 7 A-B respectively show a side and top view of one embodiment of a spacer post.
- FIGS. 8 A-B respectively show a side and top view of one embodiment of a stop rod.
- FIG. 9 shows a rear perspective view of two cassette assemblies, one configured for holding square plates and one configured for holding round disks.
- the invention is an improved universal cassette for holding semi conductor or other materials for thin film processing.
- One embodiment of the invention is shown in FIGS. 1-9 .
- This embodiment incorporates removable spacer posts 70 used within the universal cassette assembly 14 to hold round disks 16 when the spacer posts 70 are installed and non-round disks 17 , such as square plates, when the spacer posts 70 are removed. Additionally, the geometric centers of both the round disk 16 and square plates 17 are located within the same approximate front to rear location within the cassette assembly grooves 54 .
- FIG. 1 shows a typical robotic transfer station 10 which is controlled by a computer control panel 11 .
- the robotic transfer station 10 generally has a lift arm 12 for extending into a cassette assembly 14 and lifting a disk 16 , 17 and placing the disk 16 , 17 into a process chamber 18 .
- Process chambers 18 are typically used to remove impurities, such as photo resist.
- a common process chamber is a Matrix System 1 Plasma Asher or stripper.
- an elevator 20 raises a cassette assembly 14 to the proper height for the lift arm 12 to extend underneath the proper disk 16 , 17 .
- the lift arm 12 then slightly lifts the disk 16 , 17 and slides the disk 16 , 17 out of the cassette assembly 14 .
- the lift arm 12 can then rotate to the proper orientation and insert the disk 16 , 17 into the process chamber 18 for processing.
- the lift arm 12 can then enter the processing chamber 18 , lift the disk 16 , 17 , remove the disk 16 , 17 , and return the disk 16 , 17 to the cassette assembly 14 . This cycle is repeated for each disk 16 , 17 in the cassette assembly 14 . Any number of disks 16 , 17 can be held in the contemplated cassette assembly 14 .
- the processing procedure is well-known to one ordinarily skilled in the art.
- FIGS. 1-3 and 9 show the preferred embodiment of an assembled wafer cassette assembly 14 .
- FIG. 1 shows a typical set-up utilizing the wafer cassette assembly 14 in process.
- FIG. 2 shows an isometric view of the preferred embodiment of the cassette assembly 14 .
- FIG. 3A -C show front, top and side views of the wafer cassette assembly 14 .
- FIG. 9 shows a perspective view of two wafer cassette assemblies 14 side-by-side, one having spacer posts 70 installed and the other not having spacer posts 70 installed.
- FIGS. 4 A-C shows a preferred embodiment of the bottom plate 30 of the wafer cassette assembly 14 .
- the bottom plate 30 may have a cut-out 32 on the bottom side of the bottom plate 30 .
- the bottom plate 30 have one or more locating pin points 34 which are holes that can help align the bottom plate 30 to the side plates 50 , 52 with dowel pins (not shown). This helps to create a proper alignment of the bottom plate 30 to the side plates 50 , 52 .
- the bottom plate 30 is also preferred to have one or more machine bolt through holes 36 . These machine bolt through holes 36 allow a machine bolt (not shown) to pass through the hole 36 and into machine bolt threaded holes 38 in the side plates 50 , 52 . The machine bolt(s) tighten into the threaded holes 38 to hold the pieces together.
- the top plate 40 shown in FIG. 6 , additionally has machine bolt through holes 36 and locating pin points 34 for locating and attaching the top plate 40 to the side plates 50 , 52 .
- the preferred material for the top plate 40 , bottom plate 30 and side plates 50 , 52 is anodized aluminum, however other materials will work.
- the side plates, 50 , 52 shown in FIG. 5 have a plurality of grooves 54 .
- the grooves 54 are preferred to have a chamfer 55 .
- the grooves 54 should be deep enough, wide enough and spaced apart enough to allow the desired size plates 16 , 17 to easily slide in and out of the grooves 54 when used with a cassette assembly 14 .
- the chambers 55 smooth the sharp edges on the corners of the groove 54 to reduce damaging the disks 16 , 17 .
- the grooves 54 should be wide enough and deep enough to also allow the cassette assembly 14 to hold alumina, aluminum nitride, and fused silica, and other types of square plates as well as round silica disks for thin film processing.
- the side plates 50 , 52 are preferred to have a rod stop hole 56 .
- the rod stop hole 56 is sized to receive a rod stop 80 , as shown in FIG. 8 .
- the rod stop is preferred to be made of Teflon®, Delrin®, or other types of plastic type material to stop the travel of the plates 17 as they slide into the groove 54 of the cassette assembly 14 .
- a plastic type stop rod 80 is preferred so that it doesn't damage the disk 16 or plate 17 within the cassette assembly 14 .
- the rod stop 80 passes through the stop rod hole 56 in the side plates 50 , 52 and extends into the grooves 54 . Additionally, the rod stop 80 is held into the rod stop hole 56 in the side plates 50 , 52 by the bottom plate 30 and the top plate 40 .
- the top plate 40 additionally is preferred to have one or more spacer post through holes 42 for allowing spacer posts 70 to pass through the through hole 42 and to the spacer post threaded holes 44 in the bottom plate 30 .
- the spacer post 70 is preferred to be a stainless steel rod with a screw driver slot 74 on one end and threads 72 on the other end. This allows the spacer post 70 to pass through a spacer post through hole 42 in the top plate 40 and thread into and tighten in the spacer post threaded holes 44 in the bottom plate 30 .
- the spacer post 70 is to be placed in a location which stops the travel of round silicon disks 16 within the grooves 54 in the same location within the grooves 54 that the square plates 17 are stopped with the stop rod 80 . In other words, the geometric center 90 of both the round disk 16 and the square plate 17 should be located in the same position in the groove 54 .
- the wafer cassette assembly 14 can easily be transformed from holding square plates 17 , with the square plates 17 being stopped by the stop rod 80 , to being capable of holding round disks 16 in the grooves 54 such that the geometric centers 90 align.
- This allows for a cassette assembly 14 to be easily transformed into holding either round disks 16 or square plates 17 so that a robotic transfer station 10 can easily pick up the geometric center 90 of either the round disk 16 or the square plate 17 and properly locate it into and out of a process chamber 18 and back into the cassette assembly 14 .
- This allows any substrate to be used without reprogramming or realignment of the robotic transfer station 10 .
- To convert a cassette assembly 14 from using round disk 16 to square plate 17 one simply has to remove the spacer post 70 .
- To convert a cassette assembly 14 which is using square plates 17 to be able to use round disk 16 one simply has to install spacer post 70 .
- cassette assembly 14 allows for a single design of cassette assembly 14 to be used for any type of substrate material for use in thin film processing.
- the preferred embodiment is configured to hold substrates ranging in size from about 0.015′′ to about 0.060′′ nominal thickness.
- the invention can be built to hold any size substrate.
- circular and non circular disk and plate are used in this application interchangeably.
- a disk was referred to a round material and a plate was referred to a square shaped material.
- any shape of devices can be used with the current invention.
- circular and round disks or plates are used for exemplary purposes only. Any shape or sets of shapes of disks may be used with this invention.
Abstract
Description
- This invention relates to cassettes for holding disks, wafers and/or plates during thin film manufacturing processes. Specifically, this invention relates to a universal cassette.
- It is common today to use cassettes for holding and transporting semi-conductor type devices during processing in reusable cassettes. Generally, the silicon disks used with these cassettes are circular. However, advances in nontraditional materials, such as alumina, aluminum nitride, and fused silica are becoming more widespread. These nontraditional materials however, are generally square shaped during processing., Thus, it is desirable to have a cassette capable of holding and storing both the round silicon disks as well as the square nontraditional disks. Furthermore, it is desirable to have a universal cassette design which allows existing, robotic processing equipment to handle both the round and square devices without modification to the robotic or processing equipment.
- In light of the foregoing, the primary feature or advantage of the present invention is to provide an improved universal cassette.
- A further feature or advantage of the present invention is a cassette which can easily be converted from a configuration for holding round semi-conductor type disks to a configuration for holding square plates.
- Another feature or advantage of the present invention is a cassette which is capable of holding both round disks and square plates for processing so that the geometric center of each is in the same location within the cassette.
- A still further feature or advantage of the present invention is a provision of a universal cassette design which is economical to manufacturer, durable in use, and efficient in operation.
- One or more of these and/or other features or advantages of the current invention will be apparent from the specification and claims that follow.
- One or more of the foregoing features or advantages may be achieved by cassette assembly for holding circular and non-circular disks having a cassette body with a top wall, a bottom wall, opposite side walls, and an open front, creating an inside and an outside of the cassette body. The side walls having horizontal grooves adapted to receive and hold the disks. One or more first stops are inside the cassette body adjacent the grooves for stopping non-circular disks at a location in the grooves, as the non-circular disks are placed in the grooves from the front, and one or more removable second stops inside the cassette body spaced inwardly from the first stops for stopping the circular disks at the location in the grooves as the circular disks are placed in the grooves from the front, so that the geometric center of the circular disk approximately aligns with the geometric center of the non-circular disks.
- Another aspect of the current invention is a cassette assembly wherein grooves open toward the inside of the cassette body and extend from the front towards the rear of the cassette body.
- Another aspect of the current invention is a cassette assembly having linear grooves.
- Another aspect of the current invention is a cassette assembly having one or more removable stops extending from the top wall to the bottom wall. In addition, these stops may be constructed of stainless steel.
- A still further aspect of the current invention is a cassette assembly using stops which may be constructed from a plastic material.
-
FIG. 1 shows one embodiment of a robotic transfer station assembly in association with a process chamber and one embodiment of the current invention. -
FIG. 2 shows a perspective view of one embodiment of the current invention. - FIGS. 3A-C respectively show a front, top and side view of one embodiment of the current invention.
- FIGS. 4A-C respectively show a top, front and side view of one embodiment of the bottom plate.
- FIGS. 5A-C respectively show a front, side, and top view of one embodiment of the side plates.
- FIGS. 6A-C respectively show a top, front and side view of one embodiment of the top plate.
- FIGS. 7A-B respectively show a side and top view of one embodiment of a spacer post.
- FIGS. 8A-B respectively show a side and top view of one embodiment of a stop rod.
-
FIG. 9 shows a rear perspective view of two cassette assemblies, one configured for holding square plates and one configured for holding round disks. - The invention is an improved universal cassette for holding semi conductor or other materials for thin film processing. One embodiment of the invention is shown in
FIGS. 1-9 . This embodiment incorporatesremovable spacer posts 70 used within theuniversal cassette assembly 14 to holdround disks 16 when thespacer posts 70 are installed andnon-round disks 17, such as square plates, when thespacer posts 70 are removed. Additionally, the geometric centers of both theround disk 16 andsquare plates 17 are located within the same approximate front to rear location within thecassette assembly grooves 54. -
FIG. 1 shows a typicalrobotic transfer station 10 which is controlled by acomputer control panel 11. Therobotic transfer station 10 generally has alift arm 12 for extending into acassette assembly 14 and lifting adisk disk process chamber 18.Process chambers 18 are typically used to remove impurities, such as photo resist. A common process chamber is a Matrix System 1 Plasma Asher or stripper. - In operation, an
elevator 20 raises acassette assembly 14 to the proper height for thelift arm 12 to extend underneath theproper disk lift arm 12 then slightly lifts thedisk disk cassette assembly 14. Thelift arm 12 can then rotate to the proper orientation and insert thedisk process chamber 18 for processing. Once processing is completed in theprocess chamber 18, thelift arm 12 can then enter theprocessing chamber 18, lift thedisk disk disk cassette assembly 14. This cycle is repeated for eachdisk cassette assembly 14. Any number ofdisks cassette assembly 14. The processing procedure is well-known to one ordinarily skilled in the art. -
FIGS. 1-3 and 9 show the preferred embodiment of an assembledwafer cassette assembly 14.FIG. 1 shows a typical set-up utilizing thewafer cassette assembly 14 in process.FIG. 2 shows an isometric view of the preferred embodiment of thecassette assembly 14.FIG. 3A -C show front, top and side views of thewafer cassette assembly 14.FIG. 9 shows a perspective view of twowafer cassette assemblies 14 side-by-side, one havingspacer posts 70 installed and the other not havingspacer posts 70 installed. - FIGS. 4A-C shows a preferred embodiment of the
bottom plate 30 of thewafer cassette assembly 14. Thebottom plate 30 may have a cut-out 32 on the bottom side of thebottom plate 30. In addition, it is preferred that thebottom plate 30 have one or more locatingpin points 34 which are holes that can help align thebottom plate 30 to theside plates bottom plate 30 to theside plates bottom plate 30 is also preferred to have one or more machine bolt through holes 36. These machine bolt throughholes 36 allow a machine bolt (not shown) to pass through thehole 36 and into machine bolt threadedholes 38 in theside plates holes 38 to hold the pieces together. - The
top plate 40, shown inFIG. 6 , additionally has machine bolt throughholes 36 and locating pin points 34 for locating and attaching thetop plate 40 to theside plates top plate 40,bottom plate 30 andside plates - The side plates, 50, 52 shown in
FIG. 5 , have a plurality ofgrooves 54. Thegrooves 54 are preferred to have achamfer 55. Thegrooves 54 should be deep enough, wide enough and spaced apart enough to allow the desiredsize plates grooves 54 when used with acassette assembly 14. In addition, thechambers 55 smooth the sharp edges on the corners of thegroove 54 to reduce damaging thedisks grooves 54 should be wide enough and deep enough to also allow thecassette assembly 14 to hold alumina, aluminum nitride, and fused silica, and other types of square plates as well as round silica disks for thin film processing. - The
side plates rod stop hole 56. Therod stop hole 56 is sized to receive arod stop 80, as shown inFIG. 8 . The rod stop is preferred to be made of Teflon®, Delrin®, or other types of plastic type material to stop the travel of theplates 17 as they slide into thegroove 54 of thecassette assembly 14. A plastictype stop rod 80 is preferred so that it doesn't damage thedisk 16 orplate 17 within thecassette assembly 14. Therod stop 80 passes through thestop rod hole 56 in theside plates grooves 54. Additionally, therod stop 80 is held into therod stop hole 56 in theside plates bottom plate 30 and thetop plate 40. - The
top plate 40 additionally is preferred to have one or more spacer post throughholes 42 for allowing spacer posts 70 to pass through the throughhole 42 and to the spacer post threadedholes 44 in thebottom plate 30. Thespacer post 70, as seen inFIG. 7 , is preferred to be a stainless steel rod with ascrew driver slot 74 on one end andthreads 72 on the other end. This allows thespacer post 70 to pass through a spacer post throughhole 42 in thetop plate 40 and thread into and tighten in the spacer post threadedholes 44 in thebottom plate 30. Thespacer post 70 is to be placed in a location which stops the travel ofround silicon disks 16 within thegrooves 54 in the same location within thegrooves 54 that thesquare plates 17 are stopped with thestop rod 80. In other words, thegeometric center 90 of both theround disk 16 and thesquare plate 17 should be located in the same position in thegroove 54. - Constructed in this manner, the
wafer cassette assembly 14 can easily be transformed from holdingsquare plates 17, with thesquare plates 17 being stopped by thestop rod 80, to being capable of holdinground disks 16 in thegrooves 54 such that thegeometric centers 90 align. This allows for acassette assembly 14 to be easily transformed into holding eitherround disks 16 orsquare plates 17 so that arobotic transfer station 10 can easily pick up thegeometric center 90 of either theround disk 16 or thesquare plate 17 and properly locate it into and out of aprocess chamber 18 and back into thecassette assembly 14. This allows any substrate to be used without reprogramming or realignment of therobotic transfer station 10. To convert acassette assembly 14 from usinground disk 16 tosquare plate 17, one simply has to remove thespacer post 70. On the other hand, to convert acassette assembly 14 which is usingsquare plates 17 to be able to useround disk 16, one simply has to installspacer post 70. - Traditionally, when substrate media was changed, individualized or customized cassette assemblies had to be constructed and used. This invention allows for a single design of
cassette assembly 14 to be used for any type of substrate material for use in thin film processing. In addition, the preferred embodiment is configured to hold substrates ranging in size from about 0.015″ to about 0.060″ nominal thickness. However, the invention can be built to hold any size substrate. - The words circular and non circular disk and plate are used in this application interchangeably. Generally, a disk was referred to a round material and a plate was referred to a square shaped material. However, any shape of devices can be used with the current invention. Furthermore, circular and round disks or plates are used for exemplary purposes only. Any shape or sets of shapes of disks may be used with this invention.
- In the drawings and specification there has been set forth preferred embodiment of the invention, and all those specific terms are employed, these are used in a generic and descriptive sense only and not for purposes of limitation. Changes in the form and the portions of parts as well as in the substitution of equivalence are contemplated as circumstance may suggest or render expedient without departing from the spirit or scope of the invention as further defined in the following claims. For example, the present invention contemplates variations in structure of the top plate, bottom plate and side plates. Additionally, it is contemplated that other types or shapes of substrate materials can be used within the present invention. These and other variations are within the spirit and scope of the invention.
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US11/229,875 US20070062889A1 (en) | 2005-09-19 | 2005-09-19 | Universal cassette |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US11/229,875 US20070062889A1 (en) | 2005-09-19 | 2005-09-19 | Universal cassette |
Publications (1)
Publication Number | Publication Date |
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US20070062889A1 true US20070062889A1 (en) | 2007-03-22 |
Family
ID=37883001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/229,875 Abandoned US20070062889A1 (en) | 2005-09-19 | 2005-09-19 | Universal cassette |
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US (1) | US20070062889A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2950195A1 (en) * | 2009-07-21 | 2011-03-18 | Semco Engineering Sa | Silicon plate support for heat treating furnace to manufacture photovoltaic cell, has housings receiving respective plates to treat and maintain plates in horizontal position, where housings horizontally extend between openings of basket |
US20140037406A1 (en) * | 2012-07-31 | 2014-02-06 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Glass Substrate Cassette and Pick-and-Place System for Glass Substrate |
US20140231305A1 (en) * | 2013-02-18 | 2014-08-21 | Disco Corporation | Cassette assembly |
US20140360552A1 (en) * | 2012-07-19 | 2014-12-11 | Brittmore Group LLC | Solar Panel Field Array Support System and Apparatus and Method for Construction Use |
US10096503B2 (en) * | 2015-01-20 | 2018-10-09 | Boe Technology Group Co., Ltd. | Stopper for substrate cassette and substrate cassette assembly |
US20190326145A1 (en) * | 2018-04-19 | 2019-10-24 | Mitsubishi Electric Corporation | Wafer boat and method of manufacturing the same |
WO2021083971A1 (en) * | 2019-10-31 | 2021-05-06 | Asys Automatisierungssysteme Gmbh | Magazine system |
US11367639B2 (en) * | 2020-02-06 | 2022-06-21 | Samsung Display Co., Ltd. | Cassette for substrates of display devices |
TWI829388B (en) * | 2022-10-12 | 2024-01-11 | 迅得機械股份有限公司 | Cassette for carrying plates |
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Cited By (14)
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FR2950195A1 (en) * | 2009-07-21 | 2011-03-18 | Semco Engineering Sa | Silicon plate support for heat treating furnace to manufacture photovoltaic cell, has housings receiving respective plates to treat and maintain plates in horizontal position, where housings horizontally extend between openings of basket |
US10696451B2 (en) * | 2011-07-19 | 2020-06-30 | Eric Bramwell Britcher | Solar panel field array support system and apparatus and method for construction use |
US20170313470A1 (en) * | 2011-07-19 | 2017-11-02 | Brittmore Group LLC | Solar Panel Field Array Support System and Apparatus and Method for Construction Use |
US20140360552A1 (en) * | 2012-07-19 | 2014-12-11 | Brittmore Group LLC | Solar Panel Field Array Support System and Apparatus and Method for Construction Use |
US9079714B2 (en) * | 2012-07-31 | 2015-07-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Glass substrate cassette and pick-and-place system for glass substrate |
US20140037406A1 (en) * | 2012-07-31 | 2014-02-06 | Shenzhen China Star Optoelectronics Technology Co. Ltd. | Glass Substrate Cassette and Pick-and-Place System for Glass Substrate |
US20140231305A1 (en) * | 2013-02-18 | 2014-08-21 | Disco Corporation | Cassette assembly |
US9117864B2 (en) * | 2013-02-18 | 2015-08-25 | Disco Corporation | Assemblies of stacked cassettes |
US10096503B2 (en) * | 2015-01-20 | 2018-10-09 | Boe Technology Group Co., Ltd. | Stopper for substrate cassette and substrate cassette assembly |
US20190326145A1 (en) * | 2018-04-19 | 2019-10-24 | Mitsubishi Electric Corporation | Wafer boat and method of manufacturing the same |
WO2021083971A1 (en) * | 2019-10-31 | 2021-05-06 | Asys Automatisierungssysteme Gmbh | Magazine system |
US11367639B2 (en) * | 2020-02-06 | 2022-06-21 | Samsung Display Co., Ltd. | Cassette for substrates of display devices |
US11670530B2 (en) | 2020-02-06 | 2023-06-06 | Samsung Display Co., Ltd. | Cassette for substrates of display devices |
TWI829388B (en) * | 2022-10-12 | 2024-01-11 | 迅得機械股份有限公司 | Cassette for carrying plates |
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