JPH0529445A - Positioning apparatus for substrate - Google Patents

Positioning apparatus for substrate

Info

Publication number
JPH0529445A
JPH0529445A JP20327091A JP20327091A JPH0529445A JP H0529445 A JPH0529445 A JP H0529445A JP 20327091 A JP20327091 A JP 20327091A JP 20327091 A JP20327091 A JP 20327091A JP H0529445 A JPH0529445 A JP H0529445A
Authority
JP
Japan
Prior art keywords
substrate
matching
board
diameter
fitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20327091A
Other languages
Japanese (ja)
Other versions
JP2573759B2 (en
Inventor
Akihiro Azuma
昭弘 東
Masami Otani
正美 大谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP20327091A priority Critical patent/JP2573759B2/en
Publication of JPH0529445A publication Critical patent/JPH0529445A/en
Application granted granted Critical
Publication of JP2573759B2 publication Critical patent/JP2573759B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Registering Or Overturning Sheets (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To provide a substrate-positioning apparatus wherein it is possible to simply and quickly comply with a change in a substrate diameter. CONSTITUTION:A group of abutment pins 2 on one pair of substrate alignment members 1 which are moved so as to be approached and separated relatively by a definite distance are installed on a circular line which corresponds to a maximum-diameter substrate Wa to be handled; fitting alignment plates 3 which are used to position a small-diameter substrate Wb are fitted to and mounted on, so as to be detachable, the required abutment pins 2 on the individual substrate alignment members 1. A plurality of abutment parts 7 which abut on the outer circumferential edge of the small-diameter substrate Wb are formed respectively at faced end edges of both fitting alignment plates 3.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体基板等の基板に
各種処理を施す際の位置決め心合わせを行うための装置
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for performing positioning alignment when various kinds of processing are performed on a substrate such as a semiconductor substrate.

【0002】[0002]

【従来の技術】この種の基板の位置決め装置の構成を図
6および図7を参照して説明する。図中、符号1は相対
的に一定距離だけ接近離反移動するように対向配置され
た一対の基板整合部材であり、これらの基板整合部材1
の上面にそれぞれ複数個の当接ピン2が突設されてい
る。両基板整合部材1の間には昇降自在の基板搭載アー
ム8があり、この基板搭載アーム8の上面に、搬入され
てきた基板Wを搭載支持するための複数個の支持ピン9
が立設されている。上昇位置にある基板搭載アーム8の
支持ピン9の上に基板Wが搭載されると、基板搭載アー
ム8が所定位置にまで下降する。その後、基板整合部材
1が相対的に接近移動し、各当接ピン2が基板Wの外周
縁に当接して基板Wを水平方向に微動させることによ
り、基板Wの位置決めを行っている。
2. Description of the Related Art The construction of a substrate positioning device of this type will be described with reference to FIGS. In the figure, reference numeral 1 is a pair of substrate matching members arranged so as to face each other so as to move toward and away from each other by a fixed distance.
A plurality of contact pins 2 are provided on the upper surface of each of them. A substrate mounting arm 8 that can be raised and lowered is provided between both substrate matching members 1, and a plurality of support pins 9 for mounting and supporting the substrate W that has been carried in are provided on the upper surface of the substrate mounting arm 8.
Is erected. When the substrate W is mounted on the support pins 9 of the substrate mounting arm 8 in the raised position, the substrate mounting arm 8 descends to a predetermined position. After that, the substrate aligning member 1 relatively moves closer to each other, and the contact pins 2 contact the outer peripheral edge of the substrate W to finely move the substrate W in the horizontal direction, thereby positioning the substrate W.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、上述し
た従来装置には次のような問題点がある。すなわち、従
来装置によれば、処理対象である基板Wの寸法が変わる
と、装置にネジ止め固定されていた基板整合部材1を取
り外した後、新たな基板Wに対応したピン配置をもった
別の基板整合部材1をネジ止め固定しなければならず、
工具を使って基板支持部材1を着脱交換するのに時間が
かかるとともに、その交換の間の運転休止のために装置
の処理効率が低下するという問題点がある。
However, the above-mentioned conventional device has the following problems. That is, according to the conventional apparatus, when the size of the substrate W to be processed changes, the substrate alignment member 1 screwed and fixed to the apparatus is removed, and then the pin arrangement corresponding to the new substrate W is provided. The board matching member 1 of must be fixed with screws,
There is a problem that it takes time to remove and replace the substrate supporting member 1 using a tool, and the processing efficiency of the apparatus is lowered due to the suspension of operation during the replacement.

【0004】本発明は、このような事情に鑑みてなされ
たものであって、対象基板の寸法変更があった場合でも
特に工具を使うことなく、簡単迅速に対応することがで
きる基板の位置決め装置を提供することを目的とする。
The present invention has been made in view of the above circumstances, and can easily and quickly respond to a change in the size of a target substrate without using a tool. The purpose is to provide.

【0005】[0005]

【発明を解決するための手段】上記目的を達成するた
め、本発明は次のような構成を採る。すなわち、本発明
は、相対的に一定距離だけ接近離反移動する一対の基板
整合部材の上面にそれぞれ複数個の当接ピンを突設し、
前記両基板整合部材が相対的に接近移動して前記各当接
ピンが基板の外周縁に当接することにより、基板の位置
決めを行う基板の位置決め装置において、前記両基板整
合部材上の当接ピン群は、位置決めされる最大径の基板
形状に対応した位置にそれぞれ設けられており、かつ両
基板整合部材上に少なくとも2つの当接ピンによって位
置決め嵌合される嵌合整合板をそれぞれ取外し可能に搭
載し、前記両嵌合整合板に前記最大径の基板よりも小径
の基板の外周縁に当接する複数個の当接部を設けたもの
である。
In order to achieve the above object, the present invention has the following constitution. That is, according to the present invention, a plurality of contact pins are provided on the upper surfaces of a pair of substrate matching members that relatively move toward and away from each other by a fixed distance,
In a board positioning device for positioning a board by causing the board matching members to move relatively toward each other and the contact pins to contact the outer peripheral edge of the board, the contact pins on the board matching members are provided. The groups are respectively provided at the positions corresponding to the shape of the board having the largest diameter to be positioned, and the fitting matching plates that are positioned and fitted by the at least two contact pins on both the board matching members are removable. A plurality of abutting portions that are mounted and abut on the outer peripheral edge of the board having a diameter smaller than that of the board having the maximum diameter are provided on both of the fitting matching plates.

【0006】[0006]

【作用】本発明の作用は次のとおりである。すなわち、
本発明によれば、嵌合整合板を嵌め付けずに、基板整合
部材を相対的に接近移動させることによって、最大径の
基板が位置決めされる。一方、対象とする基板の径が小
さいものである場合、これに応じて予め用意してある嵌
合整合板を基板整合部材上の当接ピンに嵌め付けた後、
基板整合部材とともに嵌合整合板を接近移動させて、そ
の嵌合整合板に形成された当接部を小径基板の外周縁に
当接させることにより、小径基板の位置決めを行う。
The operation of the present invention is as follows. That is,
According to the present invention, the substrate having the largest diameter is positioned by moving the substrate matching member relatively close to each other without fitting the fitting matching plate. On the other hand, when the diameter of the target substrate is small, after fitting the fitting matching plate prepared in advance to the contact pin on the substrate matching member,
The small-diameter substrate is positioned by moving the fitting-matching plate together with the substrate-matching member and bringing the contact portion formed on the fitting-matching plate into contact with the outer peripheral edge of the small-diameter substrate.

【0007】[0007]

【実施例】以下、図1ないし図5を参照して、本発明に
係る基板の位置決め装置の一実施例を説明する。本実施
例に係る基板の位置決め装置は、上述した従来装置と同
様に、対向配置された基板整合部材1と、前記両基板整
合部材1の間に図示しない基板搭載アームを備え、図示
しない駆動手段によって各基板整合部材1をそれぞれ一
定ストロークLa,Lbで接近離反移動させて、基板搭
載アームに立設された支持ピン上に搭載された基板Wa
に当接ピン2を当接することで基板Waを所定の中心P
上に心合わせ位置決めするものである。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the substrate positioning apparatus according to the present invention will be described below with reference to FIGS. The substrate positioning apparatus according to the present embodiment is provided with a substrate matching member 1 arranged opposite to each other and a substrate mounting arm (not shown) between the both substrate matching members 1 as in the above-described conventional apparatus, and a driving unit (not shown). The substrate matching members 1 are moved toward and away from each other by constant strokes La and Lb, respectively, and the substrate Wa mounted on the support pins erected on the substrate mounting arm is moved.
The substrate Wa is moved to a predetermined center P by abutting the abutment pin 2 on the substrate Wa.
It is for centering and positioning on top.

【0008】ここで、前記当接ピン2群は、取扱う最大
径の基板Waに対向して所定の円形線に沿って設けられ
ており、この基板Waを位置決めする際には、後述する
嵌合整合板3を取り外した状態で基板整合部材1を作動
させる。一方、基板Waよりも小径の基板Wbを位置決
めする際には、図1ないし図4に示すように例えばプラ
スチック製の嵌合整合板3を補助治具として用いる。
Here, the contact pin group 2 is provided along a predetermined circular line so as to face the substrate Wa having the largest diameter to be handled, and when positioning the substrate Wa, a fitting described later is performed. The substrate matching member 1 is operated with the matching plate 3 removed. On the other hand, when positioning the substrate Wb having a smaller diameter than the substrate Wa, a fitting matching plate 3 made of, for example, plastic is used as an auxiliary jig as shown in FIGS. 1 to 4.

【0009】この嵌合整合板3は、各基板整合部材1上
に搭載装着されるものであって、最も端の1つの当接ピ
ン2に対して密に嵌合する単孔4と、他端の当接ピン2
に対して前後方向(基板整合部材の移動方向)には密に
嵌合して横方向には融通のある長孔5と、中間にある当
接ピン2に対しては遊嵌される凹部6とを備え、単孔4
と長孔5を用いて嵌合整合板3が各基板整合部材1上に
それぞれ一定の姿勢で嵌合装着されるようになってい
る。
The fitting and matching plate 3 is mounted and mounted on each substrate matching member 1, and has a single hole 4 that closely fits the one contact pin 2 at the end, and the other. End contact pin 2
On the other hand, the elongated hole 5 that is tightly fitted in the front-rear direction (the moving direction of the substrate alignment member) and has the flexibility in the lateral direction, and the recess 6 that is loosely fitted in the contact pin 2 in the middle. And a single hole 4
The fitting matching plate 3 is fitted and mounted on each substrate matching member 1 in a fixed posture by using the long holes 5.

【0010】そして、各嵌合整合板3の対向する端縁は
対象とする小径基板Wbよりやや大径の円弧状に切り欠
き形成されるとともに、この端縁3aに凸状の当接部7
が複数個形成されており、前記ストロークLa,Lbで
両基板整合部材1が接近移動した時に、これら当接部7
群が小径基板Wbの外周縁に当接して、基板Wbを中心
P上に心合せ位置決めするようになっている。
The opposing edges of each fitting matching plate 3 are cut out in a circular arc shape having a diameter slightly larger than the target small diameter substrate Wb, and a convex contact portion 7 is formed on the edge 3a.
When a plurality of substrate alignment members 1 are moved toward each other by the strokes La and Lb, the contact portions 7 are formed.
The group abuts on the outer peripheral edge of the small-diameter substrate Wb to align the substrate Wb on the center P.

【0011】尚、更に小径の基板Wcを取扱うときに
は、図5に示すように、この基板Wcの外形に対応する
当接部7をもった別の嵌合整合板3を基板整合部材1の
当接ピン2に嵌合装着して、前記と同様の位置決めを行
う。
When handling a substrate Wc having a smaller diameter, as shown in FIG. 5, another fitting matching plate 3 having a contact portion 7 corresponding to the outer shape of the substrate Wc is applied to the substrate matching member 1. The contact pin 2 is fitted and mounted, and the same positioning as described above is performed.

【0012】上述の実施例では、嵌合整合板3に小径の
基板の外周縁に当接するための当接部7として、嵌合整
合板3の円弧状切り欠きの端縁3aに突起を形成した
が、これは、嵌合整合板3の上面に小径基板の外形に沿
った当接ピンを配置したものであってもよい。
In the above-described embodiment, a protrusion is formed on the edge 3a of the arcuate cutout of the fitting matching plate 3 as the contact portion 7 for contacting the fitting matching plate 3 with the outer peripheral edge of the small-diameter substrate. However, this may be one in which a contact pin along the outer shape of the small-diameter substrate is arranged on the upper surface of the fitting matching plate 3.

【0013】[0013]

【発明の効果】以上の説明から明らかなように、本発明
によれば、嵌合整合板を工具なしで基板整合部材上に着
脱するだけで各種寸法の基板に簡単迅速に対応すること
ができ、仕様変更のために処理を中断する時間が極めて
短くなり、この種の位置決め機構を持った各種装置の処
理効率を高めることができる。
As is apparent from the above description, according to the present invention, it is possible to easily and quickly deal with substrates of various sizes simply by attaching and detaching the fitting matching plate to and from the substrate matching member without using a tool. The time during which the processing is interrupted due to the specification change becomes extremely short, and the processing efficiency of various devices having this kind of positioning mechanism can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明に係る基板の位置決め装置の一実施例の
要部分解斜視図である。
FIG. 1 is an exploded perspective view of a main part of an embodiment of a substrate positioning apparatus according to the present invention.

【図2】嵌合整合板を使った位置決め処理状態を示す平
面図である。
FIG. 2 is a plan view showing a positioning processing state using a fitting matching plate.

【図3】嵌合整合板の取り付け状態を示す縦断側面図あ
る。
FIG. 3 is a vertical sectional side view showing a mounting state of a fitting matching plate.

【図4】嵌合整合板の取付け状態を示す縦断正面図であ
る。
FIG. 4 is a vertical sectional front view showing a mounting state of a fitting matching plate.

【図5】より小径の基板を位置決め処理する状態を示し
た平面図である。
FIG. 5 is a plan view showing a state in which a substrate having a smaller diameter is positioned.

【図6】従来装置の平面図である。FIG. 6 is a plan view of a conventional device.

【図7】従来装置の側面図である。FIG. 7 is a side view of a conventional device.

【符号の説明】[Explanation of symbols]

1…基板整合部材 2…当接ピン 3…嵌合整合板 7…当接部 1 ... Board matching member 2 ... Contact pin 3 ... Fitting matching plate 7 ... Contact part

Claims (1)

【特許請求の範囲】 【請求項1】 相対的に一定距離だけ接近離反移動する
一対の基板整合部材の上面にそれぞれ複数個の当接ピン
を突設し、前記両基板整合部材が相対的に接近移動して
前記各当接ピンが基板の外周縁に当接することにより、
基板の位置決めを行う基板の位置決め装置において、 前記両基板整合部材上の当接ピン群は、位置決めされる
最大径の基板形状に対応した位置にそれぞれ設けられて
おり、かつ両基板整合部材上に少なくとも2つの当接ピ
ンによって位置決め嵌合される嵌合整合板をそれぞれ取
外し可能に搭載し、前記両嵌合整合板に前記最大径の基
板よりも小径の基板の外周縁に当接する複数個の当接部
を設けたことを特徴とする基板の位置決め装置。
Claim: What is claimed is: 1. A plurality of abutting pins are provided on the upper surfaces of a pair of substrate matching members that relatively move toward and away from each other by a fixed distance, and the two substrate matching members are relatively arranged. By approaching and contacting the contact pins with the outer peripheral edge of the substrate,
In the board positioning device for positioning the board, the contact pin groups on the board matching members are respectively provided at positions corresponding to the shape of the board having the largest diameter to be positioned, and on the board matching members. A plurality of fitting matching plates that are positionally fitted by at least two abutting pins are removably mounted, and a plurality of abutting matching plates that come into contact with the outer peripheral edge of a substrate having a diameter smaller than the substrate having the largest diameter are provided. A board positioning device comprising a contact portion.
JP20327091A 1991-07-18 1991-07-18 Substrate positioning device Expired - Fee Related JP2573759B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20327091A JP2573759B2 (en) 1991-07-18 1991-07-18 Substrate positioning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20327091A JP2573759B2 (en) 1991-07-18 1991-07-18 Substrate positioning device

Publications (2)

Publication Number Publication Date
JPH0529445A true JPH0529445A (en) 1993-02-05
JP2573759B2 JP2573759B2 (en) 1997-01-22

Family

ID=16471268

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20327091A Expired - Fee Related JP2573759B2 (en) 1991-07-18 1991-07-18 Substrate positioning device

Country Status (1)

Country Link
JP (1) JP2573759B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340300A (en) * 1998-05-27 1999-12-10 Shinko Electric Co Ltd Stage for mounting wafer-housing container
JP2011525717A (en) * 2008-06-24 2011-09-22 アプライド マテリアルズ インコーポレイテッド Large foot lift pin
JP2013056390A (en) * 2011-09-08 2013-03-28 Yaskawa Electric Corp Robot hand and robot
JP2015095542A (en) * 2013-11-12 2015-05-18 株式会社ディスコ Positioning table

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11340300A (en) * 1998-05-27 1999-12-10 Shinko Electric Co Ltd Stage for mounting wafer-housing container
JP2011525717A (en) * 2008-06-24 2011-09-22 アプライド マテリアルズ インコーポレイテッド Large foot lift pin
JP2013056390A (en) * 2011-09-08 2013-03-28 Yaskawa Electric Corp Robot hand and robot
JP2015095542A (en) * 2013-11-12 2015-05-18 株式会社ディスコ Positioning table

Also Published As

Publication number Publication date
JP2573759B2 (en) 1997-01-22

Similar Documents

Publication Publication Date Title
US8220685B1 (en) System for breaking a semiconductor wafer or other workpiece along a scribe line
US20070062889A1 (en) Universal cassette
JPH10501926A (en) Method of positioning a printed wiring board in a component placement machine and component placement machine for this method
JPH0529445A (en) Positioning apparatus for substrate
JPH02130103A (en) Dicing jig
US4907790A (en) Pellet-lifting apparatus
KR100564081B1 (en) Die pick-up method and die pick-up jig
JP4051422B2 (en) Substrate cutting method and substrate cutting apparatus
JPH03101119A (en) Substrate chuck mechanism
KR101578876B1 (en) robot hand for transferring glass
EP0361818A2 (en) Universal platen holddown apparatus
JPH06260409A (en) Heat-treating device
JPH10321654A (en) Bonding device for chip
JP2562147Y2 (en) Plate-like processed material holding device
JP3283827B2 (en) Positioning method and apparatus for flat precision parts
WO2009058096A1 (en) Device for supporting workpiece
JPS6367743A (en) Movable stage mechanism
JPH0217785Y2 (en)
JP2000006078A (en) Robot hand device
KR101323662B1 (en) Support plate used in subtrate processing appartus
CN218647904U (en) Substrate alignment device
JP4052701B2 (en) Nut welding equipment
JPH06254763A (en) Pressure head for plane polishing device
KR102600430B1 (en) Substrate Holding Apparatus
JP2548234Y2 (en) Can guide member mounting device

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees