TWI268265B - Glass substrate cassette - Google Patents

Glass substrate cassette

Info

Publication number
TWI268265B
TWI268265B TW093124413A TW93124413A TWI268265B TW I268265 B TWI268265 B TW I268265B TW 093124413 A TW093124413 A TW 093124413A TW 93124413 A TW93124413 A TW 93124413A TW I268265 B TWI268265 B TW I268265B
Authority
TW
Taiwan
Prior art keywords
glass substrate
substrate cassette
support plates
pair
side supports
Prior art date
Application number
TW093124413A
Other languages
Chinese (zh)
Other versions
TW200606081A (en
Inventor
Shiang-Chiang Liu
Original Assignee
Au Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW093124413A priority Critical patent/TWI268265B/en
Priority to US11/092,767 priority patent/US7334691B2/en
Priority to JP2005175698A priority patent/JP2006054429A/en
Publication of TW200606081A publication Critical patent/TW200606081A/en
Application granted granted Critical
Publication of TWI268265B publication Critical patent/TWI268265B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

A glass substrate cassette includes a bottom structure, a top structure, and a pair of side supports affixed to the bottom structure and the top structure. A plurality of support plates horizontally affixed to the pair of side supports. The support plates are formed with corrugated structure for supporting a glass structure. The corrugated structure of the support plates has recess portions for allowing a delivering device to load and unload a glass substrate.
TW093124413A 2004-08-13 2004-08-13 Glass substrate cassette TWI268265B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW093124413A TWI268265B (en) 2004-08-13 2004-08-13 Glass substrate cassette
US11/092,767 US7334691B2 (en) 2004-08-13 2005-03-30 Glass substrate cassette
JP2005175698A JP2006054429A (en) 2004-08-13 2005-06-15 Cassette for glass substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093124413A TWI268265B (en) 2004-08-13 2004-08-13 Glass substrate cassette

Publications (2)

Publication Number Publication Date
TW200606081A TW200606081A (en) 2006-02-16
TWI268265B true TWI268265B (en) 2006-12-11

Family

ID=35798996

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124413A TWI268265B (en) 2004-08-13 2004-08-13 Glass substrate cassette

Country Status (3)

Country Link
US (1) US7334691B2 (en)
JP (1) JP2006054429A (en)
TW (1) TWI268265B (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100973816B1 (en) * 2003-12-23 2010-08-03 삼성전자주식회사 Cassette for a large glass substrate
JP2006293257A (en) * 2005-04-08 2006-10-26 Samsung Electronics Co Ltd Glass cassette for loading glass substrate of display panel
JP4523513B2 (en) * 2005-08-05 2010-08-11 東京エレクトロン株式会社 Substrate delivery apparatus, substrate delivery method and storage medium
US8240490B2 (en) * 2006-01-11 2012-08-14 Mohammad Ghassem Malekmadani Anti-vibration rack, mount and feet for computer servers
JP2007281252A (en) * 2006-04-07 2007-10-25 E I Du Pont De Nemours & Co Substrate cassette
CN100388074C (en) * 2006-06-07 2008-05-14 友达光电股份有限公司 Substrate loading device
JP2008010606A (en) * 2006-06-29 2008-01-17 Nec Lcd Technologies Ltd Substrate cassette holding device, and substrate cassette holding and storing method thereof
JP4564570B2 (en) * 2009-03-10 2010-10-20 三井造船株式会社 Atomic layer deposition equipment
CN102487109A (en) * 2009-12-22 2012-06-06 无锡尚德太阳能电力有限公司 Horizontal graphite boat
DE102010040918B4 (en) * 2010-09-16 2013-10-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Container for stacking and transporting discs of brittle material
US8544651B2 (en) * 2012-01-20 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer transfer pod for reducing wafer particulate contamination
CN103258776B (en) * 2012-02-17 2017-07-11 诺发系统公司 The mass damper of end effector is loaded and unloaded for semiconductor wafer
CN102765557B (en) * 2012-07-31 2014-07-09 深圳市华星光电技术有限公司 Glass substrate cassette and picking and placing system of glass substrates
CN103057945B (en) * 2012-08-08 2015-07-15 深圳市华星光电技术有限公司 Storage device of multilayer substrates
US9144901B2 (en) 2012-08-08 2015-09-29 Weibing Yang Storage device for multilayer substrate
US8997996B2 (en) * 2013-03-18 2015-04-07 Shenzhen China Star Optoelectronics Technology Co., Ltd. Drawer type cushioning packaging device for liquid crystal glass
KR101363872B1 (en) * 2013-06-25 2014-02-19 주식회사 신우수출포장 Packing box for solar battery module
US11315815B2 (en) * 2016-01-05 2022-04-26 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer container and method for holding wafer
CN205608389U (en) * 2016-05-11 2016-09-28 重庆京东方光电科技有限公司 Memory device and be equipped with this memory device's rubber coating developing machine
CN107010417B (en) 2017-03-20 2020-03-06 京东方科技集团股份有限公司 Storage device for display screen substrate and control method for taking and placing display screen substrate
CN107878874A (en) * 2017-09-16 2018-04-06 合肥惠科金扬科技有限公司 A kind of processing technology of the panel support mechanism of liquid crystal panel tote cart
CN107878537A (en) * 2017-09-16 2018-04-06 合肥惠科金扬科技有限公司 A kind of panel support mechanism of liquid crystal panel tote cart
CN107640200A (en) * 2017-09-16 2018-01-30 合肥惠科金扬科技有限公司 A kind of liquid crystal panel tote cart
CN107651275A (en) * 2017-09-16 2018-02-02 合肥惠科金扬科技有限公司 A kind of manufacture method of the supporting part of substrate tray
CN109693860B (en) * 2017-10-23 2020-12-22 合肥欣奕华智能机器有限公司 Substrate caching device
JP7123010B2 (en) * 2019-06-25 2022-08-22 株式会社岩崎製作所 Plate-like object support device
JP7048012B2 (en) * 2020-09-16 2022-04-05 エスゼット ディージェイアイ テクノロジー カンパニー リミテッド Control device, image pickup device, control method, and program
JP2022117671A (en) * 2021-02-01 2022-08-12 東京エレクトロン株式会社 Storage container and processing system
CN113401685A (en) * 2021-06-03 2021-09-17 河北光兴半导体技术有限公司 Inserting frame system for glass plates

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2746667A (en) * 1953-08-17 1956-05-22 Custom Made Container Corp Shipping container with cushioning liner
US3923156A (en) * 1974-04-29 1975-12-02 Fluoroware Inc Wafer basket
US4155447A (en) * 1978-02-27 1979-05-22 Multi-Tool & Manufacturing Inc. Integrated circuit board carrier
US4721207A (en) * 1986-04-28 1988-01-26 Tensho Electric Industrial Co., Ltd. Hard disk container
US4930634A (en) * 1987-09-29 1990-06-05 Fluoroware, Inc. Carrier for flat panel displays
KR0135049B1 (en) * 1994-05-31 1998-04-20 양승택 Wafer cassette for semiconductor fabrication
KR100188137B1 (en) 1995-09-07 1999-06-01 김광호 Cassette for lcd glass
US5853214A (en) * 1995-11-27 1998-12-29 Progressive System Technologies, Inc. Aligner for a substrate carrier
US5823361A (en) * 1996-02-06 1998-10-20 Progressive System Technologies, Inc. Substrate support apparatus for a substrate housing
JPH10203584A (en) * 1997-01-22 1998-08-04 Nec Corp Cassette for substrate
US6145673A (en) * 1999-03-31 2000-11-14 Applied Materials, Inc. Wafer transfer cassette
TW522448B (en) * 2001-10-22 2003-03-01 Advanced Semiconductor Eng Semiconductor wafer carrying apparatus
KR100870661B1 (en) * 2002-03-15 2008-11-26 엘지디스플레이 주식회사 Cassette for accepting substrate
KR100675627B1 (en) * 2002-10-10 2007-02-01 엘지.필립스 엘시디 주식회사 Cassette for accepting substrate

Also Published As

Publication number Publication date
US20060032826A1 (en) 2006-02-16
JP2006054429A (en) 2006-02-23
US7334691B2 (en) 2008-02-26
TW200606081A (en) 2006-02-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees