TW424073B - Apparatus and method for transporting substrates - Google Patents

Apparatus and method for transporting substrates Download PDF

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Publication number
TW424073B
TW424073B TW087118241A TW87118241A TW424073B TW 424073 B TW424073 B TW 424073B TW 087118241 A TW087118241 A TW 087118241A TW 87118241 A TW87118241 A TW 87118241A TW 424073 B TW424073 B TW 424073B
Authority
TW
Taiwan
Prior art keywords
substrate
complete
robot
wait
load lock
Prior art date
Application number
TW087118241A
Other languages
English (en)
Chinese (zh)
Inventor
Ruth Ann Hendrickson
Der Meulen Peter Van
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Application granted granted Critical
Publication of TW424073B publication Critical patent/TW424073B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G65/00—Loading or unloading
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
TW087118241A 1997-12-01 1998-11-03 Apparatus and method for transporting substrates TW424073B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US6703697P 1997-12-01 1997-12-01
US09/089,752 US6257827B1 (en) 1997-12-01 1998-06-02 Apparatus and method for transporting substrates

Publications (1)

Publication Number Publication Date
TW424073B true TW424073B (en) 2001-03-01

Family

ID=26747423

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087118241A TW424073B (en) 1997-12-01 1998-11-03 Apparatus and method for transporting substrates

Country Status (7)

Country Link
US (1) US6257827B1 (https=)
EP (1) EP1051342A1 (https=)
JP (2) JP5046435B2 (https=)
KR (1) KR20010032641A (https=)
AU (1) AU1109599A (https=)
TW (1) TW424073B (https=)
WO (1) WO1999028222A1 (https=)

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TWI786329B (zh) * 2018-09-18 2022-12-11 美商應用材料股份有限公司 電腦可讀媒體、處理多個基板的方法及用於處理多個基板的系統

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI786329B (zh) * 2018-09-18 2022-12-11 美商應用材料股份有限公司 電腦可讀媒體、處理多個基板的方法及用於處理多個基板的系統
TWI798148B (zh) * 2018-09-18 2023-04-01 美商應用材料股份有限公司 電腦可讀媒體、處理多個基板的方法及用於處理多個基板的系統
TWI815776B (zh) * 2018-09-18 2023-09-11 美商應用材料股份有限公司 電腦可讀媒體、處理多個基板的方法及用於處理多個基板的系統

Also Published As

Publication number Publication date
JP5046435B2 (ja) 2012-10-10
US6257827B1 (en) 2001-07-10
AU1109599A (en) 1999-06-16
EP1051342A1 (en) 2000-11-15
JP5543318B2 (ja) 2014-07-09
JP2001524763A (ja) 2001-12-04
KR20010032641A (ko) 2001-04-25
JP2011049585A (ja) 2011-03-10
WO1999028222A1 (en) 1999-06-10

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