JP5046435B2 - 基板搬送装置及び方法 - Google Patents

基板搬送装置及び方法 Download PDF

Info

Publication number
JP5046435B2
JP5046435B2 JP2000523138A JP2000523138A JP5046435B2 JP 5046435 B2 JP5046435 B2 JP 5046435B2 JP 2000523138 A JP2000523138 A JP 2000523138A JP 2000523138 A JP2000523138 A JP 2000523138A JP 5046435 B2 JP5046435 B2 JP 5046435B2
Authority
JP
Japan
Prior art keywords
wafer
lock
shelf
processing module
insert
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000523138A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001524763A (ja
JP2001524763A5 (https=
Inventor
ルース アン ヘンドリックソン
デール ミュレン ピーター ヴァン
Original Assignee
ブルックス オートメーション インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ブルックス オートメーション インコーポレイテッド filed Critical ブルックス オートメーション インコーポレイテッド
Publication of JP2001524763A publication Critical patent/JP2001524763A/ja
Publication of JP2001524763A5 publication Critical patent/JP2001524763A5/ja
Application granted granted Critical
Publication of JP5046435B2 publication Critical patent/JP5046435B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G65/00—Loading or unloading
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2000523138A 1997-12-01 1998-10-21 基板搬送装置及び方法 Expired - Lifetime JP5046435B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US6703697P 1997-12-01 1997-12-01
US60/067,036 1997-12-01
US09/089,752 US6257827B1 (en) 1997-12-01 1998-06-02 Apparatus and method for transporting substrates
US09/089,752 1998-06-02
PCT/US1998/022240 WO1999028222A1 (en) 1997-12-01 1998-10-21 Apparatus and method for transporting substrates

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010244420A Division JP5543318B2 (ja) 1997-12-01 2010-10-29 基板搬送方法

Publications (3)

Publication Number Publication Date
JP2001524763A JP2001524763A (ja) 2001-12-04
JP2001524763A5 JP2001524763A5 (https=) 2010-04-15
JP5046435B2 true JP5046435B2 (ja) 2012-10-10

Family

ID=26747423

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2000523138A Expired - Lifetime JP5046435B2 (ja) 1997-12-01 1998-10-21 基板搬送装置及び方法
JP2010244420A Expired - Lifetime JP5543318B2 (ja) 1997-12-01 2010-10-29 基板搬送方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010244420A Expired - Lifetime JP5543318B2 (ja) 1997-12-01 2010-10-29 基板搬送方法

Country Status (7)

Country Link
US (1) US6257827B1 (https=)
EP (1) EP1051342A1 (https=)
JP (2) JP5046435B2 (https=)
KR (1) KR20010032641A (https=)
AU (1) AU1109599A (https=)
TW (1) TW424073B (https=)
WO (1) WO1999028222A1 (https=)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
JPH11204411A (ja) * 1998-01-19 1999-07-30 Nikon Corp 塗布現像露光装置
WO2000028587A1 (en) * 1998-11-09 2000-05-18 Tokyo Electron Limited Processing device
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US6322312B1 (en) 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
JP4248695B2 (ja) * 1999-07-26 2009-04-02 東京エレクトロン株式会社 ウェハ移載装置の緊急停止装置
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6379095B1 (en) * 2000-04-14 2002-04-30 Applied Materials, Inc. Robot for handling semiconductor wafers
US6582175B2 (en) 2000-04-14 2003-06-24 Applied Materials, Inc. Robot for handling semiconductor wafers
EP1174910A3 (en) * 2000-07-20 2010-01-06 Applied Materials, Inc. Method and apparatus for dechucking a substrate
US6578893B2 (en) 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
US6451118B1 (en) * 2000-11-14 2002-09-17 Anon, Inc. Cluster tool architecture for sulfur trioxide processing
US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
US6528767B2 (en) 2001-05-22 2003-03-04 Applied Materials, Inc. Pre-heating and load lock pedestal material for high temperature CVD liquid crystal and flat panel display applications
JP4821074B2 (ja) * 2001-08-31 2011-11-24 東京エレクトロン株式会社 処理システム
US6634686B2 (en) 2001-10-03 2003-10-21 Applied Materials, Inc. End effector assembly
US6835039B2 (en) * 2002-03-15 2004-12-28 Asm International N.V. Method and apparatus for batch processing of wafers in a furnace
WO2004001817A1 (en) * 2002-06-21 2003-12-31 Applied Materials, Inc. Transfer chamber for vacuum processing system
US7204669B2 (en) 2002-07-17 2007-04-17 Applied Materials, Inc. Semiconductor substrate damage protection system
US6696367B1 (en) * 2002-09-27 2004-02-24 Asm America, Inc. System for the improved handling of wafers within a process tool
US20040096636A1 (en) * 2002-11-18 2004-05-20 Applied Materials, Inc. Lifting glass substrate without center lift pins
US6852644B2 (en) * 2002-11-25 2005-02-08 The Boc Group, Inc. Atmospheric robot handling equipment
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
US6917755B2 (en) * 2003-02-27 2005-07-12 Applied Materials, Inc. Substrate support
US20040226513A1 (en) * 2003-05-12 2004-11-18 Applied Materials, Inc. Chamber for uniform heating of large area substrates
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
KR100578134B1 (ko) * 2003-11-10 2006-05-10 삼성전자주식회사 멀티 챔버 시스템
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20050223837A1 (en) 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
US8033245B2 (en) * 2004-02-12 2011-10-11 Applied Materials, Inc. Substrate support bushing
JP4128973B2 (ja) * 2004-03-30 2008-07-30 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理方法
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
CN103199039B (zh) * 2004-06-02 2016-01-13 应用材料公司 电子装置制造室及其形成方法
US20060005770A1 (en) * 2004-07-09 2006-01-12 Robin Tiner Independently moving substrate supports
KR100805397B1 (ko) * 2004-08-17 2008-02-20 맷슨 테크놀로지, 인크. 웨이퍼 가공 장치 및 그 구성 방법
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US20060130767A1 (en) * 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
WO2007047163A2 (en) * 2005-10-04 2007-04-26 Applied Materials, Inc. Methods and apparatus for drying a substrate
US20080308884A1 (en) * 2005-10-13 2008-12-18 Silex Microsystems Ab Fabrication of Inlet and Outlet Connections for Microfluidic Chips
KR100781082B1 (ko) * 2005-12-03 2007-11-30 주식회사 뉴파워 프라즈마 기판 반송 장치 및 그것을 사용한 기판 처리 설비
US9117859B2 (en) * 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
JP4746003B2 (ja) * 2007-05-07 2011-08-10 リンテック株式会社 移載装置及び移載方法
JP5253933B2 (ja) * 2008-09-04 2013-07-31 東京エレクトロン株式会社 成膜装置、基板処理装置、成膜方法及び記憶媒体
CN103917466B (zh) * 2011-09-14 2019-01-04 布鲁克斯自动化公司 装载工位
US9673071B2 (en) * 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
US11037838B2 (en) * 2018-09-18 2021-06-15 Applied Materials, Inc. In-situ integrated chambers

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4801241A (en) * 1984-03-09 1989-01-31 Tegal Corporation Modular article processing machine and method of article handling therein
JPS6218037A (ja) * 1985-07-17 1987-01-27 Wakomu:Kk パススル−ル−ム
US4915564A (en) * 1986-04-04 1990-04-10 Materials Research Corporation Method and apparatus for handling and processing wafer-like materials
US4836733A (en) * 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
KR100309932B1 (ko) * 1986-04-28 2001-12-15 제임스 엠. 윌리암스 웨이퍼 운반 장치 및 방법
US4851101A (en) * 1987-09-18 1989-07-25 Varian Associates, Inc. Sputter module for modular wafer processing machine
US5310410A (en) * 1990-04-06 1994-05-10 Sputtered Films, Inc. Method for processing semi-conductor wafers in a multiple vacuum and non-vacuum chamber apparatus
US5399531A (en) * 1990-12-17 1995-03-21 United Micrpelectronics Corporation Single semiconductor wafer transfer method and plural processing station manufacturing system
JP3238432B2 (ja) * 1991-08-27 2001-12-17 東芝機械株式会社 マルチチャンバ型枚葉処理装置
JP2867194B2 (ja) * 1992-02-05 1999-03-08 東京エレクトロン株式会社 処理装置及び処理方法
JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
JP3005373B2 (ja) * 1992-10-23 2000-01-31 東京エレクトロン株式会社 処理装置
KR100261532B1 (ko) * 1993-03-14 2000-07-15 야마시타 히데나리 피처리체 반송장치를 가지는 멀티챔버 시스템
JP3522796B2 (ja) * 1993-07-15 2004-04-26 株式会社日立国際電気 半導体製造装置
JP3654597B2 (ja) * 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
JP3181455B2 (ja) * 1993-11-20 2001-07-03 東京エレクトロン株式会社 搬送アーム装置及びこれを用いた処理室集合装置
DE4340522A1 (de) * 1993-11-29 1995-06-01 Leybold Ag Vorrichtung und Verfahren zum schrittweisen und automatischen Be- und Entladen einer Beschichtungsanlage
JP2994553B2 (ja) * 1994-04-08 1999-12-27 大日本スクリーン製造株式会社 基板処理装置
US5486080A (en) * 1994-06-30 1996-01-23 Diamond Semiconductor Group, Inc. High speed movement of workpieces in vacuum processing
US5655060A (en) * 1995-03-31 1997-08-05 Brooks Automation Time optimal trajectory for cluster tool robots
JP3288200B2 (ja) * 1995-06-09 2002-06-04 東京エレクトロン株式会社 真空処理装置
JPH098094A (ja) * 1995-06-21 1997-01-10 Shibaura Eng Works Co Ltd 真空処理装置
TW309503B (https=) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
JPH09115985A (ja) * 1995-10-24 1997-05-02 Toshiba Mach Co Ltd ウエハトランスファチャンバ及びウエハの予熱方法
JP2857097B2 (ja) * 1996-03-29 1999-02-10 芝浦メカトロニクス株式会社 真空処理装置
US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
US5975740A (en) * 1996-05-28 1999-11-02 Applied Materials, Inc. Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme
US5900105A (en) * 1996-07-09 1999-05-04 Gamma Precision Technology, Inc. Wafer transfer system and method of using the same
JP3632812B2 (ja) * 1997-10-24 2005-03-23 シャープ株式会社 基板搬送移載装置

Also Published As

Publication number Publication date
US6257827B1 (en) 2001-07-10
AU1109599A (en) 1999-06-16
EP1051342A1 (en) 2000-11-15
JP5543318B2 (ja) 2014-07-09
JP2001524763A (ja) 2001-12-04
KR20010032641A (ko) 2001-04-25
JP2011049585A (ja) 2011-03-10
TW424073B (en) 2001-03-01
WO1999028222A1 (en) 1999-06-10

Similar Documents

Publication Publication Date Title
JP5046435B2 (ja) 基板搬送装置及び方法
JP5212165B2 (ja) 基板処理装置
EP1094921B1 (en) Transferring substrates with different holding end effectors
KR100235917B1 (ko) 진공처리장치
US6431807B1 (en) Wafer processing architecture including single-wafer load lock with cooling unit
US20090259335A1 (en) Substrate Processing System
US7704031B2 (en) Substrate processing apparatus
KR101106803B1 (ko) 반도체 웨이퍼 처리용 반도체 제조 시스템, 대기중 로봇핸들링 장비 및 반도체 웨이퍼의 반송 방법
CN113782466A (zh) 高吞吐量、多室衬底处理系统
JP5610009B2 (ja) 基板処理装置
US20260068590A1 (en) Substrate processing apparatus and method of manufacturing semiconductor device
CN118412299B (zh) 基板处理系统
KR20050034139A (ko) 기판세정장치 및 그 방법
KR100521401B1 (ko) 기판세정시스템
WO2023129544A1 (en) Four or cassette storage for hybrid substrate bonding system
JPH04298059A (ja) 真空処理装置
US20260107736A1 (en) Interface module, method of operating the same, and substrate processing apparatus
US20250164898A1 (en) Storage and transfer module and substrate treatment apparatus including storage and transfer module
KR100625308B1 (ko) 기판세정장치
US6881914B2 (en) Apparatus and method for handling, storing and reloading carriers for disk-shaped items, such as semiconductor wafers or CDs
JP2002043389A (ja) 基板処理装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050823

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080520

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20080811

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080818

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081120

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090113

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090406

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090413

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20090713

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090901

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20091124

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20091201

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20100301

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100629

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20101029

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20101108

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20110121

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20110623

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20110628

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20120305

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20120308

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120606

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120717

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150727

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term