KR20010032641A - 기판이송장치 및 방법 - Google Patents

기판이송장치 및 방법 Download PDF

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Publication number
KR20010032641A
KR20010032641A KR1020007005919A KR20007005919A KR20010032641A KR 20010032641 A KR20010032641 A KR 20010032641A KR 1020007005919 A KR1020007005919 A KR 1020007005919A KR 20007005919 A KR20007005919 A KR 20007005919A KR 20010032641 A KR20010032641 A KR 20010032641A
Authority
KR
South Korea
Prior art keywords
substrate
wait
complete
load lock
robot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020007005919A
Other languages
English (en)
Korean (ko)
Inventor
루스앤 헨드릭슨
피터 반데르뮤렌
Original Assignee
스탠리 디. 피에코스
브룩스 오토메이션 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스탠리 디. 피에코스, 브룩스 오토메이션 인코퍼레이티드 filed Critical 스탠리 디. 피에코스
Publication of KR20010032641A publication Critical patent/KR20010032641A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G65/00—Loading or unloading
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
KR1020007005919A 1997-12-01 1998-10-21 기판이송장치 및 방법 Withdrawn KR20010032641A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US6703697P 1997-12-01 1997-12-01
US60/067,036 1997-12-01
US09/089,752 US6257827B1 (en) 1997-12-01 1998-06-02 Apparatus and method for transporting substrates
US9/089,752 1998-06-02
PCT/US1998/022240 WO1999028222A1 (en) 1997-12-01 1998-10-21 Apparatus and method for transporting substrates

Publications (1)

Publication Number Publication Date
KR20010032641A true KR20010032641A (ko) 2001-04-25

Family

ID=26747423

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007005919A Withdrawn KR20010032641A (ko) 1997-12-01 1998-10-21 기판이송장치 및 방법

Country Status (7)

Country Link
US (1) US6257827B1 (https=)
EP (1) EP1051342A1 (https=)
JP (2) JP5046435B2 (https=)
KR (1) KR20010032641A (https=)
AU (1) AU1109599A (https=)
TW (1) TW424073B (https=)
WO (1) WO1999028222A1 (https=)

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KR100781082B1 (ko) * 2005-12-03 2007-11-30 주식회사 뉴파워 프라즈마 기판 반송 장치 및 그것을 사용한 기판 처리 설비
KR100972346B1 (ko) * 2002-03-15 2010-07-26 에이에스엠 인터내셔널 엔.브이. 퍼니스 내에서 웨이퍼의 배치처리를 위한 방법 및 장치
KR101535683B1 (ko) * 2008-09-04 2015-07-09 도쿄엘렉트론가부시키가이샤 성막 장치, 기판 처리 장치, 성막 방법 및 기억 매체

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TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US6322312B1 (en) 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
JP4248695B2 (ja) * 1999-07-26 2009-04-02 東京エレクトロン株式会社 ウェハ移載装置の緊急停止装置
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6379095B1 (en) * 2000-04-14 2002-04-30 Applied Materials, Inc. Robot for handling semiconductor wafers
US6582175B2 (en) 2000-04-14 2003-06-24 Applied Materials, Inc. Robot for handling semiconductor wafers
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US6578893B2 (en) 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
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US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
US6528767B2 (en) 2001-05-22 2003-03-04 Applied Materials, Inc. Pre-heating and load lock pedestal material for high temperature CVD liquid crystal and flat panel display applications
JP4821074B2 (ja) * 2001-08-31 2011-11-24 東京エレクトロン株式会社 処理システム
US6634686B2 (en) 2001-10-03 2003-10-21 Applied Materials, Inc. End effector assembly
WO2004001817A1 (en) * 2002-06-21 2003-12-31 Applied Materials, Inc. Transfer chamber for vacuum processing system
US7204669B2 (en) 2002-07-17 2007-04-17 Applied Materials, Inc. Semiconductor substrate damage protection system
US6696367B1 (en) * 2002-09-27 2004-02-24 Asm America, Inc. System for the improved handling of wafers within a process tool
US20040096636A1 (en) * 2002-11-18 2004-05-20 Applied Materials, Inc. Lifting glass substrate without center lift pins
US6852644B2 (en) * 2002-11-25 2005-02-08 The Boc Group, Inc. Atmospheric robot handling equipment
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
US6917755B2 (en) * 2003-02-27 2005-07-12 Applied Materials, Inc. Substrate support
US20040226513A1 (en) * 2003-05-12 2004-11-18 Applied Materials, Inc. Chamber for uniform heating of large area substrates
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
KR100578134B1 (ko) * 2003-11-10 2006-05-10 삼성전자주식회사 멀티 챔버 시스템
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20050223837A1 (en) 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
US8033245B2 (en) * 2004-02-12 2011-10-11 Applied Materials, Inc. Substrate support bushing
JP4128973B2 (ja) * 2004-03-30 2008-07-30 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理方法
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
CN103199039B (zh) * 2004-06-02 2016-01-13 应用材料公司 电子装置制造室及其形成方法
US20060005770A1 (en) * 2004-07-09 2006-01-12 Robin Tiner Independently moving substrate supports
KR100805397B1 (ko) * 2004-08-17 2008-02-20 맷슨 테크놀로지, 인크. 웨이퍼 가공 장치 및 그 구성 방법
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US20060130767A1 (en) * 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
WO2007047163A2 (en) * 2005-10-04 2007-04-26 Applied Materials, Inc. Methods and apparatus for drying a substrate
US20080308884A1 (en) * 2005-10-13 2008-12-18 Silex Microsystems Ab Fabrication of Inlet and Outlet Connections for Microfluidic Chips
US9117859B2 (en) * 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
JP4746003B2 (ja) * 2007-05-07 2011-08-10 リンテック株式会社 移載装置及び移載方法
CN103917466B (zh) * 2011-09-14 2019-01-04 布鲁克斯自动化公司 装载工位
US9673071B2 (en) * 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
US11037838B2 (en) * 2018-09-18 2021-06-15 Applied Materials, Inc. In-situ integrated chambers

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100972346B1 (ko) * 2002-03-15 2010-07-26 에이에스엠 인터내셔널 엔.브이. 퍼니스 내에서 웨이퍼의 배치처리를 위한 방법 및 장치
KR100781082B1 (ko) * 2005-12-03 2007-11-30 주식회사 뉴파워 프라즈마 기판 반송 장치 및 그것을 사용한 기판 처리 설비
KR101535683B1 (ko) * 2008-09-04 2015-07-09 도쿄엘렉트론가부시키가이샤 성막 장치, 기판 처리 장치, 성막 방법 및 기억 매체

Also Published As

Publication number Publication date
JP5046435B2 (ja) 2012-10-10
US6257827B1 (en) 2001-07-10
AU1109599A (en) 1999-06-16
EP1051342A1 (en) 2000-11-15
JP5543318B2 (ja) 2014-07-09
JP2001524763A (ja) 2001-12-04
JP2011049585A (ja) 2011-03-10
TW424073B (en) 2001-03-01
WO1999028222A1 (en) 1999-06-10

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Legal Events

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PA0105 International application

Patent event date: 20000531

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20031021

PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid