AU1109599A - Apparatus and method for transporting substrates - Google Patents

Apparatus and method for transporting substrates

Info

Publication number
AU1109599A
AU1109599A AU11095/99A AU1109599A AU1109599A AU 1109599 A AU1109599 A AU 1109599A AU 11095/99 A AU11095/99 A AU 11095/99A AU 1109599 A AU1109599 A AU 1109599A AU 1109599 A AU1109599 A AU 1109599A
Authority
AU
Australia
Prior art keywords
transporting substrates
transporting
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU11095/99A
Other languages
English (en)
Inventor
Ruth Ann Hendrickson
Peter Van Der Meulen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Publication of AU1109599A publication Critical patent/AU1109599A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G65/00—Loading or unloading
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
AU11095/99A 1997-12-01 1998-10-21 Apparatus and method for transporting substrates Abandoned AU1109599A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US6703697P 1997-12-01 1997-12-01
US60067036 1997-12-01
US09089752 1998-06-02
US09/089,752 US6257827B1 (en) 1997-12-01 1998-06-02 Apparatus and method for transporting substrates
PCT/US1998/022240 WO1999028222A1 (en) 1997-12-01 1998-10-21 Apparatus and method for transporting substrates

Publications (1)

Publication Number Publication Date
AU1109599A true AU1109599A (en) 1999-06-16

Family

ID=26747423

Family Applications (1)

Application Number Title Priority Date Filing Date
AU11095/99A Abandoned AU1109599A (en) 1997-12-01 1998-10-21 Apparatus and method for transporting substrates

Country Status (7)

Country Link
US (1) US6257827B1 (https=)
EP (1) EP1051342A1 (https=)
JP (2) JP5046435B2 (https=)
KR (1) KR20010032641A (https=)
AU (1) AU1109599A (https=)
TW (1) TW424073B (https=)
WO (1) WO1999028222A1 (https=)

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JPH11204411A (ja) * 1998-01-19 1999-07-30 Nikon Corp 塗布現像露光装置
WO2000028587A1 (en) * 1998-11-09 2000-05-18 Tokyo Electron Limited Processing device
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US6322312B1 (en) 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
JP4248695B2 (ja) * 1999-07-26 2009-04-02 東京エレクトロン株式会社 ウェハ移載装置の緊急停止装置
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6379095B1 (en) * 2000-04-14 2002-04-30 Applied Materials, Inc. Robot for handling semiconductor wafers
US6582175B2 (en) 2000-04-14 2003-06-24 Applied Materials, Inc. Robot for handling semiconductor wafers
EP1174910A3 (en) * 2000-07-20 2010-01-06 Applied Materials, Inc. Method and apparatus for dechucking a substrate
US6578893B2 (en) 2000-10-02 2003-06-17 Ajs Automation, Inc. Apparatus and methods for handling semiconductor wafers
US6451118B1 (en) * 2000-11-14 2002-09-17 Anon, Inc. Cluster tool architecture for sulfur trioxide processing
US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
US6528767B2 (en) 2001-05-22 2003-03-04 Applied Materials, Inc. Pre-heating and load lock pedestal material for high temperature CVD liquid crystal and flat panel display applications
JP4821074B2 (ja) * 2001-08-31 2011-11-24 東京エレクトロン株式会社 処理システム
US6634686B2 (en) 2001-10-03 2003-10-21 Applied Materials, Inc. End effector assembly
US6835039B2 (en) * 2002-03-15 2004-12-28 Asm International N.V. Method and apparatus for batch processing of wafers in a furnace
WO2004001817A1 (en) * 2002-06-21 2003-12-31 Applied Materials, Inc. Transfer chamber for vacuum processing system
US7204669B2 (en) 2002-07-17 2007-04-17 Applied Materials, Inc. Semiconductor substrate damage protection system
US6696367B1 (en) * 2002-09-27 2004-02-24 Asm America, Inc. System for the improved handling of wafers within a process tool
US20040096636A1 (en) * 2002-11-18 2004-05-20 Applied Materials, Inc. Lifting glass substrate without center lift pins
US6852644B2 (en) * 2002-11-25 2005-02-08 The Boc Group, Inc. Atmospheric robot handling equipment
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
US6917755B2 (en) * 2003-02-27 2005-07-12 Applied Materials, Inc. Substrate support
US20040226513A1 (en) * 2003-05-12 2004-11-18 Applied Materials, Inc. Chamber for uniform heating of large area substrates
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
KR100578134B1 (ko) * 2003-11-10 2006-05-10 삼성전자주식회사 멀티 챔버 시스템
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20050223837A1 (en) 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
US8033245B2 (en) * 2004-02-12 2011-10-11 Applied Materials, Inc. Substrate support bushing
JP4128973B2 (ja) * 2004-03-30 2008-07-30 株式会社日立ハイテクノロジーズ 真空処理装置及び真空処理方法
US20060201074A1 (en) * 2004-06-02 2006-09-14 Shinichi Kurita Electronic device manufacturing chamber and methods of forming the same
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
CN103199039B (zh) * 2004-06-02 2016-01-13 应用材料公司 电子装置制造室及其形成方法
US20060005770A1 (en) * 2004-07-09 2006-01-12 Robin Tiner Independently moving substrate supports
KR100805397B1 (ko) * 2004-08-17 2008-02-20 맷슨 테크놀로지, 인크. 웨이퍼 가공 장치 및 그 구성 방법
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US20060130767A1 (en) * 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
WO2007047163A2 (en) * 2005-10-04 2007-04-26 Applied Materials, Inc. Methods and apparatus for drying a substrate
US20080308884A1 (en) * 2005-10-13 2008-12-18 Silex Microsystems Ab Fabrication of Inlet and Outlet Connections for Microfluidic Chips
KR100781082B1 (ko) * 2005-12-03 2007-11-30 주식회사 뉴파워 프라즈마 기판 반송 장치 및 그것을 사용한 기판 처리 설비
US9117859B2 (en) * 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
JP4746003B2 (ja) * 2007-05-07 2011-08-10 リンテック株式会社 移載装置及び移載方法
JP5253933B2 (ja) * 2008-09-04 2013-07-31 東京エレクトロン株式会社 成膜装置、基板処理装置、成膜方法及び記憶媒体
CN103917466B (zh) * 2011-09-14 2019-01-04 布鲁克斯自动化公司 装载工位
US9673071B2 (en) * 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
US11037838B2 (en) * 2018-09-18 2021-06-15 Applied Materials, Inc. In-situ integrated chambers

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JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
JP3005373B2 (ja) * 1992-10-23 2000-01-31 東京エレクトロン株式会社 処理装置
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JP3522796B2 (ja) * 1993-07-15 2004-04-26 株式会社日立国際電気 半導体製造装置
JP3654597B2 (ja) * 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
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JP2994553B2 (ja) * 1994-04-08 1999-12-27 大日本スクリーン製造株式会社 基板処理装置
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US5863170A (en) * 1996-04-16 1999-01-26 Gasonics International Modular process system
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JP3632812B2 (ja) * 1997-10-24 2005-03-23 シャープ株式会社 基板搬送移載装置

Also Published As

Publication number Publication date
JP5046435B2 (ja) 2012-10-10
US6257827B1 (en) 2001-07-10
EP1051342A1 (en) 2000-11-15
JP5543318B2 (ja) 2014-07-09
JP2001524763A (ja) 2001-12-04
KR20010032641A (ko) 2001-04-25
JP2011049585A (ja) 2011-03-10
TW424073B (en) 2001-03-01
WO1999028222A1 (en) 1999-06-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase