TW360898B - Semiconductor fabricating apparatus, method for modifying positional displacements of a wafer in a wafer cassette within the semiconductor fabricating apparatus and method for transferring the wafer cassette - Google Patents
Semiconductor fabricating apparatus, method for modifying positional displacements of a wafer in a wafer cassette within the semiconductor fabricating apparatus and method for transferring the wafer cassetteInfo
- Publication number
- TW360898B TW360898B TW085106968A TW85106968A TW360898B TW 360898 B TW360898 B TW 360898B TW 085106968 A TW085106968 A TW 085106968A TW 85106968 A TW85106968 A TW 85106968A TW 360898 B TW360898 B TW 360898B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- cassette
- cassettes
- fabricating apparatus
- semiconductor fabricating
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Control Of Conveyors (AREA)
- Attitude Control For Articles On Conveyors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17274295 | 1995-06-15 | ||
JP13286496A JP3478364B2 (ja) | 1995-06-15 | 1996-04-30 | 半導体製造装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW360898B true TW360898B (en) | 1999-06-11 |
Family
ID=26467328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085106968A TW360898B (en) | 1995-06-15 | 1996-06-10 | Semiconductor fabricating apparatus, method for modifying positional displacements of a wafer in a wafer cassette within the semiconductor fabricating apparatus and method for transferring the wafer cassette |
Country Status (4)
Country | Link |
---|---|
US (1) | US6318944B1 (zh) |
JP (1) | JP3478364B2 (zh) |
KR (1) | KR100266401B1 (zh) |
TW (1) | TW360898B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112830205A (zh) * | 2020-12-30 | 2021-05-25 | 壹米智汇工程技术研究院(北京)有限公司 | 油封码放设备及其工作方法 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL1008143C2 (nl) * | 1998-01-27 | 1999-07-28 | Asm Int | Stelsel voor het behandelen van wafers. |
KR100646906B1 (ko) * | 1998-09-22 | 2006-11-17 | 동경 엘렉트론 주식회사 | 기판처리장치 및 기판처리방법 |
JP3664897B2 (ja) * | 1998-11-18 | 2005-06-29 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
JP4519348B2 (ja) * | 2001-03-29 | 2010-08-04 | 東京エレクトロン株式会社 | 熱処理装置および熱処理方法 |
US6817823B2 (en) * | 2001-09-11 | 2004-11-16 | Marian Corporation | Method, device and system for semiconductor wafer transfer |
CN1608308A (zh) * | 2001-11-13 | 2005-04-20 | Fsi国际公司 | 微型电子基片的自动化加工用的减少占地的工具 |
FR2844258B1 (fr) * | 2002-09-06 | 2005-06-03 | Recif Sa | Systeme de transport et stockage de conteneurs de plaques de semi-conducteur, et mecanisme de transfert |
US20040080852A1 (en) * | 2002-10-18 | 2004-04-29 | Seagate Technology Llc | Disc caddy feeder system with caddy gripper for data storage devices |
US6852644B2 (en) * | 2002-11-25 | 2005-02-08 | The Boc Group, Inc. | Atmospheric robot handling equipment |
US7165303B2 (en) * | 2002-12-16 | 2007-01-23 | Seagate Technology Llc | Disc cassette delidder and feeder system for data storage devices |
JP4358690B2 (ja) * | 2004-06-30 | 2009-11-04 | 東京エレクトロン株式会社 | 縦型熱処理装置及びその運用方法 |
JP4266197B2 (ja) | 2004-10-19 | 2009-05-20 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
US7553516B2 (en) * | 2005-12-16 | 2009-06-30 | Asm International N.V. | System and method of reducing particle contamination of semiconductor substrates |
KR100793137B1 (ko) * | 2006-09-06 | 2008-01-10 | (주)젬텍 | 엘시디 마더글라스 이송라인의 버퍼스테이션 |
JP4807579B2 (ja) * | 2006-09-13 | 2011-11-02 | 株式会社ダイフク | 基板収納設備及び基板処理設備 |
JP4756372B2 (ja) * | 2006-09-13 | 2011-08-24 | 株式会社ダイフク | 基板処理方法 |
JP4335908B2 (ja) * | 2006-12-22 | 2009-09-30 | 東京エレクトロン株式会社 | 縦型熱処理装置及び縦型熱処理方法 |
US20100129940A1 (en) * | 2008-11-24 | 2010-05-27 | Texas Instruments Incorporated | Vibration monitoring of electronic substrate handling systems |
JP5562759B2 (ja) * | 2009-11-04 | 2014-07-30 | 東京エレクトロン株式会社 | 基板処理装置 |
US10297481B2 (en) | 2013-03-21 | 2019-05-21 | Tokyo Electron Limited | Magnetic annealing apparatus |
CN113548492A (zh) * | 2021-06-30 | 2021-10-26 | 无锡奥特维科技股份有限公司 | 一种硅片收片方法 |
US12037968B1 (en) * | 2023-01-24 | 2024-07-16 | Fca Us Llc | Vehicle fuel system with active accumulator |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5064337A (en) * | 1988-07-19 | 1991-11-12 | Tokyo Electron Limited | Handling apparatus for transferring carriers and a method of transferring carriers |
KR920006632B1 (ko) * | 1988-12-20 | 1992-08-10 | 삼성전자 주식회사 | 비데오 테이프의 콘트롤신호 누락시 제어회로 |
JPH05294410A (ja) * | 1992-04-21 | 1993-11-09 | Daifuku Co Ltd | 荷保管設備 |
TW245823B (zh) * | 1992-10-05 | 1995-04-21 | Tokyo Electron Co Ltd | |
JP3258748B2 (ja) * | 1993-02-08 | 2002-02-18 | 東京エレクトロン株式会社 | 熱処理装置 |
KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
-
1996
- 1996-04-30 JP JP13286496A patent/JP3478364B2/ja not_active Expired - Fee Related
- 1996-06-04 US US08/659,021 patent/US6318944B1/en not_active Expired - Fee Related
- 1996-06-10 KR KR1019960020544A patent/KR100266401B1/ko not_active IP Right Cessation
- 1996-06-10 TW TW085106968A patent/TW360898B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112830205A (zh) * | 2020-12-30 | 2021-05-25 | 壹米智汇工程技术研究院(北京)有限公司 | 油封码放设备及其工作方法 |
Also Published As
Publication number | Publication date |
---|---|
KR100266401B1 (ko) | 2000-09-15 |
KR970003770A (ko) | 1997-01-28 |
JP3478364B2 (ja) | 2003-12-15 |
US6318944B1 (en) | 2001-11-20 |
JPH0964150A (ja) | 1997-03-07 |
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