TW353784B - Apparatus and method for washing substrate - Google Patents
Apparatus and method for washing substrateInfo
- Publication number
- TW353784B TW353784B TW086116842A TW86116842A TW353784B TW 353784 B TW353784 B TW 353784B TW 086116842 A TW086116842 A TW 086116842A TW 86116842 A TW86116842 A TW 86116842A TW 353784 B TW353784 B TW 353784B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- washing
- contact
- washing surface
- scrubbing member
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 11
- 238000005406 washing Methods 0.000 title abstract 10
- 238000000034 method Methods 0.000 title 1
- 238000005201 scrubbing Methods 0.000 abstract 4
- 230000001680 brushing effect Effects 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B08B1/32—
-
- B08B1/50—
-
- B08B1/52—
-
- B08B1/54—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32340496 | 1996-11-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW353784B true TW353784B (en) | 1999-03-01 |
Family
ID=18154342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086116842A TW353784B (en) | 1996-11-19 | 1997-11-11 | Apparatus and method for washing substrate |
Country Status (6)
Country | Link |
---|---|
US (2) | US6158075A (zh) |
EP (2) | EP0843341B1 (zh) |
KR (1) | KR100379650B1 (zh) |
DE (1) | DE69724915T2 (zh) |
SG (1) | SG67439A1 (zh) |
TW (1) | TW353784B (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW353784B (en) * | 1996-11-19 | 1999-03-01 | Tokyo Electron Ltd | Apparatus and method for washing substrate |
JP3654779B2 (ja) * | 1998-01-06 | 2005-06-02 | 東京エレクトロン株式会社 | 基板洗浄具及び基板洗浄方法 |
JP3990073B2 (ja) * | 1999-06-17 | 2007-10-10 | 株式会社荏原製作所 | 基板洗浄装置及び基板洗浄方法 |
JP3991180B2 (ja) * | 1999-07-29 | 2007-10-17 | 富士フイルム株式会社 | ウエブの除塵装置 |
JP2001246331A (ja) * | 2000-03-08 | 2001-09-11 | Sharp Corp | 洗浄装置 |
JP3875456B2 (ja) * | 2000-06-29 | 2007-01-31 | 株式会社東芝 | 洗浄方法および洗浄装置 |
JP4079205B2 (ja) * | 2000-08-29 | 2008-04-23 | 東京エレクトロン株式会社 | 基板洗浄装置及び基板洗浄方法 |
KR100376395B1 (ko) * | 2000-09-19 | 2003-03-15 | 주식회사 케이씨텍 | 세정용 브러시 조립체 |
US6817057B2 (en) * | 2001-08-30 | 2004-11-16 | Micron Technology, Inc. | Spindle chuck cleaner |
US6651284B2 (en) * | 2001-10-11 | 2003-11-25 | Silicon Integrated Systems Corp. | Scrubbing assembly for wafer-cleaning device |
KR100468110B1 (ko) * | 2002-07-12 | 2005-01-26 | 삼성전자주식회사 | 웨이퍼 처리 장치 |
US20040040576A1 (en) * | 2002-08-29 | 2004-03-04 | Yuxia Sun | Wafer cleaning brush |
US7655094B2 (en) * | 2004-07-07 | 2010-02-02 | Nano Om, Llc | Systems and methods for charging a cleaning solution used for cleaning integrated circuit substrates |
JP4486003B2 (ja) * | 2005-07-07 | 2010-06-23 | 大日本スクリーン製造株式会社 | 基板洗浄ブラシ、ならびにこれを用いた基板処理装置および基板処理方法 |
US20070251035A1 (en) * | 2006-05-01 | 2007-11-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Cleaning device |
US20110296634A1 (en) * | 2010-06-02 | 2011-12-08 | Jingdong Jia | Wafer side edge cleaning apparatus |
JP4794685B1 (ja) * | 2010-10-19 | 2011-10-19 | ミクロ技研株式会社 | 基板処理装置及び基板処理方法 |
JP6054805B2 (ja) * | 2013-04-25 | 2016-12-27 | 株式会社荏原製作所 | 基板洗浄装置 |
SG10201404086XA (en) * | 2013-07-19 | 2015-02-27 | Ebara Corp | Substrate cleaning device, substrate cleaning apparatus, method for manufacturing cleaned substrate and substrate processing apparatus |
JP6312534B2 (ja) * | 2014-06-10 | 2018-04-18 | 株式会社荏原製作所 | 基板洗浄装置 |
JP2016082195A (ja) * | 2014-10-22 | 2016-05-16 | Towa株式会社 | 切断装置及び切断方法 |
US9770092B2 (en) * | 2015-08-20 | 2017-09-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Brush, back surface treatment assembly and method for cleaning substrate |
CN107221491B (zh) * | 2016-03-22 | 2021-10-22 | 东京毅力科创株式会社 | 基板清洗装置 |
JP6751634B2 (ja) * | 2016-09-21 | 2020-09-09 | 株式会社Screenホールディングス | 基板処理装置 |
JP6875154B2 (ja) * | 2017-03-06 | 2021-05-19 | 株式会社荏原製作所 | セルフクリーニング装置、基板処理装置、および洗浄具のセルフクリーニング方法 |
JP7161418B2 (ja) * | 2019-01-30 | 2022-10-26 | 株式会社荏原製作所 | 基板洗浄装置、基板処理装置、洗浄部材のセルフクリーニング方法 |
CN112845250A (zh) * | 2019-11-26 | 2021-05-28 | 常德市联嘉机械有限公司 | 一种带清洁功能的机械加工用辅助装置 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58182234A (ja) * | 1982-04-17 | 1983-10-25 | Dainippon Screen Mfg Co Ltd | 複数種のブラシ使用可能な洗浄装置 |
JPS58182830A (ja) * | 1982-04-20 | 1983-10-25 | Toshiba Corp | ジエツトスクラバ洗浄装置 |
FR2589089B3 (fr) * | 1985-10-25 | 1987-10-30 | Bertholet Louis | Appareil pour le nettoyage des tuiles |
JP2746670B2 (ja) * | 1989-07-20 | 1998-05-06 | 東京エレクトロン株式会社 | 洗浄装置 |
US5169408A (en) * | 1990-01-26 | 1992-12-08 | Fsi International, Inc. | Apparatus for wafer processing with in situ rinse |
KR100230694B1 (ko) * | 1992-05-18 | 1999-11-15 | 다카시마 히로시 | 기판세정처리장치 |
US5345639A (en) * | 1992-05-28 | 1994-09-13 | Tokyo Electron Limited | Device and method for scrubbing and cleaning substrate |
JPH06190346A (ja) * | 1992-12-28 | 1994-07-12 | Toshiba Corp | 基板洗浄装置 |
US5311634A (en) * | 1993-02-03 | 1994-05-17 | Nicholas Andros | Sponge cleaning pad |
JP2862754B2 (ja) * | 1993-04-19 | 1999-03-03 | 東京エレクトロン株式会社 | 処理装置及び回転部材 |
JP3066422B2 (ja) * | 1993-11-05 | 2000-07-17 | 東京エレクトロン株式会社 | 枚葉式両面洗浄装置 |
US5518542A (en) * | 1993-11-05 | 1996-05-21 | Tokyo Electron Limited | Double-sided substrate cleaning apparatus |
JP3328426B2 (ja) * | 1994-05-12 | 2002-09-24 | 東京エレクトロン株式会社 | 洗浄装置 |
EP0692318B1 (en) * | 1994-06-28 | 2001-09-12 | Ebara Corporation | Method of and apparatus for cleaning workpiece |
KR0150595B1 (ko) * | 1994-06-30 | 1998-12-01 | 이시다 아키라 | 브러쉬 세정장치 및 브러쉬 세정방법 및 브러쉬 부착/분리방법 |
JP3044277B2 (ja) * | 1994-12-21 | 2000-05-22 | 信越半導体株式会社 | ウェーハの洗浄及び洗浄乾燥装置 |
TW297910B (zh) * | 1995-02-02 | 1997-02-11 | Tokyo Electron Co Ltd | |
JPH08238463A (ja) * | 1995-03-03 | 1996-09-17 | Ebara Corp | 洗浄方法及び洗浄装置 |
KR100213992B1 (ko) * | 1995-05-12 | 1999-08-02 | 히가시 데쓰로 | 세정장치 |
US5624501A (en) * | 1995-09-26 | 1997-04-29 | Gill, Jr.; Gerald L. | Apparatus for cleaning semiconductor wafers |
US5778481A (en) * | 1996-02-15 | 1998-07-14 | International Business Machines Corporation | Silicon wafer cleaning and polishing pads |
JP3278590B2 (ja) * | 1996-08-23 | 2002-04-30 | 株式会社東芝 | 超音波洗浄装置及び超音波洗浄方法 |
JP2875213B2 (ja) * | 1996-09-10 | 1999-03-31 | 芝浦メカトロニクス株式会社 | 洗浄用スポンジブラシ |
TW353784B (en) * | 1996-11-19 | 1999-03-01 | Tokyo Electron Ltd | Apparatus and method for washing substrate |
US5870792A (en) * | 1997-03-31 | 1999-02-16 | Speedfam Corporation | Apparatus for cleaning wafers and discs |
US5870793A (en) * | 1997-05-02 | 1999-02-16 | Integrated Process Equipment Corp. | Brush for scrubbing semiconductor wafers |
US6006391A (en) * | 1997-11-10 | 1999-12-28 | Speedfam-Ipec Corporation | Workpiece cleaning element with improved rib configuration |
-
1997
- 1997-11-11 TW TW086116842A patent/TW353784B/zh not_active IP Right Cessation
- 1997-11-12 SG SG1997004026A patent/SG67439A1/en unknown
- 1997-11-12 EP EP97119769A patent/EP0843341B1/en not_active Expired - Lifetime
- 1997-11-12 DE DE69724915T patent/DE69724915T2/de not_active Expired - Fee Related
- 1997-11-12 EP EP03011900A patent/EP1341212A3/en not_active Withdrawn
- 1997-11-14 US US08/970,617 patent/US6158075A/en not_active Expired - Fee Related
- 1997-11-19 KR KR1019970061034A patent/KR100379650B1/ko not_active IP Right Cessation
-
2000
- 2000-10-03 US US09/677,894 patent/US6379469B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1341212A2 (en) | 2003-09-03 |
EP1341212A3 (en) | 2005-10-12 |
EP0843341A2 (en) | 1998-05-20 |
DE69724915T2 (de) | 2004-07-15 |
US6158075A (en) | 2000-12-12 |
KR19980042583A (ko) | 1998-08-17 |
DE69724915D1 (de) | 2003-10-23 |
US6379469B1 (en) | 2002-04-30 |
EP0843341B1 (en) | 2003-09-17 |
EP0843341A3 (en) | 1999-12-29 |
KR100379650B1 (ko) | 2003-07-22 |
SG67439A1 (en) | 1999-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |