TW349179B - Display device and IC chip used therefor - Google Patents

Display device and IC chip used therefor

Info

Publication number
TW349179B
TW349179B TW085106004A TW85106004A TW349179B TW 349179 B TW349179 B TW 349179B TW 085106004 A TW085106004 A TW 085106004A TW 85106004 A TW85106004 A TW 85106004A TW 349179 B TW349179 B TW 349179B
Authority
TW
Taiwan
Prior art keywords
wiring
disposed
primary
drive circuit
circuit parts
Prior art date
Application number
TW085106004A
Other languages
English (en)
Inventor
Yoshikazu Yomogihara
Ikue Yoshida
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of TW349179B publication Critical patent/TW349179B/zh

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/053—Tails

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
TW085106004A 1995-06-05 1996-05-21 Display device and IC chip used therefor TW349179B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13775695 1995-06-05
JP08007496A JP3643640B2 (ja) 1995-06-05 1996-04-02 表示装置及びこれに使用されるｉｃチップ

Publications (1)

Publication Number Publication Date
TW349179B true TW349179B (en) 1999-01-01

Family

ID=26421118

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085106004A TW349179B (en) 1995-06-05 1996-05-21 Display device and IC chip used therefor

Country Status (5)

Country Link
US (1) US5737053A (zh)
JP (1) JP3643640B2 (zh)
KR (1) KR100242741B1 (zh)
MY (1) MY112054A (zh)
TW (1) TW349179B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2299229A1 (en) 2009-09-10 2011-03-23 Cpumate Inc. Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having such an assembly
CN108668177A (zh) * 2017-03-30 2018-10-16 Smk株式会社 复合电缆

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TW293093B (zh) 1994-09-08 1996-12-11 Hitachi Ltd
WO1998012597A1 (en) * 1996-09-20 1998-03-26 Hitachi, Ltd. Liquid crystal display device, production method thereof and mobile telephone
DE19653360A1 (de) * 1996-12-20 1998-06-25 Bosch Gmbh Robert Leiterfolie zur leitenden Verbindung von elektrischen und/oder elektronischen Baukomponenten
JP3955376B2 (ja) * 1997-05-13 2007-08-08 セイコーエプソン株式会社 液晶表示パネルおよび液晶表示パネルの検査方法
US6292248B1 (en) * 1997-08-09 2001-09-18 Lg. Philips Lcd Co., Ltd. COG type liquid crystal panel and fabrication method thereof having first and second conductive bumps in different planes
US6388652B1 (en) * 1997-08-20 2002-05-14 Semiconductor Energy Laboratory Co., Ltd. Electrooptical device
KR100269947B1 (ko) * 1997-09-13 2000-10-16 윤종용 인쇄회로기판및이를이용한엘씨디모듈
US6352434B1 (en) * 1997-10-15 2002-03-05 Motorola, Inc. High density flexible circuit element and communication device using same
JP3286582B2 (ja) * 1997-10-23 2002-05-27 セイコーインスツルメンツ株式会社 表示装置及び表示装置の製造方法
FR2774203B1 (fr) * 1998-01-29 2000-03-31 Valeo Electronique Dispositif a module d'affichage a cristaux liquides, protege, notamment pour tableau de commande d'une installation de vehicule automobile
JPH11305254A (ja) * 1998-04-24 1999-11-05 Hitachi Ltd 液晶表示装置
US6825836B1 (en) 1998-05-16 2004-11-30 Thomson Licensing S.A. Bus arrangement for a driver of a matrix display
US6072699A (en) * 1998-07-21 2000-06-06 Intel Corporation Method and apparatus for matching trace lengths of signal lines making 90°/180° turns
US6123551A (en) * 1998-10-06 2000-09-26 Northern Telecom Limited Electronic circuit interconnection method and apparatus
JP4240424B2 (ja) * 1998-10-23 2009-03-18 エルジー ディスプレイ カンパニー リミテッド エッチング剤及びこれを用いた電子機器用基板の製造方法
JP3688915B2 (ja) * 1998-11-27 2005-08-31 株式会社 日立ディスプレイズ 液晶表示装置
JP3808224B2 (ja) 1998-12-02 2006-08-09 株式会社 日立ディスプレイズ 液晶表示装置
JP2000172193A (ja) * 1998-12-08 2000-06-23 Fujitsu Ltd マトリックス表示装置及びその製造方法並びに熱圧着接続用ヘッド
JP3209219B2 (ja) * 1999-01-18 2001-09-17 セイコーエプソン株式会社 電気光学装置および電子機器
JP2000259091A (ja) * 1999-03-04 2000-09-22 Casio Comput Co Ltd 表示パネル、フレキシブル配線基板及びそれらを備えた表示装置
DE60027342T2 (de) * 1999-03-26 2007-01-04 Seiko Epson Corp. Flexible gedruckte Leiterplatte, elektrooptische Vorrichtung, und elektronisches Gerät
DE19934403C1 (de) * 1999-07-22 2001-01-11 Daimler Chrysler Ag Elektrische Kontaktanordnung
KR100666317B1 (ko) * 1999-12-15 2007-01-09 삼성전자주식회사 구동 신호 인가시점 결정모듈, 이를 포함한 액정표시패널어셈블리 및 액정표시패널 어셈블리의 구동 방법
TW527513B (en) * 2000-03-06 2003-04-11 Hitachi Ltd Liquid crystal display device and manufacturing method thereof
JP2001326441A (ja) * 2000-05-17 2001-11-22 Sony Corp 複合配線板及びその製造方法
KR100385082B1 (ko) * 2000-07-27 2003-05-22 삼성전자주식회사 액정 표시 장치
US20020034930A1 (en) * 2000-09-11 2002-03-21 Shunpei Yamazaki Electronic device and method of usage thereof
FR2814858B1 (fr) * 2000-10-02 2002-12-20 Cit Alcatel Connecteur a ressort pour la connexion electrique de pistes d'un ecran d'affichage avec un circuit electrique
TWI304909B (zh) * 2000-10-04 2009-01-01 Matsushita Electric Ind Co Ltd
JP2002139739A (ja) * 2000-11-01 2002-05-17 Rohm Co Ltd 液晶表示装置とこれに使用する半導体チップの製造方法
JP3588444B2 (ja) * 2000-10-26 2004-11-10 松下電器産業株式会社 電子部品、部品実装装置及び部品実装方法
KR100695303B1 (ko) * 2000-10-31 2007-03-14 삼성전자주식회사 제어 신호부 및 그 제조 방법과 이를 포함하는 액정 표시장치 및 그 제조 방법
KR100777596B1 (ko) * 2000-12-30 2007-11-16 엘지.필립스 엘시디 주식회사 액정표시장치 및 그 제조방법
KR100382501B1 (ko) * 2001-03-26 2003-05-09 엘지전자 주식회사 유기 ｅｌ 표시장치의 ｃｏｆ 결합구조
JP4774161B2 (ja) * 2001-04-13 2011-09-14 シチズンホールディングス株式会社 液晶装置
JP4650822B2 (ja) * 2001-05-24 2011-03-16 パナソニック株式会社 フラットパネル型表示装置
CN1185915C (zh) * 2001-06-13 2005-01-19 佳能株式会社 柔性基板、半导体器件、摄像装置和放射线摄像系统
JP3708467B2 (ja) * 2001-09-26 2005-10-19 株式会社日立製作所 表示装置
JP3812558B2 (ja) * 2002-09-20 2006-08-23 セイコーエプソン株式会社 液晶装置、その駆動方法および電子機器
JP4059750B2 (ja) * 2002-10-28 2008-03-12 シャープ株式会社 電子モジュールおよびその製造方法
JP3895697B2 (ja) * 2003-03-03 2007-03-22 日東電工株式会社 フレキシブル配線回路基板
JP4004994B2 (ja) 2003-06-05 2007-11-07 株式会社アドバンスト・ディスプレイ 表示装置
KR20050048409A (ko) * 2003-11-19 2005-05-24 디스플레이칩스 주식회사 액정패널 구동용 디바이스와 이를 이용한 배선구조
US7292451B2 (en) * 2003-12-17 2007-11-06 Siemens Vdo Automotive Corporation Architecture for power modules such as power inverters
CN100465706C (zh) * 2004-03-15 2009-03-04 夏普株式会社 显示装置及用于此装置的玻璃基板
TWI288267B (en) * 2004-09-03 2007-10-11 Innolux Display Corp Liquid crystal display panel and method of fabricating the circuit substrate of the liquid crystal display panel
JP2006098536A (ja) * 2004-09-28 2006-04-13 Sharp Corp 液晶表示装置
US7515240B2 (en) * 2004-10-05 2009-04-07 Au Optronics Corporation Flat display panel and assembly process or driver components in flat display panel
JP4237160B2 (ja) * 2005-04-08 2009-03-11 エルピーダメモリ株式会社 積層型半導体装置
JP2007251446A (ja) * 2006-03-15 2007-09-27 Sharp Corp 受信装置、受信システム
JP4896619B2 (ja) * 2006-08-07 2012-03-14 株式会社 日立ディスプレイズ 表示装置
JP4603522B2 (ja) * 2006-09-25 2010-12-22 エプソンイメージングデバイス株式会社 実装構造体、電気光学装置及び電子機器
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JP5068067B2 (ja) * 2006-11-22 2012-11-07 株式会社ジャパンディスプレイイースト 表示装置および平面型表示装置
KR101469037B1 (ko) * 2008-07-18 2014-12-05 삼성디스플레이 주식회사 표시 장치
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JP5106341B2 (ja) * 2008-10-02 2012-12-26 株式会社ジャパンディスプレイイースト 表示装置
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TWI437934B (zh) * 2012-02-16 2014-05-11 Innocom Tech Shenzhen Co Ltd 介面模組及其製造方法
JP2014211825A (ja) * 2013-04-19 2014-11-13 株式会社ジャパンディスプレイ 表示装置
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KR102440487B1 (ko) * 2015-04-30 2022-09-07 삼성전자주식회사 디스플레이 유닛 및 이를 가지는 디스플레이 장치
WO2019146011A1 (ja) * 2018-01-24 2019-08-01 堺ディスプレイプロダクト株式会社 配線基板の電気接続構造および表示装置
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Cited By (3)

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Publication number Priority date Publication date Assignee Title
EP2299229A1 (en) 2009-09-10 2011-03-23 Cpumate Inc. Fixing assembly for heat-absorbing surfaces of juxtaposed heat pipes and heat sink having such an assembly
CN108668177A (zh) * 2017-03-30 2018-10-16 Smk株式会社 复合电缆
CN108668177B (zh) * 2017-03-30 2021-05-07 Smk株式会社 复合电缆

Also Published As

Publication number Publication date
JPH0954333A (ja) 1997-02-25
MY112054A (en) 2001-03-31
JP3643640B2 (ja) 2005-04-27
KR970004096A (ko) 1997-01-29
US5737053A (en) 1998-04-07
KR100242741B1 (ko) 2000-02-01

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees