TW344856B - Method and apparatus for processing substrates - Google Patents

Method and apparatus for processing substrates

Info

Publication number
TW344856B
TW344856B TW086111211A TW86111211A TW344856B TW 344856 B TW344856 B TW 344856B TW 086111211 A TW086111211 A TW 086111211A TW 86111211 A TW86111211 A TW 86111211A TW 344856 B TW344856 B TW 344856B
Authority
TW
Taiwan
Prior art keywords
nozzle
process solution
substrate
contact member
moving
Prior art date
Application number
TW086111211A
Other languages
English (en)
Inventor
Tetu Kawasaki
Kimio Motoda
Original Assignee
Tokyo Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Co Ltd filed Critical Tokyo Electron Co Ltd
Application granted granted Critical
Publication of TW344856B publication Critical patent/TW344856B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter
    • B05B15/52—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter for removal of clogging particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
TW086111211A 1996-08-30 1997-08-05 Method and apparatus for processing substrates TW344856B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24922796A JP3245769B2 (ja) 1996-08-30 1996-08-30 液処理方法及びその装置

Publications (1)

Publication Number Publication Date
TW344856B true TW344856B (en) 1998-11-11

Family

ID=17189818

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086111211A TW344856B (en) 1996-08-30 1997-08-05 Method and apparatus for processing substrates

Country Status (4)

Country Link
US (1) US5853812A (zh)
JP (1) JP3245769B2 (zh)
KR (1) KR100505923B1 (zh)
TW (1) TW344856B (zh)

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JP4614509B2 (ja) * 2000-07-31 2011-01-19 大日本印刷株式会社 塗布装置および塗布方法
JP4614508B2 (ja) * 2000-07-31 2011-01-19 大日本印刷株式会社 塗布装置および塗布方法
JP4736177B2 (ja) * 2000-11-16 2011-07-27 大日本印刷株式会社 枚葉基板の製造方法
US20030041893A1 (en) * 2001-08-31 2003-03-06 Matsushita Electric Industrial Co. Ltd. Solar cell, method for manufacturing the same, and apparatus for manufacturing the same
DE10224896A1 (de) * 2002-06-04 2003-12-18 Topack Verpacktech Gmbh Verfahren und Vorrichtung zum Reinigen wenigstens einer Leimdüse
KR100987674B1 (ko) * 2003-11-27 2010-10-13 엘지디스플레이 주식회사 노즐 세정장치 및 방법
JP4541690B2 (ja) * 2003-12-04 2010-09-08 平田機工株式会社 流体塗布装置及び流体塗布制御方法
KR100987676B1 (ko) * 2003-12-08 2010-10-13 엘지디스플레이 주식회사 노즐 세정장치
JP4343018B2 (ja) * 2004-04-20 2009-10-14 東京エレクトロン株式会社 基板の処理方法及び基板の処理装置
JP2006078382A (ja) * 2004-09-10 2006-03-23 Yokogawa Electric Corp バイオチップ作成装置
JP4727203B2 (ja) * 2004-10-18 2011-07-20 大日本スクリーン製造株式会社 基板処理装置
KR100796572B1 (ko) * 2004-11-24 2008-01-21 주식회사 나래나노텍 액정 디스플레이 또는 플라즈마 디스플레이 패널의 코팅용도액 공급 장치
JP2006159161A (ja) * 2004-12-10 2006-06-22 Nitto Seiko Co Ltd 塗布ロボット
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7255747B2 (en) 2004-12-22 2007-08-14 Sokudo Co., Ltd. Coat/develop module with independent stations
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
KR100787908B1 (ko) * 2006-07-28 2007-12-27 주식회사 케이씨텍 예비 토출 장치와 이를 포함하는 기판 코팅 장치 및 기판 코팅 방법
WO2008124830A1 (en) * 2007-04-10 2008-10-16 Nfjv, Llc Dba Nextechfas Method and apparatus for extruding a liquid onto a substrate and inspecting the same
KR200467097Y1 (ko) 2007-11-30 2013-05-27 주식회사 케이씨텍 슬릿코터의 예비토출장치
KR100982245B1 (ko) 2008-08-13 2010-09-14 주식회사 나래나노텍 더미 코팅 플레이트 장치 및 이를 구비한 코팅 장치 및 코팅 방법
WO2011077959A1 (ja) * 2009-12-25 2011-06-30 シャープ株式会社 塗布システム
WO2011080933A1 (ja) * 2009-12-28 2011-07-07 タツモ株式会社 基板用塗布装置及び基板塗布方法
JP5288383B2 (ja) * 2010-12-20 2013-09-11 東京エレクトロン株式会社 塗布処理装置及び塗布処理方法
JP5757777B2 (ja) * 2011-04-15 2015-07-29 パナソニック株式会社 基板塗布方法及び基板塗布装置並びに同方法を用いた有機エレクトロルミネッセント素子の製造方法
KR101914991B1 (ko) * 2012-02-08 2019-01-07 세메스 주식회사 기판 처리 장치 및 방법
KR101307006B1 (ko) * 2012-03-14 2013-09-26 주식회사 디엠에스 기판처리장치
JP6223222B2 (ja) 2014-02-19 2017-11-01 株式会社巴川製紙所 光学接続部品製造装置および光学接続部品製造方法
JP6223221B2 (ja) * 2014-02-19 2017-11-01 株式会社巴川製紙所 光学接続部品製造装置および高分子材料被膜形成装置
CN105413961B (zh) * 2016-01-05 2018-01-26 京东方科技集团股份有限公司 一种胶涂覆设备
TW201910403A (zh) 2017-07-28 2019-03-16 日商道康寧東麗股份有限公司 光學構件用樹脂薄片、具備其之光學構件、積層體或發光元件以及光學構件用樹脂薄片之製造方法
KR102221258B1 (ko) * 2018-09-27 2021-03-02 세메스 주식회사 약액 토출 장치
EP4015092A1 (de) * 2020-12-18 2022-06-22 Henkel AG & Co. KGaA Verfahren und vorrichtung zum abstreifen eines materialrests von einer dosierdüse

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Also Published As

Publication number Publication date
KR100505923B1 (ko) 2005-10-25
KR19980019187A (ko) 1998-06-05
JP3245769B2 (ja) 2002-01-15
US5853812A (en) 1998-12-29
JPH1076205A (ja) 1998-03-24

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees