TW307779B - - Google Patents
Download PDFInfo
- Publication number
- TW307779B TW307779B TW83101274A TW83101274A TW307779B TW 307779 B TW307779 B TW 307779B TW 83101274 A TW83101274 A TW 83101274A TW 83101274 A TW83101274 A TW 83101274A TW 307779 B TW307779 B TW 307779B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- resin
- bisphenol
- addition polymerization
- item
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2882593A JPH06239962A (ja) | 1993-02-18 | 1993-02-18 | 積層板用エポキシ樹脂組成物 |
JP5028826A JPH06239963A (ja) | 1993-02-18 | 1993-02-18 | 積層板用エポキシ樹脂組成物 |
JP173194A JPH07206978A (ja) | 1994-01-12 | 1994-01-12 | エポキシ樹脂 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW307779B true TW307779B (ja) | 1997-06-11 |
Family
ID=27275047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW83101274A TW307779B (ja) | 1993-02-18 | 1994-02-17 |
Country Status (5)
Country | Link |
---|---|
CN (3) | CN1037972C (ja) |
GB (1) | GB2275682B (ja) |
MY (1) | MY131546A (ja) |
SG (1) | SG64861A1 (ja) |
TW (1) | TW307779B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103694450A (zh) * | 2013-11-15 | 2014-04-02 | 山东圣泉化工股份有限公司 | 一种阻燃环氧树脂及其制备方法 |
CN109575237B (zh) * | 2018-11-30 | 2021-10-22 | 陕西科技大学 | 一种双酚s改性双酚a甲醛酚醛环氧树脂及其合成方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD238615A1 (de) * | 1985-06-26 | 1986-08-27 | Leuna Werke Veb | Verfahren zur herstellung von flammhemmenden bindemitteln auf epoxidharzbasis |
JPS6490216A (en) * | 1987-09-30 | 1989-04-06 | Hitachi Chemical Co Ltd | Epoxy resin composition |
JPS6490215A (en) * | 1987-09-30 | 1989-04-06 | Hitachi Chemical Co Ltd | Bisphenol a novolak epoxy resin |
JPH02238018A (ja) * | 1989-03-13 | 1990-09-20 | Yuka Shell Epoxy Kk | 封止用エポキシ樹脂組成物 |
-
1994
- 1994-02-17 TW TW83101274A patent/TW307779B/zh active
- 1994-02-17 GB GB9403012A patent/GB2275682B/en not_active Expired - Fee Related
- 1994-02-17 MY MYPI9400355 patent/MY131546A/en unknown
- 1994-02-17 SG SG1996001462A patent/SG64861A1/en unknown
- 1994-02-18 CN CN94103299A patent/CN1037972C/zh not_active Expired - Fee Related
-
1997
- 1997-08-05 CN CN 97117197 patent/CN1219546A/zh active Pending
- 1997-08-05 CN CN 97117195 patent/CN1176262A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
CN1037972C (zh) | 1998-04-08 |
CN1176262A (zh) | 1998-03-18 |
CN1219546A (zh) | 1999-06-16 |
MY131546A (en) | 2007-08-30 |
GB2275682A (en) | 1994-09-07 |
GB9403012D0 (en) | 1994-04-06 |
GB2275682B (en) | 1997-02-26 |
CN1095728A (zh) | 1994-11-30 |
SG64861A1 (en) | 2000-06-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5262389B2 (ja) | エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 | |
JP4632077B2 (ja) | エポキシ樹脂組成物、エポキシ樹脂の製造方法、新規エポキシ樹脂、及び新規フェノール樹脂 | |
KR100995678B1 (ko) | 페놀 노볼락 수지, 페놀 노볼락 에폭시 수지 및 에폭시 수지 조성물 | |
JP3579800B2 (ja) | 低誘電性エポキシ樹脂組成物 | |
JP2823057B2 (ja) | エポキシ樹脂の製造方法 | |
JPH073123A (ja) | エポキシ樹脂組成物 | |
JP4144732B2 (ja) | 高分子量エポキシ樹脂、電気積層板用樹脂組成物及び電気積層板 | |
TW307779B (ja) | ||
KR20130103307A (ko) | 에폭시 수지용 잠복 촉매로서의 포스파젠 차단된 아졸 화합물 | |
TW295592B (ja) | ||
JP3395845B2 (ja) | 積層板用エポキシ樹脂組成物 | |
JPH05178963A (ja) | エポキシ樹脂組成物 | |
JP2006257137A (ja) | エポキシ樹脂組成物及びその硬化物 | |
JP2008231428A (ja) | 高分子量エポキシ樹脂、電気積層板用樹脂組成物及び電気積層板 | |
JP2005307032A (ja) | 1液型エポキシ樹脂組成物及びその硬化物 | |
JP4636307B2 (ja) | エポキシ樹脂組成物及びその硬化物 | |
JP2003137950A (ja) | ジヒドロキシベンゼン型ノボラック樹脂の製造方法、エポキシ樹脂組成物及びその硬化物。 | |
JP3331222B2 (ja) | エポキシ樹脂及びエポキシ樹脂組成物 | |
JP4605420B2 (ja) | エポキシ樹脂組成物及びその硬化物 | |
JP2019052258A (ja) | 多価ヒドロキシ樹脂、その製造方法、エポキシ樹脂用硬化剤、エポキシ樹脂、エポキシ樹脂組成物、その硬化物、半導体封止材および積層板 | |
JPH10130364A (ja) | フェノール類樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 | |
JP3305030B2 (ja) | 電気積層板用エポキシ樹脂組成物 | |
JP4404821B2 (ja) | 変性エポキシ樹脂、エポキシ樹脂組成物及びその硬化物 | |
JP4540080B2 (ja) | 高軟化点o−クレゾ−ルノボラック型エポキシ樹脂、これを含むエポキシ樹脂溶液、エポキシ樹脂組成物及びエポキシ樹脂の製造法 | |
JP2001019743A (ja) | エポキシ樹脂、これを含むエポキシ樹脂溶液、エポキシ樹脂組成物及びエポキシ樹脂の製造法 |