GB2275682B - Epoxy resin and epoxy resin composition - Google Patents

Epoxy resin and epoxy resin composition

Info

Publication number
GB2275682B
GB2275682B GB9403012A GB9403012A GB2275682B GB 2275682 B GB2275682 B GB 2275682B GB 9403012 A GB9403012 A GB 9403012A GB 9403012 A GB9403012 A GB 9403012A GB 2275682 B GB2275682 B GB 2275682B
Authority
GB
United Kingdom
Prior art keywords
epoxy resin
resin composition
composition
epoxy
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9403012A
Other versions
GB9403012D0 (en
GB2275682A (en
Inventor
Kiyomi Yasyda
Hideo Nakamura
Terufumi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2882593A external-priority patent/JPH06239962A/en
Priority claimed from JP5028826A external-priority patent/JPH06239963A/en
Priority claimed from JP173194A external-priority patent/JPH07206978A/en
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Publication of GB9403012D0 publication Critical patent/GB9403012D0/en
Publication of GB2275682A publication Critical patent/GB2275682A/en
Application granted granted Critical
Publication of GB2275682B publication Critical patent/GB2275682B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
GB9403012A 1993-02-18 1994-02-17 Epoxy resin and epoxy resin composition Expired - Fee Related GB2275682B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2882593A JPH06239962A (en) 1993-02-18 1993-02-18 Epoxy resin composition for laminate
JP5028826A JPH06239963A (en) 1993-02-18 1993-02-18 Epoxy resin composition for laminate
JP173194A JPH07206978A (en) 1994-01-12 1994-01-12 Epoxy resin

Publications (3)

Publication Number Publication Date
GB9403012D0 GB9403012D0 (en) 1994-04-06
GB2275682A GB2275682A (en) 1994-09-07
GB2275682B true GB2275682B (en) 1997-02-26

Family

ID=27275047

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9403012A Expired - Fee Related GB2275682B (en) 1993-02-18 1994-02-17 Epoxy resin and epoxy resin composition

Country Status (5)

Country Link
CN (3) CN1037972C (en)
GB (1) GB2275682B (en)
MY (1) MY131546A (en)
SG (1) SG64861A1 (en)
TW (1) TW307779B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103694450A (en) * 2013-11-15 2014-04-02 山东圣泉化工股份有限公司 Fire retardation epoxy resin and preparation method thereof
CN109575237B (en) * 2018-11-30 2021-10-22 陕西科技大学 Bisphenol S modified bisphenol A formaldehyde novolac epoxy resin and synthetic method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6490215A (en) * 1987-09-30 1989-04-06 Hitachi Chemical Co Ltd Bisphenol a novolak epoxy resin
JPS6490216A (en) * 1987-09-30 1989-04-06 Hitachi Chemical Co Ltd Epoxy resin composition

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD238615A1 (en) * 1985-06-26 1986-08-27 Leuna Werke Veb METHOD FOR THE PRODUCTION OF FLAME-RESISTANT BINDER ON EPOXY-BASED BASE
JPH02238018A (en) * 1989-03-13 1990-09-20 Yuka Shell Epoxy Kk Epoxy resin composition for sealing

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6490215A (en) * 1987-09-30 1989-04-06 Hitachi Chemical Co Ltd Bisphenol a novolak epoxy resin
JPS6490216A (en) * 1987-09-30 1989-04-06 Hitachi Chemical Co Ltd Epoxy resin composition

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
WPI Abstract Accession No 89-147419/20 & JP 01090215 A *
WPI Abstract Accession No 89-147420/20 & JP 01090216 A *

Also Published As

Publication number Publication date
GB9403012D0 (en) 1994-04-06
CN1176262A (en) 1998-03-18
CN1219546A (en) 1999-06-16
CN1095728A (en) 1994-11-30
CN1037972C (en) 1998-04-08
MY131546A (en) 2007-08-30
GB2275682A (en) 1994-09-07
SG64861A1 (en) 2000-06-20
TW307779B (en) 1997-06-11

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20000217