JPS6490215A - Bisphenol a novolak epoxy resin - Google Patents

Bisphenol a novolak epoxy resin

Info

Publication number
JPS6490215A
JPS6490215A JP24714487A JP24714487A JPS6490215A JP S6490215 A JPS6490215 A JP S6490215A JP 24714487 A JP24714487 A JP 24714487A JP 24714487 A JP24714487 A JP 24714487A JP S6490215 A JPS6490215 A JP S6490215A
Authority
JP
Japan
Prior art keywords
epoxy resin
bisphenol
pref
average
novolak epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24714487A
Other languages
Japanese (ja)
Inventor
Mariko Hasebe
Noburu Kikuchi
Takayuki Saito
Michio Uruno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP24714487A priority Critical patent/JPS6490215A/en
Publication of JPS6490215A publication Critical patent/JPS6490215A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Epoxy Resins (AREA)

Abstract

PURPOSE:To provide an epoxy resin having a high heat resistance, by limiting the bisphenol A diglycidyl ether unit content of a bisphenol A novolak epoxy resin to a specified value or lower. CONSTITUTION:A bisphenol A novolak epoxy resin having a bisphenol A diglycidyl ether unit content of a most 10wt.%. The number-average MW of the epoxy resin is pref. 900-4,000, particularly pref. 1,000-2,000. It is pref. that the epoxy resin have a polydispersity index of at most 2.7. When this index is 2.7 or lower, the epoxy resin is effectively prevented from undergoing partial progress of a curing reaction during drying of a prepreg and from causing discoloration of a laminate which would otherwise be caused by a lowering of the curing temp. The polydispersity index refers to the ratio of weight- average MW to number-average MW. The epoxy equivalent of the epoxy resin is pref. 175-220. When the epoxy equivalent exceeds 220, the heat resistance of the cured resin tends to be lower.
JP24714487A 1987-09-30 1987-09-30 Bisphenol a novolak epoxy resin Pending JPS6490215A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24714487A JPS6490215A (en) 1987-09-30 1987-09-30 Bisphenol a novolak epoxy resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24714487A JPS6490215A (en) 1987-09-30 1987-09-30 Bisphenol a novolak epoxy resin

Publications (1)

Publication Number Publication Date
JPS6490215A true JPS6490215A (en) 1989-04-06

Family

ID=17159086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24714487A Pending JPS6490215A (en) 1987-09-30 1987-09-30 Bisphenol a novolak epoxy resin

Country Status (1)

Country Link
JP (1) JPS6490215A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2275682A (en) * 1993-02-18 1994-09-07 Mitsui Petrochemical Ind Epoxy resin and epoxy resin composition
US10047190B2 (en) 2014-09-03 2018-08-14 Dic Corporation Epoxy resin, method for producing epoxy resin, curable resin composition, cured product, fiber reinforced composite material, and molded article

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2275682A (en) * 1993-02-18 1994-09-07 Mitsui Petrochemical Ind Epoxy resin and epoxy resin composition
GB2275682B (en) * 1993-02-18 1997-02-26 Mitsui Petrochemical Ind Epoxy resin and epoxy resin composition
CN1037972C (en) * 1993-02-18 1998-04-08 三井石油化学工业株式会社 Epoxy resin and epoxy resin composition
US10047190B2 (en) 2014-09-03 2018-08-14 Dic Corporation Epoxy resin, method for producing epoxy resin, curable resin composition, cured product, fiber reinforced composite material, and molded article

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