JPS5674117A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS5674117A JPS5674117A JP15220579A JP15220579A JPS5674117A JP S5674117 A JPS5674117 A JP S5674117A JP 15220579 A JP15220579 A JP 15220579A JP 15220579 A JP15220579 A JP 15220579A JP S5674117 A JPS5674117 A JP S5674117A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- 100pts
- curing agent
- polybutadiene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE: An epoxy resin composition, suitable for a printed circuit board used in an electronic appliance, having improved heat and flame resistance, and comprising a specific curing agent and a flame retardant.
CONSTITUTION: 100pts.wt. a bisphenol epoxy resin having an epoxy equivalent of 100W4,000 is incorporated with 50W100pts.wt. a maleinized 1,2-polybutadiene obtained by adding maleic anhydride to part of 1,2-polybutadiene having a number- average molecular weight of 1,000W4,000 as a curing agent. 100pts.wt. the resultant epoxy resin is then mixed with preferably 20W60pts.wt. tetrabromobisphenol A ester of methacrylic acid and then a tertiary amine as a curing assistant if desired to give the aimed epoxy resin composition.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15220579A JPS5674117A (en) | 1979-11-24 | 1979-11-24 | Epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15220579A JPS5674117A (en) | 1979-11-24 | 1979-11-24 | Epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5674117A true JPS5674117A (en) | 1981-06-19 |
Family
ID=15535354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15220579A Pending JPS5674117A (en) | 1979-11-24 | 1979-11-24 | Epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5674117A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5629379A (en) * | 1994-09-27 | 1997-05-13 | Harper; John D. | Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct |
US5962586A (en) * | 1994-09-27 | 1999-10-05 | Harper; John D. | Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct |
JP2011057862A (en) * | 2009-09-10 | 2011-03-24 | Sumitomo Bakelite Co Ltd | Resin composition and semiconductor device produced by using the same |
-
1979
- 1979-11-24 JP JP15220579A patent/JPS5674117A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5629379A (en) * | 1994-09-27 | 1997-05-13 | Harper; John D. | Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct |
US5962586A (en) * | 1994-09-27 | 1999-10-05 | Harper; John D. | Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct |
JP2011057862A (en) * | 2009-09-10 | 2011-03-24 | Sumitomo Bakelite Co Ltd | Resin composition and semiconductor device produced by using the same |
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