JPS5674117A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS5674117A
JPS5674117A JP15220579A JP15220579A JPS5674117A JP S5674117 A JPS5674117 A JP S5674117A JP 15220579 A JP15220579 A JP 15220579A JP 15220579 A JP15220579 A JP 15220579A JP S5674117 A JPS5674117 A JP S5674117A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
100pts
curing agent
polybutadiene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15220579A
Other languages
Japanese (ja)
Inventor
Masaaki Otsu
Masahiro Matsumura
Yoshihiro Kitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15220579A priority Critical patent/JPS5674117A/en
Publication of JPS5674117A publication Critical patent/JPS5674117A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: An epoxy resin composition, suitable for a printed circuit board used in an electronic appliance, having improved heat and flame resistance, and comprising a specific curing agent and a flame retardant.
CONSTITUTION: 100pts.wt. a bisphenol epoxy resin having an epoxy equivalent of 100W4,000 is incorporated with 50W100pts.wt. a maleinized 1,2-polybutadiene obtained by adding maleic anhydride to part of 1,2-polybutadiene having a number- average molecular weight of 1,000W4,000 as a curing agent. 100pts.wt. the resultant epoxy resin is then mixed with preferably 20W60pts.wt. tetrabromobisphenol A ester of methacrylic acid and then a tertiary amine as a curing assistant if desired to give the aimed epoxy resin composition.
COPYRIGHT: (C)1981,JPO&Japio
JP15220579A 1979-11-24 1979-11-24 Epoxy resin composition Pending JPS5674117A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15220579A JPS5674117A (en) 1979-11-24 1979-11-24 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15220579A JPS5674117A (en) 1979-11-24 1979-11-24 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS5674117A true JPS5674117A (en) 1981-06-19

Family

ID=15535354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15220579A Pending JPS5674117A (en) 1979-11-24 1979-11-24 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5674117A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629379A (en) * 1994-09-27 1997-05-13 Harper; John D. Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct
US5962586A (en) * 1994-09-27 1999-10-05 Harper; John D. Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct
JP2011057862A (en) * 2009-09-10 2011-03-24 Sumitomo Bakelite Co Ltd Resin composition and semiconductor device produced by using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629379A (en) * 1994-09-27 1997-05-13 Harper; John D. Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct
US5962586A (en) * 1994-09-27 1999-10-05 Harper; John D. Epoxy resin(s) with anhydride and polybutadiene-maleic anhydride adduct
JP2011057862A (en) * 2009-09-10 2011-03-24 Sumitomo Bakelite Co Ltd Resin composition and semiconductor device produced by using the same

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