JPS5584379A - Flame retardant adhesive composition - Google Patents

Flame retardant adhesive composition

Info

Publication number
JPS5584379A
JPS5584379A JP15805378A JP15805378A JPS5584379A JP S5584379 A JPS5584379 A JP S5584379A JP 15805378 A JP15805378 A JP 15805378A JP 15805378 A JP15805378 A JP 15805378A JP S5584379 A JPS5584379 A JP S5584379A
Authority
JP
Japan
Prior art keywords
flame retardant
acrylic
adhesive composition
cooh
retardant adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15805378A
Other languages
Japanese (ja)
Inventor
Masanao Watanabe
Toru Odajima
Yoshio Fujiwara
Keiichi Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP15805378A priority Critical patent/JPS5584379A/en
Publication of JPS5584379A publication Critical patent/JPS5584379A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To provide a flame retardant adhesive composition adapted for a flexible printed circuit board fabrication by containing bisphenol type brominated epoxy resin, acrylic compolymer obtained by copolymerizing specified starting materials, and specified acid anhydrides as main components.
CONSTITUTION: 100pts.wt. of brominated epoxy resin (A), 40W80pts.wt. of acrylic copolymer (B), and acid anhydride (C) represented by the formula I, wherein X is H or 1W4C hydrocarbon group, and Y is H, COOH, or 1W4C hydrocarbon group, are mixed as main components, and (B) is obtained by copolymerization of 5W35wt% of acrylonitrile (a), 0.5W10wt% of an ethylenically unsaturated compound (b) having one or more functional groups selected from COOH, OH and epoxy group, and an ester (C) obtained from 1W6C alcohol and acrylic acid and/or methacrylic acid substantially occupying the remaining part.
COPYRIGHT: (C)1980,JPO&Japio
JP15805378A 1978-12-20 1978-12-20 Flame retardant adhesive composition Pending JPS5584379A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15805378A JPS5584379A (en) 1978-12-20 1978-12-20 Flame retardant adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15805378A JPS5584379A (en) 1978-12-20 1978-12-20 Flame retardant adhesive composition

Publications (1)

Publication Number Publication Date
JPS5584379A true JPS5584379A (en) 1980-06-25

Family

ID=15663254

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15805378A Pending JPS5584379A (en) 1978-12-20 1978-12-20 Flame retardant adhesive composition

Country Status (1)

Country Link
JP (1) JPS5584379A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827768A (en) * 1981-08-11 1983-02-18 Asahi Chem Ind Co Ltd Water-dispersed contact adhesive composition
JPS5966476A (en) * 1982-10-08 1984-04-14 Toshiba Chem Corp Adhesive composition for flexible printed circuit board
JPS59170115A (en) * 1983-03-17 1984-09-26 Kanegafuchi Chem Ind Co Ltd Flame-retardant liquid epoxy resin composition and manufacture of laminate sheet for electrical use therefrom
JPS60186579A (en) * 1984-03-05 1985-09-24 Mitsui Petrochem Ind Ltd Flame-resistant adhesive compositon
JPS61254680A (en) * 1985-05-07 1986-11-12 Toshiba Chem Corp Adhesive composition for flexible printed-circuit board
JPH03181580A (en) * 1989-12-11 1991-08-07 Hitachi Chem Co Ltd Adhesive for flexible printed-wiring board and flexible printed-wiring board using same
JP2007009057A (en) * 2005-06-30 2007-01-18 Nitto Denko Corp Adhesive composition and adhesive sheet
JP2014218651A (en) * 2013-04-08 2014-11-20 Jnc株式会社 Heat-curable composition

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH027348B2 (en) * 1981-08-11 1990-02-16 Asahi Chemical Ind
JPS5827768A (en) * 1981-08-11 1983-02-18 Asahi Chem Ind Co Ltd Water-dispersed contact adhesive composition
JPS5966476A (en) * 1982-10-08 1984-04-14 Toshiba Chem Corp Adhesive composition for flexible printed circuit board
JPH0219869B2 (en) * 1982-10-08 1990-05-07 Toshiba Chem Prod
JPH0454701B2 (en) * 1983-03-17 1992-09-01 Kanegafuchi Chemical Ind
JPS59170115A (en) * 1983-03-17 1984-09-26 Kanegafuchi Chem Ind Co Ltd Flame-retardant liquid epoxy resin composition and manufacture of laminate sheet for electrical use therefrom
JPS60186579A (en) * 1984-03-05 1985-09-24 Mitsui Petrochem Ind Ltd Flame-resistant adhesive compositon
JPH0359947B2 (en) * 1984-03-05 1991-09-12 Mitsui Petrochemical Ind
JPS61254680A (en) * 1985-05-07 1986-11-12 Toshiba Chem Corp Adhesive composition for flexible printed-circuit board
JPH03181580A (en) * 1989-12-11 1991-08-07 Hitachi Chem Co Ltd Adhesive for flexible printed-wiring board and flexible printed-wiring board using same
JP2007009057A (en) * 2005-06-30 2007-01-18 Nitto Denko Corp Adhesive composition and adhesive sheet
JP4733443B2 (en) * 2005-06-30 2011-07-27 日東電工株式会社 Adhesive composition and adhesive sheet
JP2014218651A (en) * 2013-04-08 2014-11-20 Jnc株式会社 Heat-curable composition

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