JPS54162736A - Adhesive composition - Google Patents

Adhesive composition

Info

Publication number
JPS54162736A
JPS54162736A JP7153878A JP7153878A JPS54162736A JP S54162736 A JPS54162736 A JP S54162736A JP 7153878 A JP7153878 A JP 7153878A JP 7153878 A JP7153878 A JP 7153878A JP S54162736 A JPS54162736 A JP S54162736A
Authority
JP
Japan
Prior art keywords
vol
parts
epoxy resin
acrylic ester
ethyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7153878A
Other languages
Japanese (ja)
Other versions
JPS6310195B2 (en
Inventor
Tetsuo Takahashi
Jun Tamashima
Genichi Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP7153878A priority Critical patent/JPS54162736A/en
Publication of JPS54162736A publication Critical patent/JPS54162736A/en
Publication of JPS6310195B2 publication Critical patent/JPS6310195B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: The title composition free from sagging and spreading, comprising an epoxy resin and a specific amount of an acrylic ester resin.
CONSTITUTION: A composition comprising (A) 100 parts by vol. of an epoxy resin, e.g. a condensate of bisphenol A with epichlorohydrin, (B) 50W80 parts by vol. of an acrylic ester resin, e.g. a terpolymer obtained by copolymerizing acrylic acid with 2-ethyl-hexyl, butyl, and ethyl acrylates, in a compatible state.
USE: Temporary fixing of electronic barts to circuit base boards.
COPYRIGHT: (C)1979,JPO&Japio
JP7153878A 1978-06-15 1978-06-15 Adhesive composition Granted JPS54162736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7153878A JPS54162736A (en) 1978-06-15 1978-06-15 Adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7153878A JPS54162736A (en) 1978-06-15 1978-06-15 Adhesive composition

Publications (2)

Publication Number Publication Date
JPS54162736A true JPS54162736A (en) 1979-12-24
JPS6310195B2 JPS6310195B2 (en) 1988-03-04

Family

ID=13463608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7153878A Granted JPS54162736A (en) 1978-06-15 1978-06-15 Adhesive composition

Country Status (1)

Country Link
JP (1) JPS54162736A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110003381A (en) * 2019-03-07 2019-07-12 何嘉妍 A kind of resist sagging resin and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110003381A (en) * 2019-03-07 2019-07-12 何嘉妍 A kind of resist sagging resin and preparation method thereof

Also Published As

Publication number Publication date
JPS6310195B2 (en) 1988-03-04

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