JPS5554315A - Ultraviolet curing composition - Google Patents

Ultraviolet curing composition

Info

Publication number
JPS5554315A
JPS5554315A JP12753878A JP12753878A JPS5554315A JP S5554315 A JPS5554315 A JP S5554315A JP 12753878 A JP12753878 A JP 12753878A JP 12753878 A JP12753878 A JP 12753878A JP S5554315 A JPS5554315 A JP S5554315A
Authority
JP
Japan
Prior art keywords
curing composition
composition
epoxy resin
ultraviolet curing
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12753878A
Other languages
Japanese (ja)
Inventor
Keiji Saeki
Chuji Shibuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP12753878A priority Critical patent/JPS5554315A/en
Publication of JPS5554315A publication Critical patent/JPS5554315A/en
Pending legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

PURPOSE: The title composition usable for flexible printed wiring base boards, having improved solder heat resistance and flexibility, comprising an epoxy acrylate ultraviolet curing composition and a specific amount of a thermosetting phenol- modified epoxy resin.
CONSTITUTION: (A) An epoxy acrylate ultraviolt curing composition comprising an epoxy acrylate prepared by esterifying the epoxy group of an epoxy resin with (meth)acrylic acid and a photosensitizer, etc., is incorporated with (B) 30 parts by wt. of a thermosetting phenol-modified epoxy resin to give the objective composition.
COPYRIGHT: (C)1980,JPO&Japio
JP12753878A 1978-10-16 1978-10-16 Ultraviolet curing composition Pending JPS5554315A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12753878A JPS5554315A (en) 1978-10-16 1978-10-16 Ultraviolet curing composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12753878A JPS5554315A (en) 1978-10-16 1978-10-16 Ultraviolet curing composition

Publications (1)

Publication Number Publication Date
JPS5554315A true JPS5554315A (en) 1980-04-21

Family

ID=14962482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12753878A Pending JPS5554315A (en) 1978-10-16 1978-10-16 Ultraviolet curing composition

Country Status (1)

Country Link
JP (1) JPS5554315A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63295615A (en) * 1987-05-28 1988-12-02 Teijin Ltd Polymerizable composition for molding
WO1996028764A1 (en) * 1993-09-02 1996-09-19 Goo Chemical Industries Co., Ltd. Photosensitive resin composition, and coating film, resist ink, resist, solder resist and printed circuit board each produced therefrom

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63295615A (en) * 1987-05-28 1988-12-02 Teijin Ltd Polymerizable composition for molding
WO1996028764A1 (en) * 1993-09-02 1996-09-19 Goo Chemical Industries Co., Ltd. Photosensitive resin composition, and coating film, resist ink, resist, solder resist and printed circuit board each produced therefrom

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