JPS54127458A - Colorless and transparent epoxy resin composition - Google Patents
Colorless and transparent epoxy resin compositionInfo
- Publication number
- JPS54127458A JPS54127458A JP3425978A JP3425978A JPS54127458A JP S54127458 A JPS54127458 A JP S54127458A JP 3425978 A JP3425978 A JP 3425978A JP 3425978 A JP3425978 A JP 3425978A JP S54127458 A JPS54127458 A JP S54127458A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- parts
- colorless
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: A colorless and transparent epoxy resin composition that is prepared by adding a specific curing accelerator and a discoloration inhibitor to a thermosetting resin composition mainly cmprising an epoxy resin and a curing agent of organic polybasic acid anhydride, thus being good in resistance to heat deterioration.
CONSTITUTION: To a thermosetting resin mainly comprising an epoxy resin with less than 1 Gardner's color number and a curing agent of organic polybasic acid anhydride are incorporated (A) 0.05W0.5 part, per 100 parts by wt of the epoxy resin, of at least one of alicyclic tertiary amines or their salts selected from n,n'- dialkylpiperazines and diazabicycloalkanes as curing accelerator and 0.1W10 parts of at least one of reducible and soluble organic metal compounds selected from divalent tin salts of higher fatty acids, and (B) 0.05W2 parts of soluble hindered phenol and/or organic sulfide with 1W10 phenyl nuclei as discoloration inhibitor.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3425978A JPS5830893B2 (en) | 1978-03-27 | 1978-03-27 | Colorless transparent epoxy resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3425978A JPS5830893B2 (en) | 1978-03-27 | 1978-03-27 | Colorless transparent epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54127458A true JPS54127458A (en) | 1979-10-03 |
JPS5830893B2 JPS5830893B2 (en) | 1983-07-02 |
Family
ID=12409167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3425978A Expired JPS5830893B2 (en) | 1978-03-27 | 1978-03-27 | Colorless transparent epoxy resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5830893B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5649726A (en) * | 1979-09-29 | 1981-05-06 | Nitto Electric Ind Co Ltd | Epoxy resin composition having excellent transparency for casting |
JPS58128756A (en) * | 1982-01-27 | 1983-08-01 | Nitto Electric Ind Co Ltd | Epoxy resin composition for photo semiconductor sealing |
JPS598721A (en) * | 1982-07-07 | 1984-01-18 | Mitsubishi Electric Corp | Liquid epoxy resin composition for sealing semiconductor |
US4558076A (en) * | 1984-07-03 | 1985-12-10 | Coates Brothers Plc | Coating compositions |
JPH03124735A (en) * | 1989-10-06 | 1991-05-28 | Hitachi Chem Co Ltd | Preparation of prepreg for printed circuit board |
JP2001213940A (en) * | 2000-02-04 | 2001-08-07 | Nitto Denko Corp | Epoxy resin composition and semiconductor device |
JP2002294030A (en) * | 2001-03-29 | 2002-10-09 | Toray Ind Inc | Epoxy resin composition for sealing semiconductor and semiconductor device |
-
1978
- 1978-03-27 JP JP3425978A patent/JPS5830893B2/en not_active Expired
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5649726A (en) * | 1979-09-29 | 1981-05-06 | Nitto Electric Ind Co Ltd | Epoxy resin composition having excellent transparency for casting |
JPS5728503B2 (en) * | 1979-09-29 | 1982-06-17 | ||
JPS58128756A (en) * | 1982-01-27 | 1983-08-01 | Nitto Electric Ind Co Ltd | Epoxy resin composition for photo semiconductor sealing |
JPS598721A (en) * | 1982-07-07 | 1984-01-18 | Mitsubishi Electric Corp | Liquid epoxy resin composition for sealing semiconductor |
JPS6238365B2 (en) * | 1982-07-07 | 1987-08-18 | Mitsubishi Electric Corp | |
US4558076A (en) * | 1984-07-03 | 1985-12-10 | Coates Brothers Plc | Coating compositions |
JPH03124735A (en) * | 1989-10-06 | 1991-05-28 | Hitachi Chem Co Ltd | Preparation of prepreg for printed circuit board |
JP2001213940A (en) * | 2000-02-04 | 2001-08-07 | Nitto Denko Corp | Epoxy resin composition and semiconductor device |
JP2002294030A (en) * | 2001-03-29 | 2002-10-09 | Toray Ind Inc | Epoxy resin composition for sealing semiconductor and semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS5830893B2 (en) | 1983-07-02 |
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