JPS54127458A - Colorless and transparent epoxy resin composition - Google Patents

Colorless and transparent epoxy resin composition

Info

Publication number
JPS54127458A
JPS54127458A JP3425978A JP3425978A JPS54127458A JP S54127458 A JPS54127458 A JP S54127458A JP 3425978 A JP3425978 A JP 3425978A JP 3425978 A JP3425978 A JP 3425978A JP S54127458 A JPS54127458 A JP S54127458A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
parts
colorless
organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3425978A
Other languages
Japanese (ja)
Other versions
JPS5830893B2 (en
Inventor
Ryuzo Nakatsuka
Ichita Hanabusa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP3425978A priority Critical patent/JPS5830893B2/en
Publication of JPS54127458A publication Critical patent/JPS54127458A/en
Publication of JPS5830893B2 publication Critical patent/JPS5830893B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: A colorless and transparent epoxy resin composition that is prepared by adding a specific curing accelerator and a discoloration inhibitor to a thermosetting resin composition mainly cmprising an epoxy resin and a curing agent of organic polybasic acid anhydride, thus being good in resistance to heat deterioration.
CONSTITUTION: To a thermosetting resin mainly comprising an epoxy resin with less than 1 Gardner's color number and a curing agent of organic polybasic acid anhydride are incorporated (A) 0.05W0.5 part, per 100 parts by wt of the epoxy resin, of at least one of alicyclic tertiary amines or their salts selected from n,n'- dialkylpiperazines and diazabicycloalkanes as curing accelerator and 0.1W10 parts of at least one of reducible and soluble organic metal compounds selected from divalent tin salts of higher fatty acids, and (B) 0.05W2 parts of soluble hindered phenol and/or organic sulfide with 1W10 phenyl nuclei as discoloration inhibitor.
COPYRIGHT: (C)1979,JPO&Japio
JP3425978A 1978-03-27 1978-03-27 Colorless transparent epoxy resin composition Expired JPS5830893B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3425978A JPS5830893B2 (en) 1978-03-27 1978-03-27 Colorless transparent epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3425978A JPS5830893B2 (en) 1978-03-27 1978-03-27 Colorless transparent epoxy resin composition

Publications (2)

Publication Number Publication Date
JPS54127458A true JPS54127458A (en) 1979-10-03
JPS5830893B2 JPS5830893B2 (en) 1983-07-02

Family

ID=12409167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3425978A Expired JPS5830893B2 (en) 1978-03-27 1978-03-27 Colorless transparent epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS5830893B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649726A (en) * 1979-09-29 1981-05-06 Nitto Electric Ind Co Ltd Epoxy resin composition having excellent transparency for casting
JPS58128756A (en) * 1982-01-27 1983-08-01 Nitto Electric Ind Co Ltd Epoxy resin composition for photo semiconductor sealing
JPS598721A (en) * 1982-07-07 1984-01-18 Mitsubishi Electric Corp Liquid epoxy resin composition for sealing semiconductor
US4558076A (en) * 1984-07-03 1985-12-10 Coates Brothers Plc Coating compositions
JPH03124735A (en) * 1989-10-06 1991-05-28 Hitachi Chem Co Ltd Preparation of prepreg for printed circuit board
JP2001213940A (en) * 2000-02-04 2001-08-07 Nitto Denko Corp Epoxy resin composition and semiconductor device
JP2002294030A (en) * 2001-03-29 2002-10-09 Toray Ind Inc Epoxy resin composition for sealing semiconductor and semiconductor device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649726A (en) * 1979-09-29 1981-05-06 Nitto Electric Ind Co Ltd Epoxy resin composition having excellent transparency for casting
JPS5728503B2 (en) * 1979-09-29 1982-06-17
JPS58128756A (en) * 1982-01-27 1983-08-01 Nitto Electric Ind Co Ltd Epoxy resin composition for photo semiconductor sealing
JPS598721A (en) * 1982-07-07 1984-01-18 Mitsubishi Electric Corp Liquid epoxy resin composition for sealing semiconductor
JPS6238365B2 (en) * 1982-07-07 1987-08-18 Mitsubishi Electric Corp
US4558076A (en) * 1984-07-03 1985-12-10 Coates Brothers Plc Coating compositions
JPH03124735A (en) * 1989-10-06 1991-05-28 Hitachi Chem Co Ltd Preparation of prepreg for printed circuit board
JP2001213940A (en) * 2000-02-04 2001-08-07 Nitto Denko Corp Epoxy resin composition and semiconductor device
JP2002294030A (en) * 2001-03-29 2002-10-09 Toray Ind Inc Epoxy resin composition for sealing semiconductor and semiconductor device

Also Published As

Publication number Publication date
JPS5830893B2 (en) 1983-07-02

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