JPS5718722A - Acid anhydride heat-resistant curing agent composition - Google Patents

Acid anhydride heat-resistant curing agent composition

Info

Publication number
JPS5718722A
JPS5718722A JP9327180A JP9327180A JPS5718722A JP S5718722 A JPS5718722 A JP S5718722A JP 9327180 A JP9327180 A JP 9327180A JP 9327180 A JP9327180 A JP 9327180A JP S5718722 A JPS5718722 A JP S5718722A
Authority
JP
Japan
Prior art keywords
acid anhydride
anhydride
composition
curing agent
agent composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9327180A
Other languages
Japanese (ja)
Other versions
JPS5817214B2 (en
Inventor
Hiroshi Oikawa
Yoshio Murayama
Katsuji Takahashi
Hidemitsu Tominaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP9327180A priority Critical patent/JPS5817214B2/en
Publication of JPS5718722A publication Critical patent/JPS5718722A/en
Publication of JPS5817214B2 publication Critical patent/JPS5817214B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Furan Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: The titled composition, containing a specific tetrabasic acid anhydride and a dibasic acid anhydride as essential components, capable of easily mixing with an epoxy resin, and having a low melting point and improved flexural strength in ordinary and high temperature ranges.
CONSTITUTION: (A) 5-( 2,5-Dioxotetrahydrofuryl )-3-methyl-3-cyclohexene-1,2- dicarboxylic acid anhydride is melt mixed with (B) a dibasic acid anhydride, e.g. phthalic anhydride, at an equivalent ratio betwen the acid anhydrides (A) and (B) of 90:10W25:75 to give the aimed composition. The use of a halide, e.g. chlorendic anhydride, as the component (B) imparts the flame retardancy to the composition.
COPYRIGHT: (C)1982,JPO&Japio
JP9327180A 1980-07-10 1980-07-10 Acid anhydride-based heat-resistant curing agent composition Expired JPS5817214B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9327180A JPS5817214B2 (en) 1980-07-10 1980-07-10 Acid anhydride-based heat-resistant curing agent composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9327180A JPS5817214B2 (en) 1980-07-10 1980-07-10 Acid anhydride-based heat-resistant curing agent composition

Publications (2)

Publication Number Publication Date
JPS5718722A true JPS5718722A (en) 1982-01-30
JPS5817214B2 JPS5817214B2 (en) 1983-04-05

Family

ID=14077787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9327180A Expired JPS5817214B2 (en) 1980-07-10 1980-07-10 Acid anhydride-based heat-resistant curing agent composition

Country Status (1)

Country Link
JP (1) JPS5817214B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032819A (en) * 1983-08-03 1985-02-20 Nippon Zeon Co Ltd Heat-resistant epoxy resin composition
JPS628724U (en) * 1985-06-27 1987-01-20
WO2016031228A1 (en) * 2014-08-29 2016-03-03 パナソニックＩｐマネジメント株式会社 Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6254017U (en) * 1985-09-25 1987-04-03
JPH026619U (en) * 1988-06-28 1990-01-17
JPH0218722U (en) * 1988-07-25 1990-02-07

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032819A (en) * 1983-08-03 1985-02-20 Nippon Zeon Co Ltd Heat-resistant epoxy resin composition
JPH0367092B2 (en) * 1983-08-03 1991-10-21 Nippon Zeon Co
JPS628724U (en) * 1985-06-27 1987-01-20
WO2016031228A1 (en) * 2014-08-29 2016-03-03 パナソニックＩｐマネジメント株式会社 Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board
JP2016050315A (en) * 2014-08-29 2016-04-11 パナソニックＩｐマネジメント株式会社 Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board
CN106661198A (en) * 2014-08-29 2017-05-10 松下知识产权经营株式会社 Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board
US10450405B2 (en) 2014-08-29 2019-10-22 Panasonic Intellectual Property Management Co., Ltd. Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board
TWI679241B (en) * 2014-08-29 2019-12-11 日商松下知識產權經營股份有限公司 Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board

Also Published As

Publication number Publication date
JPS5817214B2 (en) 1983-04-05

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