MY131546A - Epoxy resin and epoxy resin composition - Google Patents

Epoxy resin and epoxy resin composition

Info

Publication number
MY131546A
MY131546A MYPI9400355A MY131546A MY 131546 A MY131546 A MY 131546A MY PI9400355 A MYPI9400355 A MY PI9400355A MY 131546 A MY131546 A MY 131546A
Authority
MY
Malaysia
Prior art keywords
epoxy resin
iii
resin composition
bisphenol
resin
Prior art date
Application number
Inventor
Kiyomi Yasuda
Hideo Nakamura
Terufumi Suzuki
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2882593A external-priority patent/JPH06239962A/en
Priority claimed from JP5028826A external-priority patent/JPH06239963A/en
Priority claimed from JP173194A external-priority patent/JPH07206978A/en
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of MY131546A publication Critical patent/MY131546A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

AN EPOXY RESIN PREPARED RESIN BY GLYGICYL ETHERIFYING A BISPHENOL (I) AND A NOVOLAK RESIN (II) IN OPTIONAL PRESENCE OF A HALOGENATED BISPHENOL (III) WITH AN EPIHALOHYDRIN OR A METHYLEPIHALOHYDRIN; AND AN EPOXY RESIN COMPOSITION PREPARED BY FURTHER REACTING THE THUS PRODUCED EPOXY RESIN WITH A HALOGENATED BISPHENOL (III). THE PRODUCT OF THE PRESENT INVENTION IS CONVENIENT TO HANDLE, AND UPON CURING, EXHIBITS EXCELLENT HEAT RESISTANCE, BLISTER RESISTANCE, AND COPPER CLAD ADHESION.
MYPI9400355 1993-02-18 1994-02-17 Epoxy resin and epoxy resin composition MY131546A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2882593A JPH06239962A (en) 1993-02-18 1993-02-18 Epoxy resin composition for laminate
JP5028826A JPH06239963A (en) 1993-02-18 1993-02-18 Epoxy resin composition for laminate
JP173194A JPH07206978A (en) 1994-01-12 1994-01-12 Epoxy resin

Publications (1)

Publication Number Publication Date
MY131546A true MY131546A (en) 2007-08-30

Family

ID=27275047

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI9400355 MY131546A (en) 1993-02-18 1994-02-17 Epoxy resin and epoxy resin composition

Country Status (5)

Country Link
CN (3) CN1037972C (en)
GB (1) GB2275682B (en)
MY (1) MY131546A (en)
SG (1) SG64861A1 (en)
TW (1) TW307779B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103694450A (en) * 2013-11-15 2014-04-02 山东圣泉化工股份有限公司 Fire retardation epoxy resin and preparation method thereof
CN109575237B (en) * 2018-11-30 2021-10-22 陕西科技大学 Bisphenol S modified bisphenol A formaldehyde novolac epoxy resin and synthetic method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD238615A1 (en) * 1985-06-26 1986-08-27 Leuna Werke Veb METHOD FOR THE PRODUCTION OF FLAME-RESISTANT BINDER ON EPOXY-BASED BASE
JPS6490215A (en) * 1987-09-30 1989-04-06 Hitachi Chemical Co Ltd Bisphenol a novolak epoxy resin
JPS6490216A (en) * 1987-09-30 1989-04-06 Hitachi Chemical Co Ltd Epoxy resin composition
JPH02238018A (en) * 1989-03-13 1990-09-20 Yuka Shell Epoxy Kk Epoxy resin composition for sealing

Also Published As

Publication number Publication date
GB2275682A (en) 1994-09-07
GB9403012D0 (en) 1994-04-06
CN1176262A (en) 1998-03-18
CN1219546A (en) 1999-06-16
CN1037972C (en) 1998-04-08
GB2275682B (en) 1997-02-26
CN1095728A (en) 1994-11-30
TW307779B (en) 1997-06-11
SG64861A1 (en) 2000-06-20

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