TW202039630A - 聚醯亞胺系樹脂粉體及聚醯亞胺系樹脂粉體之製造方法 - Google Patents

聚醯亞胺系樹脂粉體及聚醯亞胺系樹脂粉體之製造方法 Download PDF

Info

Publication number
TW202039630A
TW202039630A TW109102880A TW109102880A TW202039630A TW 202039630 A TW202039630 A TW 202039630A TW 109102880 A TW109102880 A TW 109102880A TW 109102880 A TW109102880 A TW 109102880A TW 202039630 A TW202039630 A TW 202039630A
Authority
TW
Taiwan
Prior art keywords
polyimide resin
formula
polyimide
resin powder
solvent
Prior art date
Application number
TW109102880A
Other languages
English (en)
Chinese (zh)
Inventor
池内淳一
有村孝
板東晃徳
吉川岳
Original Assignee
日商住友化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商住友化學股份有限公司 filed Critical 日商住友化學股份有限公司
Publication of TW202039630A publication Critical patent/TW202039630A/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/12—Powdering or granulating
    • C08J3/14—Powdering or granulating by precipitation from solutions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW109102880A 2019-01-31 2020-01-30 聚醯亞胺系樹脂粉體及聚醯亞胺系樹脂粉體之製造方法 TW202039630A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-016080 2019-01-31
JP2019016080A JP2020122122A (ja) 2019-01-31 2019-01-31 ポリイミド系樹脂粉体及びポリイミド系樹脂粉体の製造方法

Publications (1)

Publication Number Publication Date
TW202039630A true TW202039630A (zh) 2020-11-01

Family

ID=71841430

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109102880A TW202039630A (zh) 2019-01-31 2020-01-30 聚醯亞胺系樹脂粉體及聚醯亞胺系樹脂粉體之製造方法

Country Status (5)

Country Link
JP (1) JP2020122122A (ja)
KR (1) KR20210119506A (ja)
CN (1) CN113348201A (ja)
TW (1) TW202039630A (ja)
WO (1) WO2020158785A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116218213A (zh) 2021-12-03 2023-06-06 住友化学株式会社 聚酰亚胺系树脂粉体及聚酰亚胺系树脂粉体的制造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03137124A (ja) * 1989-10-20 1991-06-11 Kanegafuchi Chem Ind Co Ltd ポリイミド樹脂粉末及びその製造方法並びに該樹脂粉末の成形方法
US8779081B2 (en) * 2011-03-15 2014-07-15 Sabic Global Technologies B.V. Process for formation of poly(arylene ethers) with lower fine particle content
JP2013007003A (ja) * 2011-06-27 2013-01-10 Kaneka Corp ポリイミド樹脂粒子の製造方法
JP6031840B2 (ja) * 2012-01-13 2016-11-24 宇部興産株式会社 ポリイミドパウダーとポリイミド前駆体とを含む凝集体とその製造方法、並びにこれを用いたポリイミド成形体
KR102341901B1 (ko) * 2014-02-27 2021-12-21 미쯔비시 케미컬 주식회사 중축합계 수지 및 그것으로 이루어지는 광학 필름
JP2016186004A (ja) * 2015-03-27 2016-10-27 三菱瓦斯化学株式会社 ポリイミド粉末の製造方法
CN108699291A (zh) * 2016-03-02 2018-10-23 株式会社Adeka 树脂添加剂组合物、热塑性树脂组合物、及其成型体
WO2017179367A1 (ja) * 2016-04-11 2017-10-19 河村産業株式会社 ポリイミド粉体およびその製造方法
JP6939225B2 (ja) 2016-08-10 2021-09-22 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材
JP6581064B2 (ja) * 2016-10-28 2019-09-25 旭化成株式会社 ポリフェニレンエーテル粉体と製造方法
WO2018135431A1 (ja) * 2017-01-20 2018-07-26 住友化学株式会社 ポリアミドイミド樹脂及び該ポリアミドイミド樹脂を含んでなる光学部材
CN110199210B (zh) * 2017-01-20 2022-05-17 住友化学株式会社 光学膜及光学膜的制造方法
CN110191909B (zh) * 2017-01-20 2021-10-22 住友化学株式会社 膜、树脂组合物及聚酰胺酰亚胺树脂的制造方法

Also Published As

Publication number Publication date
KR20210119506A (ko) 2021-10-05
JP2020122122A (ja) 2020-08-13
CN113348201A (zh) 2021-09-03
WO2020158785A1 (ja) 2020-08-06

Similar Documents

Publication Publication Date Title
TWI542610B (zh) 聚醯胺酸、聚醯亞胺、聚醯胺酸溶液、聚醯亞胺溶液、由此等溶液所得之聚醯亞胺膜及聚醯亞胺膜之利用
US7795370B2 (en) Tetracarboxylic acid compound, polyimide thereof, and production method thereof
JP5320668B2 (ja) テトラカルボン酸系化合物及びそのポリイミド、ならびにその製造方法
TW201734132A (zh) 聚醯胺酸、聚醯亞胺、聚醯胺酸溶液、聚醯亞胺積層體、可饒性裝置基板、及彼等之製造方法
TWI483967B (zh) 軟性基板用組成物及軟性基板
EP3187528A1 (en) Composition for preparing transparent polymer film, transparent polymer film, and electronic device including same
KR20150056779A (ko) 폴리이미드 및 그의 성형체
JP6287852B2 (ja) ポリイミド樹脂フィルム及びポリイミド樹脂フィルムからなる電子デバイス用基板
JP7257901B2 (ja) 光学フィルム
TW201817834A (zh) 聚醯亞胺系高分子清漆的製造方法、聚醯亞胺系高分子膜的製造方法及透明聚醯亞胺系高分子膜
JP5332204B2 (ja) ポリアミック酸、ポリイミド及びその製造方法
JP2008074769A (ja) テトラカルボン酸類及びそのポリイミド、ならびにその製造方法
TW202039630A (zh) 聚醯亞胺系樹脂粉體及聚醯亞胺系樹脂粉體之製造方法
JP6715496B2 (ja) 新規なテトラカルボン酸二無水物、及び該テトラカルボン酸二無水物から誘導されるポリイミド、及び該ポリイミドからなる成形体
JP2009292940A (ja) ポリアミック酸およびポリイミドフィルム
TW202039631A (zh) 聚醯亞胺系樹脂粉體之製造方法
TWI791761B (zh) 積層體
TWI786192B (zh) 暫時接著層形成用組成物及暫時接著層
TW202033617A (zh) 聚醯亞胺系樹脂之製造方法
TW202132423A (zh) 聚醯胺系樹脂粉體之製造方法
TW202334280A (zh) 聚醯亞胺系樹脂粉體、及聚醯亞胺系樹脂粉體的製造方法
JP4931007B2 (ja) ポリアミック酸及びイミド化重合体
TW202012508A (zh) 聚醯胺系樹脂粉體之製造方法及聚醯胺系樹脂組合物
TW201922855A (zh) 光學膜
JP2010100698A (ja) ポリアミック酸およびポリイミドフィルム