TW202035570A - 半矽氧烷衍生物組成物及其利用 - Google Patents
半矽氧烷衍生物組成物及其利用 Download PDFInfo
- Publication number
- TW202035570A TW202035570A TW108136135A TW108136135A TW202035570A TW 202035570 A TW202035570 A TW 202035570A TW 108136135 A TW108136135 A TW 108136135A TW 108136135 A TW108136135 A TW 108136135A TW 202035570 A TW202035570 A TW 202035570A
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- Prior art keywords
- semisiloxane
- derivative
- group
- composition
- oxygen storage
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F30/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F30/04—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F30/08—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/014—Stabilisers against oxidation, heat, light or ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018196951 | 2018-10-18 | ||
JP2018-196951 | 2018-10-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202035570A true TW202035570A (zh) | 2020-10-01 |
Family
ID=70284550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108136135A TW202035570A (zh) | 2018-10-18 | 2019-10-05 | 半矽氧烷衍生物組成物及其利用 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7276348B2 (ja) |
KR (1) | KR102640556B1 (ja) |
CN (1) | CN112888715B (ja) |
TW (1) | TW202035570A (ja) |
WO (1) | WO2020080081A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022072415A (ja) * | 2020-10-29 | 2022-05-17 | サカタインクス株式会社 | 活性エネルギー線硬化型組成物 |
US20240158904A1 (en) * | 2021-02-05 | 2024-05-16 | Toagosei Co., Ltd. | Undercoat agent composition for layering inorganic material layer, cured product thereof and production method thereof |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004002653A (ja) * | 2002-04-22 | 2004-01-08 | Shin Kobe Electric Mach Co Ltd | プリント基板用プリプレグ及びその製造法とプリント基板 |
US7297731B2 (en) * | 2003-03-11 | 2007-11-20 | 3M Innovative Properties Company | Coating dispersions for optical fibers |
US7811637B2 (en) | 2003-07-29 | 2010-10-12 | Toagosei Co., Ltd. | Silicon-containing polymer, process for producing the same, heat-resistant resin composition, and heat-resistant film |
WO2009054995A1 (en) * | 2007-10-22 | 2009-04-30 | Flexible Ceramics, Inc. | Fire resistant flexible ceramic resin blend and composite products formed therefrom |
US8168739B2 (en) | 2007-11-19 | 2012-05-01 | Toagosei Co., Ltd. | Polysiloxane, method for producing the same, and method for producing cured product of the same |
JP2009256662A (ja) * | 2008-03-26 | 2009-11-05 | Nagase Chemtex Corp | シルセスキオキサン誘導体及びその製造方法 |
US20120225127A1 (en) * | 2009-05-12 | 2012-09-06 | Council Of Scientific & Industrial Research | Clay nanocomposite forming microcapsule useful for guest encapsulation and process thereof |
WO2011078408A1 (en) * | 2009-12-24 | 2011-06-30 | Dow Corning Toray Co., Ltd. | Surface-treatment agent for powder for use in cosmetic and cosmetic containing powder treated with the same |
JP4911806B2 (ja) * | 2010-06-08 | 2012-04-04 | 積水化学工業株式会社 | 光半導体装置用ダイボンド材及びそれを用いた光半導体装置 |
DE102010041676A1 (de) * | 2010-09-29 | 2012-03-29 | Wacker Chemie Ag | Vernetzbare Organopolysiloxanzusammensetzung |
WO2013169506A2 (en) * | 2012-05-09 | 2013-11-14 | Dow Corning Corporation | Composition for application to the skin comprising silsesquioxane resin wax and solid particulate |
JP5893212B2 (ja) * | 2012-07-27 | 2016-03-23 | エルジー・ケム・リミテッド | 硬化性組成物 |
JP6021605B2 (ja) * | 2012-11-19 | 2016-11-09 | 新日鉄住金化学株式会社 | かご型シルセスキオキサン化合物、それを用いた硬化性樹脂組成物及び樹脂硬化物 |
CN103305036B (zh) * | 2013-06-18 | 2016-09-14 | 武汉绿凯科技有限公司 | 一种含poss减反射膜镀膜液及其制备方法与应用 |
JP6514427B2 (ja) * | 2013-06-28 | 2019-05-15 | サムスン エスディアイ カンパニー,リミテッドSamsung Sdi Co.,Ltd. | 樹脂膜、樹脂膜の製造方法、及び塗工液 |
WO2015072540A1 (ja) * | 2013-11-15 | 2015-05-21 | 株式会社コーセー | テアニンを用いた表面処理粉体及びそれを含有する化粧料 |
JP6427107B2 (ja) * | 2013-11-29 | 2018-11-21 | 東レ・ダウコーニング株式会社 | 光学材料 |
WO2016109345A1 (en) * | 2014-12-30 | 2016-07-07 | Bridgestone Corporation | Terminal-functionalized polymer and related methods |
CN107922548B (zh) * | 2015-09-02 | 2021-06-18 | 日产化学工业株式会社 | 含有具有丙烯酰基的倍半硅氧烷化合物的聚合性组合物 |
KR102453363B1 (ko) * | 2015-09-30 | 2022-10-07 | (주)아모레퍼시픽 | 묻어남이 개선된 메이크업 조성물 및 이의 제조 방법 |
CN105176296B (zh) * | 2015-10-12 | 2017-12-08 | 中国科学院宁波材料技术与工程研究所 | 基于聚倍半硅氧烷改性的耐高温涂料及其应用 |
WO2017150589A1 (ja) * | 2016-03-02 | 2017-09-08 | Jnc株式会社 | 放熱部材用組成物、放熱部材、電子機器、放熱部材の製造方法 |
CN106519701A (zh) * | 2016-10-21 | 2017-03-22 | 沈阳化工大学 | 一种带有乙苯基氢基笼型倍半硅氧烷耐热硅橡胶制备方法 |
CN106739277B (zh) * | 2016-11-16 | 2018-08-07 | 苏州大学 | 带有磁控溅射类金刚石碳膜的金属型材的制备方法 |
JP7069449B2 (ja) | 2016-12-16 | 2022-05-18 | 株式会社ダイセル | 硬化性組成物、接着シート、硬化物、積層物、及び装置 |
CN107722828B (zh) * | 2017-09-29 | 2020-06-26 | 广东冠能电力科技发展有限公司 | 电抗器专用防污湿涂料及其制造方法 |
-
2019
- 2019-09-30 WO PCT/JP2019/038571 patent/WO2020080081A1/ja active Application Filing
- 2019-09-30 JP JP2020553021A patent/JP7276348B2/ja active Active
- 2019-09-30 KR KR1020217012966A patent/KR102640556B1/ko active IP Right Grant
- 2019-09-30 CN CN201980068688.8A patent/CN112888715B/zh active Active
- 2019-10-05 TW TW108136135A patent/TW202035570A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR102640556B1 (ko) | 2024-02-27 |
JPWO2020080081A1 (ja) | 2021-09-02 |
JP7276348B2 (ja) | 2023-05-18 |
CN112888715B (zh) | 2023-11-03 |
WO2020080081A1 (ja) | 2020-04-23 |
CN112888715A (zh) | 2021-06-01 |
KR20210068108A (ko) | 2021-06-08 |
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