TW201906260A - 建立導線連接的方法及設備和具有導線連接之組件裝置 - Google Patents

建立導線連接的方法及設備和具有導線連接之組件裝置 Download PDF

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TW201906260A
TW201906260A TW107121288A TW107121288A TW201906260A TW 201906260 A TW201906260 A TW 201906260A TW 107121288 A TW107121288 A TW 107121288A TW 107121288 A TW107121288 A TW 107121288A TW 201906260 A TW201906260 A TW 201906260A
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wire
contact surface
contact
connection
flux material
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TW107121288A
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TWI770199B (zh
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安卓 科巴索
珍 霍夫曼
馬修斯 菲克
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德商封裝科技公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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  • Engineering & Computer Science (AREA)
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Abstract

本發明關於一種在第一接觸表面與至少另一接觸表面(42)之間建立導線連接的方法及設備，其中，在該方法及設備中，導線之接觸端部係藉由導線導引工具定位在相對於該第一接觸表面的接觸位置，及機械性、導電性連接隨後藉由第一焊劑材料連接(38)建立在該第一接觸表面與該接觸端部之間，及該導線導引工具隨後移動到另一接觸表面(42)，因此形成導線段，且另一機械性、導電性連接藉由另一焊劑材料連接(48)建立在該導線段端部(45)與該另一接觸表面(42)之間。再者，本發明關於一種組件裝置，具有複數個實施成晶片之電子組件。

Description

建立導線連接的方法及設備和具有導線連接之組件裝置
本發明關於如申請專利範圍第1項之建立第一接觸表面與至少另一接觸表面之間的導線連接的方法。再者，本發明關於可以配合該方法使用之設備以及利用該方法製成之組件裝置。
用於建立導線連接的設備已屬習知，特別是名為「wire bonder」者。通常這些設備實施時可兼具使得在導線導引毛細管中相對於彼此待連接之接觸表面而導引的導線的接觸端的定位以及導線與接觸表面之間的連接皆藉由導線導引工具執行，例如美國專利US 8,657,181 B2所示。
為了建立連接，將超音波施加於導線導引工具之一組件，其實施上有如壓印器且一般稱之為「楔形部」，使得配置在「楔形部」與接觸表面之間的導線係在摩擦熔接過程中經由超音波之施加而連接於接觸表面。
此熔接過程之實施是假定除了施加於「楔形部」之超音波外，導線有足夠的壓力化，可以因為超音波之施加而執行和接觸表面平行的振盪振動，使得導線利用對應之壓縮力而必定壓向接觸表面。由此施加型式，在接觸表面上及設有此接觸表面之組件上即產生對應之機械應力。
由上可知，藉由超音波接合來建立導線連接是假定接觸位置有對應之機械耐久性及可接近性。因此，超音波接合通常使用在有關製造導線且其在機械耐久性電路板上具有易接近之接觸表面，術語亦稱為印刷電路板。
本發明之目的在即使接觸位置不易接近的情況下達成建立接觸件之間的導線連接，或是要在無機械應力下建立導線與接觸件或接觸體之間的電接觸。再者，本發明之目的在使用依此方式建立的導線連接來達成組件裝置。
為了達成此目的，根據本發明之方法包含申請專利範圍第1項之特徵。
根據本發明且不同於使用作為導線接合器的習知導線導引工具，習知導線導引工具是將待接觸於表面的導線定位以及用於藉由施加超音波於導線來建立導線與接觸表面之間的機械式接觸，一種導線導引工具僅用於將導線相對於接觸件定位，但是不建立導線與接觸件之間的接觸連接。反而，導電以及機械耐久性連接是藉由潤濕一接觸區來建立，接觸區形成於第一接觸表面與接觸端之間，其使用由焊劑材料模製物形成之至少部分熔合第一焊劑材料量，以建立第一焊劑材料連接，依此方式，機械式導電連接即建立於第一接觸表面與接觸端之間。
接著，導線導引工具移向另一接觸表面，以致使接觸區形成於導線段之導線段端部與第二接觸表面之間，該導線段是藉由導線導引工具之移動而形成於第一接觸表面與第二接觸表面之間。
接著，其他接觸區係使用由焊劑材料模製物形成之至少部分熔合第二焊劑材料量潤濕，以建立另一焊劑材料連接，依此方式，機械式導電連接即建立於導線段端部與另一接觸表面之間。
接著，導線段可以分離於藉由導線導引工具導引之導線。分離可以藉由機械式或甚至加熱方式施加雷射於欲分離之位置來執行。
藉由導線導引工具將導線相對於接觸表面定位而形成接觸區、及藉由焊劑材料潤濕接觸區以建立導線與接觸表面之間的導電性與機械性接觸且無關於導線導引工具之間的本發明差異性在於產生無機械應力之接觸表面(連接於導線)。由於接觸表面與導線之間藉由潤濕建立的導線連接，特別是多芯導線或甚至壓敏性導線或導體，特別像是電絕緣光纖，其亦可連接於接觸表面。
除了可以避免對接觸件施力及特別是壓敏性接觸件可以電連接於導線等事實外，接觸件之重要平坦表面(這對於執行超音波接合很重要)亦不再是必要。因此，導線也可以是彎曲形或例如甚至是球形接觸表面。
特別是，可以執行整列或多列式接觸，其中複數個接觸表面連接於連續形成之導線導體。
特別有利的是，若第一接觸區與第二接觸區係藉由配置在相距於接觸區之初始位置的焊劑材料模製物潤濕，焊劑材料模製物在初始位置時為至少部分熔化，且至少部分熔化之焊劑材料模製物係從該初始位置拋向接觸區。因此，即使是形成於接觸表面與導線之間的那些接觸區仍可利用焊劑材料潤濕，焊劑材料使用機械式轉移裝置施加焊劑材料於接觸區而無法接近。事實上，吾人可以從相距於接觸區之初始位置執行潤濕程序。
特別有利的是，若焊劑材料模製物配置於施加毛細管之吸嘴中並且在吸嘴之施配器開口上方，以界定該初始位置時，施配器開口之直徑小於焊劑材料模製物之直徑，焊劑材料模製物係藉由施加於焊劑材料模製物之雷射能量熔化，且熔化之焊劑材料模製物藉由施加於焊劑材料模製物之氣體壓力施配。
用於施加雷射至模製物之雷射裝置較佳亦可使用作為分離裝置，或者用於在將配置於接觸表面之導線潤濕前從導線移開絕緣物，使得絕緣之導線也可以用於執行該方法。
根據本發明之設備包含申請專利範圍第5項之特徵。
根據本發明之設備包含導線導引工具，用於將導線之接觸端部定位相對於第一接觸表面，及用於在第一接觸表面與另一接觸表面之間形成導線段，以及用於將導線段端部定位相對於另一接觸表面，及焊劑材料施加裝置，用於將至少部分熔化之焊劑材料模製物施加在接觸端部與第一接觸表面之間形成的接觸區中及導線段端部與另一接觸表面之間形成的接觸區中。
較佳地，設備包含分離裝置，用於分離導線段。
較佳地，焊劑材料施加裝置係形成獨立於導線導引工具，使得施加裝置可以定位獨立於導線導引工具，亦即，焊劑材料模製物之施加可以在不同於初始位置的導線導引工具的連續接觸位置上實施，達成接觸區之個別最佳潤濕率。
若導線導引工具包含導線導引毛細管，用於將利用進料裝置輸送之導線施配至形成於導線導引毛細管之吸嘴上的施配器開口外，則從施配器開口突出的接觸端部相對於待接觸之接觸表面的正確定位即可獲確定。
較佳地，分離裝置係至少部分經過導線導引毛細管之吸嘴實施，使得吸嘴可以執行多次功能。
較佳地，分離裝置具有分離元件，係實施成可相對於導線導引毛細管之吸嘴移動，使得當分離元件作為分離裝置之第一刀刃時，導線導引毛細管之吸嘴可以形成相反刀刃。
較佳地，導線導引毛細管係經過導線導引工具之基座體剛性連接於導線固持裝置，導線固持裝置係經過包含有分離元件的中間空間而間隔於導線導引毛細管之吸嘴。因此，故可達成具有多項功能的導線導引工具特別精巧之設計。
根據本發明之組件裝置包含複數個實施成晶片之電子組件，電子組件配置成堆疊狀裝置，及接觸表面，配置於使用如申請專利範圍第1至4項中任一項建立之導線連接而被彼此連接的組件的連接側上，其方式為導線段形成於第一焊劑材料連接與第二焊劑材料連接之間，第一焊劑材料連接將第一組件之第一接觸表面連接於導線之接觸端，第二焊劑材料連接將另一組件之第二接觸表面連接於導線。
在第一有利之實際例中，組件形成金字塔狀堆疊裝置，以致使組件連接建立於彼此上下堆疊配置的兩個組件之連接側與後側之間，及形成用於連接組件之接觸表面的導線段串聯延伸過組件的相鄰側緣。
在組件裝置之另一有利實際例中，組件連接建立於彼此上下堆疊配置的兩個組件之相反後側之間，及形成用於連接組件之接觸表面的導線段拱形延伸過組件的相鄰側緣。
在後文中，根據本發明之方法之較佳變化型式以及配合此方法使用之設備之較佳實施例以及利用該方法製成之組件裝置及有利之組件裝置將作詳細說明。
圖1係以簡示圖揭示一接觸插頭11之一杯狀殼體部10，複數接觸針腳13設置於殼體部10中並且在一前側12上，亦即面朝向一設置用於和接觸插頭11組合的接觸襯套(圖中未示)，在此例中僅示一接觸針腳13以便簡化說明。
在配置於殼體部10內之其後連接部14處，接觸針腳13具有一接觸表面15，在此是以一平坦部實施。一導線連接裝置16配置於接觸表面15上方或右側，該導線連接裝置16包含一導線導引工具17以及一焊劑材料施加裝置18。
導線導引工具17包含一導線導引毛細管19以及一固持裝置21，固持裝置經過一基座體20連接於導線導引毛細管19。一分離元件23實施成一具有切削刃24之刀刃，其容置在固持裝置21與導線導引毛細管19之間所形成的一中間空間22內。
導線導引毛細管19包含一吸嘴25，吸嘴設有一反向刀刃27且鄰近於一施配器開口26，該反向刀刃27連同具有切削刃24之分離元件23以形成一分離裝置28。
為了實施導線導引工具17之多軸向移動，基座體20設有一耦合裝置29，耦合裝置可將導線導引工具17連接於一自動裝置(圖中未示)之手部軸線。
焊劑材料施加裝置18包含一施加毛細管30，施加毛細管具有一吸嘴31，設有一施配器開口32。為了施加雷射到一容置於吸嘴31內並且位於施配器開口32上方的焊劑材料模製物33，焊劑材料施加裝置18設有一雷射裝置(圖中未示)，沿著施加毛細管30之一通道軸線34發出雷射輻射。如同導線導引工具17，焊劑材料施加裝置18也可以連接於一自動裝置之手部軸線，以利實施多軸向移動。
導線導引工具17以及焊劑材料施加裝置18兩者皆設有一供給裝置(圖中未示)，在導線導引工具17的情況中，供給裝置包含一進料裝置(圖中未示)，一導線35在導線導引毛細管19中沿縱向導引，其係藉由該進料裝置朝前移向一通道軸線36並且從一導線儲存線軸(圖中亦未示)退繞。
在焊劑材料施加裝置18的情況中，供給裝置設有一儲存容器，用於容置焊劑材料模製物33，焊劑材料模製物藉由供給裝置從焊劑材料容器個別移出並且輸送到圖1中所示之初始位置P，用於施加焊劑材料模製物33。
圖1中所示之構形揭示在導線35之一接觸端部37與接觸針腳13之接觸表面15之間剛剛建立一焊劑材料連接38後的導線連接裝置16。
為了建立圖1中所示之焊劑材料連接38，被導引至導線導引毛細管19外的接觸端部37係定位於接觸表面15上，以形成一接觸區39。基於此目的，導線35導引通過固持裝置21之一容置槽40，在此情況中，該容置槽40開口朝向底部。若接觸端部37是在圖1中所示之接觸位置，容置於施加毛細管30之吸嘴31中的焊劑材料模製物33以下列方式至少部分熔化，亦即在至少部分熔化前，焊劑材料模製物33之直徑d大於施配器開口32之直徑D，焊劑材料模製物33係因施加氣壓而施配在施配器開口32外並且被拋向接觸區39。由於著陸在接觸區39上之至少部分熔化的焊劑材料模製物33，所以接觸區呈潤濕狀，如圖1所示。
建立圖1中所示之焊劑材料連接38後，導線導引工具17或導線導引工具17之基座體20移到圖2中所示之第二接觸位置；由於導線35之接觸端部37機械式固定於接觸針腳13，一導線段41形成於接觸針腳13與導線導引工具17之導線導引毛細管19之吸嘴25之間，以致使另一接觸區44形成於殼體部10中所容置之一電路板43之一接觸表面42與一導線段端部45之間，一導線35即利用導線段端部45放置在接觸區44中之接觸表面42上。
為了幫助連接區45在形成接觸區44時可放置或抵靠於接觸表面42，在此情況，基座體20係以下列方式繞著一俯仰軸線46樞轉，即現在固持裝置21在導線35前進時造成些微角度。
在圖2中所示導線導引工具17之接觸位置處，焊劑材料施加裝置18再次以上述方式動作，使得為了建立一焊劑材料連接48，另一焊劑材料模製物33被拋向接觸區44，以便潤濕接觸區44。
隨後，導線段41經過刀刃23之軸向切削運動49而分離，造成導線35被切削。
在圖3至5中揭示一導線連接裝置50之另一實施例，對比於圖1及2中所示之導線連接裝置16，其包含一導線導引工具51及一分離裝置52之配置方式，依此，與此例中之焊劑材料施加裝置18相同並因此有相同參考編號的一焊劑材料施加裝置18係配置於導線導引工具51與分離裝置52之間所形成的一中間空間62內。
尤其，圖3至5中所示之導線連接裝置之導線導引工具51、焊劑材料施加裝置18及分離裝置52必要時可以是多軸向，以及可以形成在該空間內彼此獨立地移動，以便在空間內連接彼此不同方位之接觸表面。
導線導引工具51包含一導線導引毛細管54，在此例子中為垂直定向，並且在其自由端處設有一斜向吸嘴55，吸嘴具有一施配器開口56。從圖3中可以看出，當基本上呈垂直方向配置，以致使接觸端部37配置成和接觸表面15重疊時，導線導引毛細管54可將導線35之接觸端部37定向朝向接觸表面15，並且同時切削一由焊劑材料施加裝置18之通道軸線34界定的施加軸線。在此構形中，一至少部分熔化之焊劑材料模製物33可以施加在接觸表面15上，如先前參考圖1所述者。
在第一焊劑材料連接38已經在接觸端部37與接觸表面15之間建立後，導線導引工具51移動至圖4中所示之第二接觸位置，以便形成導線段41，如先前參考圖1及2所述者，以致使另一接觸區44形成於另一接觸表面42與導線段端部45之間，導線以導線段端部45放置於接觸區44中之接觸表面42上。
為了建立另一焊劑材料連接48，另一至少部分熔化之焊劑材料模製物33施加在圖4中所示導線導引工具51之接觸位置中的接觸區44，以致使接觸區44及導線35潤濕。在另一焊劑材料連接48必為被連續導引出導線導引工具51之吸嘴55外的導線35與接觸表面之間所建立的多數焊劑材料連接之最後一者的情況中，導線段隨後藉由分離裝置52之一切削運動53分離，其方式為分離裝置59之一分離元件60上所形成的一切削刃61切削導線35，如圖5所示。
圖6揭示一具有三組件71、72、73之組件裝置70，組件彼此上下堆疊成金字塔狀裝置且在此情況中是以晶片實施。為了將組件71、72、73彼此上下堆疊，在此情況中一由底部填料建立之組件連接85係設於一具有接觸表面75、76、77的連接側83與一後側84之間。
組件裝置70包含較佳藉由使用圖3至5中所示之導線連接裝置50建立之導線連接，各設在連接側83之側緣上的接觸表面75、76、77係經過導線段78彼此連接，其在此例子中之方式為焊劑材料連接80、81、82建立於一形成導線段78的導線79與接觸表面75、76、77之間。
圖7揭示一組件裝置90，其亦較佳藉由使用導線連接裝置50製成，且其包含同樣以晶片實施之兩組件91、92，並以經過其後側93、94的方式彼此連接，在此例子中即各設有兩接觸表面97、98的組件91、92的連接側95、96各形成組件裝置90之外部。為了將彼此相配且配置於彼此背對之連接側95、96上的兩接觸表面97、98彼此連接，接觸表面97、98係經過導線段99彼此連接，其方式為一形成導線段99的導線101經過形成於具有接觸表面97的下連接側95上的第一焊劑材料連接102及經過具有接觸表面98配置於上連接側94上的第二焊劑材料連接103來建立起組件91、92之間的導線連接。
10‧‧‧殼體部
11‧‧‧接觸插頭
12‧‧‧前側
13‧‧‧接觸針腳
14‧‧‧後連接部
15‧‧‧接觸表面
16‧‧‧導線連接裝置
17‧‧‧導線導引工具
18‧‧‧焊劑材料施加裝置
19‧‧‧導線導引毛細管
20‧‧‧基座體
21‧‧‧固持裝置
22‧‧‧中間空間
23‧‧‧分離元件
24‧‧‧切削刃
25‧‧‧吸嘴
26‧‧‧施配器開口
27‧‧‧反向刀刃
28‧‧‧分離裝置
29‧‧‧耦合裝置
30‧‧‧施加毛細管
31‧‧‧吸嘴
32‧‧‧施配器開口
33‧‧‧焊劑材料模製物
34‧‧‧通道軸線
35‧‧‧導線
36‧‧‧通道軸線
37‧‧‧接觸端部
38‧‧‧焊劑材料連接
39‧‧‧接觸區
40‧‧‧容置槽
41‧‧‧導線段
42‧‧‧接觸表面
43‧‧‧電路板
44‧‧‧接觸區
45‧‧‧導線段端部
46‧‧‧俯仰軸線
48‧‧‧焊劑材料連接
49‧‧‧軸向切削運動
50‧‧‧導線連接裝置
51‧‧‧導線導引工具
52‧‧‧分離裝置
53‧‧‧切削運動
54‧‧‧導線導引毛細管
55‧‧‧吸嘴
56‧‧‧施配器開口
59‧‧‧分離裝置
60‧‧‧分離元件
61‧‧‧切削刃
62‧‧‧中間空間
70‧‧‧組件裝置
71、72、73‧‧‧組件
75、76、77‧‧‧接觸表面
78‧‧‧導線段
79‧‧‧導線
80、81、82‧‧‧焊劑材料連接
83‧‧‧連接側
84‧‧‧後側
85‧‧‧組件連接
90‧‧‧組件裝置
91、92‧‧‧組件
93、94‧‧‧後側
95、96‧‧‧連接側
97、98‧‧‧接觸表面
99‧‧‧導線段
101‧‧‧導線
102‧‧‧第一焊劑材料連接
103‧‧‧第二焊劑材料連接
d、D‧‧‧直徑
P‧‧‧初始位置
圖式中： 　　圖1揭示藉由導線連接設備之第一實施例建立導線與含有複數接觸針腳的接觸插頭的接觸針腳之間的導線連接； 　　圖2揭示建立導線與容置於接觸插頭中的接觸電路板的接觸表面之間的連接； 　　圖3至5揭示藉由導線連接設備之第二實施例建立導線連接； 　　圖6揭示配置於第一實施例中之組件裝置； 　　圖7揭示配置於另一實施例中之組件裝置。

Claims (14)

  1. 一種在第一接觸表面(15,75,97)與至少另一接觸表面(42,76,77,98)之間建立導線連接的方法，其中，導線(35,79,101)之接觸端部(37)係藉由導線導引工具(17,51)定位在相對於該第一接觸表面(15,75,97)的接觸位置，及形成於該第一接觸表面(15,75,97)與該接觸端部(37)之間的接觸區(39)隨後使用由焊劑材料模製物(33)形成之至少部分熔化的第一焊劑材料量潤濕，以於該第一接觸表面(15,75,97)與該接觸端部(37)之間形成機械性、導電性連接的方式，建立第一焊劑材料連接(38,80,102)， 　　該導線導引工具(17,51)隨後移動到該另一接觸表面(42)，其方式為接觸區(44)形成於導線段(41)之導線段端部(45)與該另一接觸表面(42,76,77,98)之間，該導線段端部係藉由該導線導引工具(17,51)之移動來形成於該第一接觸表面(15,75,97)與該另一接觸表面(42,76,77,98)之間， 　　及該第二接觸區(44)隨後使用由焊劑材料模製物(33)形成之至少部分熔化的第二焊劑材料量潤濕，以於該導線段端部(45)與該另一接觸表面(42,76,77,98)之間建立機械性、導電性連接的方式，建立至少另一焊劑材料連接(48,81,82,103)。
  2. 如申請專利範圍第1項之方法， 　　其中， 　　在建立該另一焊劑材料連接(48,81,82,103)後，該導線段(41,78,99)係從藉由該導線導引工具(17,51)導引之該導線(35,79,101)分離。
  3. 如申請專利範圍第1或2項之方法， 　　其中， 　　該第一接觸區及該第二接觸區(39,44)係藉由配置在相距於該接觸區之初始位置的焊劑材料模製物(33)潤濕，該焊劑材料模製物(33)在該初始位置時為至少部分熔化，且該至少部分熔化之焊劑材料模製物(33)係從該初始位置拋向該接觸區(39,44)。
  4. 如申請專利範圍第3項之方法， 　　其中， 　　欲界定該初始位置時，該焊劑材料模製物(33)配置於施加毛細管(30)之吸嘴(31)中並且在該吸嘴(31)之施配器開口(32)上方，該施配器開口(32)之直徑D小於該焊劑材料模製物(33)之直徑d，該焊劑材料模製物(33)係藉由施加於該焊劑材料模製物(33)之雷射能量熔化，且熔化之該焊劑材料模製物(33)藉由施加於該焊劑材料模製物(33)之氣體壓力施配。
  5. 一種建立第一接觸表面(15,75,97)與至少另一接觸表面(42,76,77,98)之間的導線連接的設備，包含導線導引工具(17,51)，用於將導線(35,79,101)之接觸端部(37)定位相對於該第一接觸表面(15,75,97)，及用於在該第一接觸表面(15,75,97)與該另一接觸表面(42,76,77,98)之間形成導線段(41,78,99)，以及用於將導線段端部(45)定位相對於該另一接觸表面(42,76,77,98)，及焊劑材料施加裝置(18)，用於將該至少部分熔化之焊劑材料模製物(33)施加在該接觸端部(37)與該第一接觸表面(15,75,97)之間形成的接觸區(39)中及該導線段端部(45)與該另一接觸表面(42,76,77,98)之間形成的接觸區(44)中。
  6. 如申請專利範圍第5項之設備， 　　其中， 　　分離裝置(28,52)，用於分離該導線段(41,78)。
  7. 如申請專利範圍第5項之設備， 　　其中， 　　該焊劑材料施加裝置(18)係形成獨立於該導線導引工具(17,51)。
  8. 如申請專利範圍第5項之設備， 　　其中， 　　該導線導引工具(17,51)包含導線導引毛細管(19,54)，用於將利用進料裝置輸送之導線(35,79)施配至形成於該導線導引毛細管(19,54)之吸嘴(25,55)上的施配器開口(26,56)外。
  9. 如申請專利範圍第5項之設備， 　　其中， 　　該分離裝置(28)係至少部分由該導線導引毛細管(19)之該吸嘴(25)形成。
  10. 如申請專利範圍第8項之設備， 　　其中， 　　該分離裝置(28,52)具有分離元件(23,60)，係實施成可相對於該導線導引毛細管(19,54)之該吸嘴(25,55)移動。
  11. 如申請專利範圍第5至10項中任一項之設備， 　　其中， 　　該導線導引毛細管(19)係經過該導線導引工具(17)之基座體(20)剛性連接於導線固持裝置(21)，該導線固持裝置(21)係經過包含有該分離元件(23)的中間空間(22)而間隔於該導線導引毛細管(19)之該吸嘴(25)。
  12. 一種組件裝置(70,90)，具有複數個實施成晶片之電子組件(71,72,73,91,92)，該電子組件配置成堆疊狀裝置，及接觸表面(75,76,77, 97,98)，配置於使用如申請專利範圍第1至4項中任一項建立之導線連接而被彼此連接的組件的連接側(83,95,96)上，其方式為導線段(78,99)形成於第一焊劑材料連接(80,102)與第二焊劑材料連接(81)之間，該第一焊劑材料連接將該第一組件(71,91)之第一接觸表面(75,97)連接於導線(79,101)之接觸端，該第二焊劑材料連接將另一組件(72,73,92)之第二接觸表面(76,98)連接於該導線。
  13. 如申請專利範圍第12項之組件裝置， 　　其中， 　　該組件(71,72,73)形成金字塔狀堆疊裝置，以致使組件連接建立於彼此上下堆疊配置的兩個該組件(71,72,73)之連接側(83)與後側(84)之間，及形成用於連接該組件之該接觸表面(75,76,77)的該導線段(78)串聯延伸過該組件的相鄰側緣。
  14. 如申請專利範圍第12項之組件裝置， 　　其中， 　　該組件連接建立於彼此上下堆疊配置的兩個該組件(91,92)之相反後側(93,94)之間，及形成用於連接該組件之該接觸表面(97,98)的該導線段(99)拱形延伸過該組件的相鄰側緣。
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